Patents by Inventor Zong-Han HU

Zong-Han HU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer support device and method for removing lift pin therefrom
    Patent number: 10998219
    Abstract: A wafer support device includes a susceptor, at least one lift pin, at least one lift pin support base and at least one pad. The susceptor has a bottom surface and a top surface configured to support a wafer. The susceptor has at least one through hole extending between the bottom surface and the top surface. The lift pin is at least partially telescopically received in the through hole of the susceptor. The lift pin support base has at least one coupling feature thereon. The pad is detachably coupled with the coupling feature and supports the lift pin.
    Type: Grant
    Filed: June 13, 2016
    Date of Patent: May 4, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Zong-Han Hu, Yu-Shan Shih, Chen-Liang Chang, Chin-Szu Lee
  • Wafer Support Device and Method for Removing Lift Pin Therefrom
    Publication number: 20170358474
    Abstract: A wafer support device includes a susceptor, at least one lift pin, at least one lift pin support base and at least one pad. The susceptor has a bottom surface and a top surface configured to support a wafer. The susceptor has at least one through hole extending between the bottom surface and the top surface. The lift pin is at least partially telescopically received in the through hole of the susceptor. The lift pin support base has at least one coupling feature thereon. The pad is detachably coupled with the coupling feature and supports the lift pin.
    Type: Application
    Filed: June 13, 2016
    Publication date: December 14, 2017
    Inventors: Zong-Han HU, Yu-Shan Shih, Chen-Liang Chang, Chin-Szu Lee