Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A wrist device, system, or method for compressing a wrist that includes a shell, a compression mechanism, and an actuator. The shell is shaped to conform to the wrist, has a radius side and an ulna side opposite the radius side, and a thumb support. The compression mechanism is associated with the radius and ulna sides of the shell. The actuator is associated with the shell and is configured to provide compression in a radioulnar direction to opposing sides of the wrist via the compression mechanism.

Abstract: The present disclosure relates to an optical filter and a method of producing the same. In the producing method, a thermal evaporation deposition process of a sacrificial layer, and depositions process of a base layer and a dielectric stack layer are sequentially performed on a substrate having a trench with a specific width, so that the base layer and the dielectric stack layer extend outward to form a solidified structure with a specific length. Next, a fixed layer is affixed to the dielectric stack layer, and the sacrificial layer is removed using a solvent to remove the substrate. As such, structural strength and flatness of the produced optical filter are enhanced, and a volume thereof is reduced, such that the optical filter can be applied to automated processes of miniaturized elements.

Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: In order to more accurately and precisely diagnose conditions affecting joint spacing, a joint space quantification system is disclosed that identifies each bone in a three-dimensional medical image, generates a three-dimensional computer model that includes a three-dimensional representation of each bone, and identifies bone distances (e.g., shortest distances, centroid distances, etc.) between each three-dimensional representation. The joint space quantification system may then identify conditions affecting joint spacing (and quantify the severity of those conditions), for example by comparing the identified bone distances to previous bone distances of the patient and/or the bone distances of patients diagnosed with conditions affecting joint spacing.