Patents by Inventor Zongchun Yang
Zongchun Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11906879Abstract: Provided are a camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic device. The molded photosensitive assembly is assembled with at least one optical lenses to form a camera module. The molded photosensitive assembly includes an imaging assembly, a molded base, and a filter member. The molded base includes a first molded portion and a second molded portion. The first molded portion embeds a part of the imaging assembly. The second molded portion is integrally formed on a first upper surface of the first molded portion, and the second molded portion has a second upper surface and a second outer side surface. A filter member is attached to the second upper surface of the second molded portion, and corresponds to a photosensitive path of the imaging assembly.Type: GrantFiled: March 2, 2020Date of Patent: February 20, 2024Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Zhen Huang, Zhongyu Luan, Zongchun Yang, Fengsheng Xi, Chenxiang Xu
-
Patent number: 11871100Abstract: Disclosed are a camera module, a blocking-type photosensitive assembly, a manufacturing method thereof, and an electronic device. The camera module includes a blocking-type photosensitive assembly and at least one motor camera lens assembly arranged on the blocking-type photosensitive assembly. The blocking-type photosensitive assembly includes a molded photosensitive assembly and a blocking structure arranged on the molded photosensitive assembly. A blocking surface of the blocking structure is higher than an upper surface of a filter element, and at least a part of the projection of the blocking surface of the blocking structure on the molded photosensitive assembly overlaps with the projection of an optical lens of the motor camera lens assembly on the molded photosensitive assembly to block the optical lens from directly contacting the filter element.Type: GrantFiled: March 2, 2020Date of Patent: January 9, 2024Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Zhen Huang, Zhongyu Luan, Zongchun Yang, Lifeng Kan, Chenxiang Xu
-
Patent number: 11758255Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.Type: GrantFiled: May 23, 2022Date of Patent: September 12, 2023Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Zhen Huang, Qimin Mei, Bojie Zhao, Zhewen Mei, Li Liu, Jiawei Chen, Zongchun Yang, Chenxiang Xu
-
Publication number: 20220360694Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.Type: ApplicationFiled: May 23, 2022Publication date: November 10, 2022Inventors: Zhen HUANG, Qimin MEI, Bojie ZHAO, Zhewen MEI, Li LIU, Jiawei CHEN, Zongchun YANG, Chenxiang XU
-
Patent number: 11412116Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.Type: GrantFiled: March 9, 2021Date of Patent: August 9, 2022Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Zhen Huang, Qimin Mei, Bojie Zhao, Zhewen Mei, Li Liu, Jiawei Chen, Zongchun Yang, Chenxiang Xu
-
Patent number: 11412117Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.Type: GrantFiled: March 9, 2021Date of Patent: August 9, 2022Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Zhen Huang, Qimin Mei, Bojie Zhao, Zhewen Mei, Li Liu, Jiawei Chen, Zongchun Yang, Chenxiang Xu
-
Publication number: 20220201169Abstract: Disclosed are a camera module, a blocking-type photosensitive assembly, a manufacturing method thereof, and an electronic device. The camera module includes a blocking-type photosensitive assembly and at least one motor camera lens assembly arranged on the blocking-type photosensitive assembly. The blocking-type photosensitive assembly includes a molded photosensitive assembly and a blocking structure arranged on the molded photosensitive assembly. A blocking surface of the blocking structure is higher than an upper surface of a filter element, and at least a part of the projection of the blocking surface of the blocking structure on the molded photosensitive assembly overlaps with the projection of an optical lens of the motor camera lens assembly on the molded photosensitive assembly to block the optical lens from directly contacting the filter element.Type: ApplicationFiled: March 2, 2020Publication date: June 23, 2022Applicant: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Zhen HUANG, Zhongyu LUAN, Zongchun YANG, Lifeng KAN, Chenxiang XU
-
Publication number: 20220179288Abstract: Provided are a camera module, a molded photosensitive assembly and a manufacturing method thereof, and an electronic device. The molded photosensitive assembly is assembled with at least one optical lenses to form a camera module. The molded photosensitive assembly includes an imaging assembly, a molded base, and a filter member. The molded base includes a first molded portion and a second molded portion. The first molded portion embeds a part of the imaging assembly. The second molded portion is integrally formed on a first upper surface of the first molded portion, and the second molded portion has a second upper surface and a second outer side surface. A filter member is attached to the second upper surface of the second molded portion, and corresponds to a photosensitive path of the imaging assembly.Type: ApplicationFiled: March 2, 2020Publication date: June 9, 2022Applicant: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Zhen HUANG, Zhongyu LUAN, Zongchun YANG, Fengsheng XI, Chenxiang XU
-
Publication number: 20210250477Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.Type: ApplicationFiled: March 9, 2021Publication date: August 12, 2021Inventors: Zhen HUANG, Qimin MEI, Bojie ZHAO, Zhewen MEI, Li LIU, Jiawei CHEN, Zongchun YANG, Chenxiang XU
-
Publication number: 20210195074Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.Type: ApplicationFiled: March 9, 2021Publication date: June 24, 2021Inventors: Zhen HUANG, Qimin MEI, Bojie ZHAO, Zhewen MEI, Li LIU, Jiawei CHEN, Zongchun YANG, Chenxiang XU
-
Patent number: 10986257Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.Type: GrantFiled: August 21, 2019Date of Patent: April 20, 2021Assignee: NINGBO SUNNY OPOTECH CO., LTD.Inventors: Zhen Huang, Qimin Mei, Bojie Zhao, Zhewen Mei, Li Liu, Jiawei Chen, Zongchun Yang, Chenxiang Xu
-
Publication number: 20200084349Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.Type: ApplicationFiled: August 21, 2019Publication date: March 12, 2020Inventors: Zhen Huang, Qimin Mei, Bojie Zhao, Zhewen Mei, Li Liu, Jiawei Chen, Zongchun Yang, Chenxiang Xu