Abstract: An electronic assembly includes a first electronic component, a second electronic component, and an electrical connector connecting the first electronic component and the second electronic component. The electrical connector includes a first multilayer circuit board and a terminal that includes a plurality of signal terminals and a plurality of ground terminals. Each signal terminal is electrically connected to a signal interface of the first electronic component and a signal interface of the second electronic component. Signal terminals configured to transmit a same signal form one group of signal terminals, and at least one ground terminal is disposed between two adjacent groups of signal terminals. The first multilayer circuit board includes at least one layer of first ground copper sheet. The first electronic component includes a second multilayer circuit board, and the second multilayer circuit board includes at least one layer of second ground copper sheet.

Abstract: The present disclosure provides a connector that includes a substrate and M conductive terminals, where the substrate is provided with M through holes, and the M conductive terminals are disposed to penetrate through the M through holes in a one-to-one correspondence. The conductive terminal includes a first conductive part, a second conductive part, and a holding part. The first conductive part is located at one end of the conductive terminal, the second conductive part is located at the other end of the conductive terminal, and the holding part is located between the first conductive part and the second conductive part. The conductive terminal may be fastened to the substrate by using the fastening medium, so that disposing of a stub structure may be avoided, to improve signal transmission performance of the conductive terminal.

Abstract: This application provides a printed circuit board. The printed circuit board includes a first outer conducting layer, a second outer conducting layer, and at least one insulation medium layer sandwiched between the first outer conducting layer and the second outer conducting layer. The printed circuit board includes a gold finger area and a soldering area. A total thickness of all conducting layers in the gold finger area is greater than that of all conducting layers in the soldering area. Because the total thickness of all conducting layers in the gold finger area is relatively thick, resistance of the gold finger area can be reduced, and a through-current capability of the gold finger area is improved. In addition, the total thickness of all conducting layers in the soldering area is relatively thin, so that a sufficient soldering temperature and a good soldering effect can be ensured.