Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A motion guide apparatus includes a cylindrical member having a peripheral protrusion formed between two outer peripheral recesses, a housing engaged onto the cylindrical member and having a peripheral swelling formed between two peripheral depressions, a number of bearing members engaged between the cylindrical member and the housing, and two actuating ring members each having a number of orifices for engaging with the bearing members and each having an inner side portion directed toward the peripheral protrusion and the peripheral swelling, and each having an operating device extended into the gap that is formed between the peripheral protrusion and the peripheral swelling for wiping the lubricating oil.

Abstract: A manufacturing method of a solar cell includes the following steps, providing a substrate, which includes a first conductivity type semi-conductor layer and a second conductivity type semi-conductor layer. The conductivity type of the first conductivity type semi-conductor layer is opposite to the conductivity type of the second conductivity type semi-conductor layer. A graphene oxide layer is formed on the substrate and the graphene oxide layer contacts with the second conductivity type semi-conductor layer. A first electrode and a second electrode are formed on the substrate. The first electrode contacts with the first conductivity type semi-conductor layer, and the second electrode contacts with the second conductivity type semi-conductor layer.

Abstract: A motion guide apparatus includes a cylindrical member having a peripheral protrusion formed between two outer peripheral recesses, a housing engaged onto the cylindrical member and having a peripheral swelling formed between two peripheral depressions, a number of bearing members engaged between the cylindrical member and the housing, and two actuating ring members each having a number of orifices for engaging with the bearing members and each having an inner side portion directed toward the peripheral protrusion and the peripheral swelling, and each having an operating device extended into the gap that is formed between the peripheral protrusion and the peripheral swelling for wiping the lubricating oil.