Patents by Inventor Zong-Hao Tang

Zong-Hao Tang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flexible encapsulating material, process for preparing the same and encapsulating method using the same
    Patent number: 11306220
    Abstract: A flexible encapsulating material, a method for preparing the flexible encapsulating material, and an encapsulating method using the flexible encapsulating material are provided. The flexible encapsulating material includes an epoxy resin represented by a Formula (1), a curing agent, and a curing accelerator and optionally includes a coupling agent, wherein based on 100 parts by weight of a total usage amount of the epoxy resin (A), the curing agent (B), and the curing accelerator (C), a usage amount of the epoxy resin (A) is 85 parts by weight or more, and based on 100 parts by weight of the usage amount of the epoxy resin (A), a usage amount of the coupling agent (D) is 0 to 5 parts by weight.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: April 19, 2022
    Assignee: eChem Solutions Corp.
    Inventors: Zong-Hao Tang, Hsin-Jen Chen
  • FLEXIBLE ENCAPSULATING MATERIAL, PROCESS FOR PREPARING THE SAME AND ENCAPSULATING METHOD USING THE SAME
    Publication number: 20200181445
    Abstract: A flexible encapsulating material, a method for preparing the flexible encapsulating material, and an encapsulating method using the flexible encapsulating material are provided. The flexible encapsulating material includes an epoxy resin represented by a Formula (1), a curing agent, and a curing accelerator and optionally includes a coupling agent, wherein based on 100 parts by weight of a total usage amount of the epoxy resin (A), the curing agent (B), and the curing accelerator (C), a usage amount of the epoxy resin (A) is 85 parts by weight or more, and based on 100 parts by weight of the usage amount of the epoxy resin (A), a usage amount of the coupling agent (D) is 0 to 5 parts by weight.
    Type: Application
    Filed: November 22, 2019
    Publication date: June 11, 2020
    Applicant: eChem Solutions Corp.
    Inventors: Zong-Hao Tang, Hsin-Jen Chen