Abstract: A device includes a first virtual power line coupled to a power supply through a first group of transistor switches, and a second virtual power line configured to receive the power supply through a second group of transistor switches. The device also includes a delay circuit coupled between the gate terminals of the first group of transistor switches and the gate terminals in the second group of transistor switches. The device further includes a wakeup detector and a plurality of main input-output (MIO) controllers. The wakeup detector is configured to generate a trigger signal after receiving a signal from the output of the delay circuit. The plurality of MIO controllers is coupled to the power supply through a group of wakeup switches and through a group of function switches. The gate terminals in the group of wakeup switches are configured to receive the trigger signal.

Abstract: A device includes a first virtual power line, a second virtual power line, a first delay circuit, and a first wakeup detector. The first virtual power line and the second virtual power line are coupled to a power supply correspondingly through a first group of transistor switches and a second group of transistor switches. The first delay circuit is coupled between gate terminals of the first group of transistor switches and gate terminals in the second group of transistor switches. The first wakeup detector is configured to generate a first trigger signal after receiving a signal from the first delay circuit.

Abstract: A device includes a first virtual power line, a second virtual power line, a first delay circuit, and a first wakeup detector. The first virtual power line and the second virtual power line are coupled to a power supply correspondingly through a first group of transistor switches and a second group of transistor switches. The first delay circuit is coupled between gate terminals of the first group of transistor switches and gate terminals in the second group of transistor switches. The first wakeup detector is configured to generate a first trigger signal after receiving a signal from the first delay circuit.

Abstract: One or more systems and techniques for modeling are provided. An original device model, such as a SPICE model, is used as a basis for fabricating a semiconductor arrangement, such as an integrated circuit arrangement, upon a semiconductor wafer. Fabrication process variations cause measured e-parameters and measured size e-parameters of the semiconductor arrangement to vary from original design parameters of the original device model. Accordingly, a partial set of e-parameters and a partial set of size e-parameters are measured from the semiconductor arrangement, and are expanded into a full set of e-parameters and a full set of size e-parameters using e-parameter derivation and size-centric derivation. The original device model is retargeted using the full set of e-parameters and the full set of size e-parameters to create a new device model that more accurately represents the real-world or fabricated semiconductor arrangement.