Abstract: A manufacturing method of a semiconductor structure includes the following steps. A first wafer is provided. The first wafer includes a first substrate and a first device layer. A second wafer is provided. The second wafer includes a second substrate and a second device layer. The second device layer is bonded to the first device layer. An edge trimming process is performed on the first wafer and the second wafer to expose a first upper surface of the first substrate and a second upper surface of the first substrate and to form a damaged region in the first substrate below the first upper surface and the second upper surface. The second upper surface is higher than the first upper surface. A first photoresist layer is formed. The first photoresist layer is located on the second wafer and the second upper surface and exposes the first upper surface and the damaged region. The damaged region is removed by using the first photoresist layer as a mask. The first photoresist layer is removed.

Abstract: A wrist device, system, or method for compressing a wrist that includes a shell, a compression mechanism, and an actuator. The shell is shaped to conform to the wrist, has a radius side and an ulna side opposite the radius side, and a thumb support. The compression mechanism is associated with the radius and ulna sides of the shell. The actuator is associated with the shell and is configured to provide compression in a radioulnar direction to opposing sides of the wrist via the compression mechanism.

Abstract: In order to more accurately and precisely diagnose conditions affecting joint spacing, a joint space quantification system is disclosed that identifies each bone in a three-dimensional medical image, generates a three-dimensional computer model that includes a three-dimensional representation of each bone, and identifies bone distances (e.g., shortest distances, centroid distances, etc.) between each three-dimensional representation. The joint space quantification system may then identify conditions affecting joint spacing (and quantify the severity of those conditions), for example by comparing the identified bone distances to previous bone distances of the patient and/or the bone distances of patients diagnosed with conditions affecting joint spacing.