Abstract: A method of manufacturing a multilayer ZnO polycrystalline diode that protects against electrostatic discharges, over-current, and voltage surges overcoming the aforementioned drawbacks is provided. The present invention further includes preparing a plurality of oxide additives and homogenizing the oxide additives with ZnO. A plurality of polycrystalline layers is then formed having a thickness of approximately 20 to 60 microns. The method further includes forming a plurality of polycrystalline layers, each having a thickness of approximately 20 to 60 microns, printing an inner electrode on each polycrystalline layer, forming a compact block with the polycrystalline layers, cutting the compact block into a plurality of chips, scorching and sintering the plurality of chips, forming a plurality of outer electrodes, scorching the outer electrodes, and placing at least two of the outer electrodes on each chip.

Abstract: A method of making a multifunctional protective component is disclosed. The method includes plastering a suspension comprising a mixture of glass dust, binder, and solvent onto a multilayer ZnO polycrystalline diode chip, multilayer self-limiting condenser chip, or a multilayer ceramic condensor chip. A sandwich structure is then formed by placing the non-plastered chips onto the plastered chip followed by scorching of the sandwich structure. A pair of uninterrupted outer electrodes are then formed from a paste of Ag or AgPd. The paste is then scorched on the pair of uninterrupted outer electrodes.

Abstract: Subject of the present invention is multifunctional protective component. This new component provides simultaneous protection against voltage strokes and against both high and low frequency disturbances. It is composed of two discrete chip components, namely of multilayer ZnO polycrystalline diode and multilayer ceramic condenser or multilayer self-limiting condenser and multilayer ceramic condenser, which are mutually mechanically connected with non-conductive low-temperature glass (frite), parallel electrical connection between both chips being created with second metallization, and common outer electrodes of newly formed chip. This new component is suitable for surface mounting as well as in terminal leads form.

Abstract: A multilayer ZnO polycrystalline diode that protects against electrostatic discharges, over-current, and voltage surges is provided. The polycrystalline diode includes a block having a plurality of polycrystalline layers in parallel having a first lateral side and a second lateral side. A polycrystalline system is formed by a network of the ZnO diodes. Each diode further includes a plurality of inner electrodes, wherein each inner electrode includes metal and is placed among the plurality of parallel polycrystalline layers, and wherein one end of each inner electrode is placed to alternately terminate at one of the first lateral side and the second lateral side of the block, and wherein the remainder of each inner electrode is surrounded by the parallel polycrystalline layers. A pair of outer electrodes, each including metal and covering each of the first lateral side and the second lateral side of the block are also provided.