Abstract: Provided is a display substrate. The display substrate includes: a substrate; a first metal layer and a second metal layer on a side of the substrate, and a first insulating layer between the first and second metal layers; wherein the first metal layer includes a plurality of first drive signal lines, and the second metal layer includes a plurality of second drive signal lines; and a plurality of light-emitting units electrically connected to the plurality of first drive signal lines and the plurality of second drive signal lines; wherein at least a portion of each of the first drive signal lines and at least a portion of each of the second drive signal lines are grid-shaped signal lines.

Abstract: A wiring substrate includes: a base substrate; and a plurality of control areas on one side of the base substrate, each of the plurality of control areas extending in a first direction, the plurality of control areas being sequentially arranged in a second direction, and any one of the plurality of control areas including: a plurality of drive circuit pad groups sequentially arranged in the first direction; a plurality of functional element pad groups, each of which being electrically connected with the corresponding drive circuit pad group; a plurality of signal lines, main bodies of which extend in the first direction; and first connection lines, each of which is configured to cascade two drive circuit pad groups adjacent in the first direction, orthographic projections of the first connection lines on the base substrate not overlapping with orthographic projections of the signal lines on the base substrate.

Abstract: A wiring substrate includes a substrate and connection wires. At least one connection wire including a first connection end and another at least one connection wire including a second connection end, together define at least one bonding pad group. A bonding pad group is located in a region where a pair of first and second connection ends proximate to each other are located, and includes: at least one first sub-bonding pad, which is a portion of the first connection end, and at least two second sub-bonding pads, which are a portion of the second connection end. In the at least one first sub-bonding pad and the at least two second sub-bonding pads, a first sub-bonding pad is arranged adjacent to a second sub-bonding pad along a first direction, and arranged adjacent to another second sub-bonding pad along a second direction intersecting the first direction.

Abstract: The present disclosure provides a light-emitting substrate, a backlight and a display device. The light-emitting substrate includes a light-emitting region and a peripheral region surrounding the light-emitting region. The peripheral region includes a first area, the first area is located between a first side of the light-emitting substrate and the light-emitting region, the light-emitting substrate further includes a first signal line, the first signal line includes at least one selected from a group consisting of a first portion and a second portion, the first portion of the first signal line extends along a first direction in the first area, the second portion of the first signal line extends into the light-emitting region, the first portion and the second portion of the first signal line are connected when the first signal line includes the first portion and the second portion.

Abstract: A display substrate and a display apparatus are provided. The display substrate includes a base substrate, a first conductive layer, a second conductive layer and an insulation layer. The first conductive layer is on a side of the base substrate and includes a first conductive part extending in a first direction, the second conductive layer is on a side of the first conductive layer facing away from the base substrate, and the insulation layer is located between the first conductive layer and the second conductive layer. At least one first conductive part includes a first hollowed-out portion including a plurality of groove structures distributed in a second direction and extending in the first direction. The first direction and the second direction produce angles.

Abstract: A light-emitting substrate includes a base, a first conductive pattern layer disposed on the base and a second conductive pattern layer disposed on a side of the first conductive pattern layer away from the base. The first conductive pattern layer includes first signal lines. The second conductive pattern layer includes lamp bead pads. The lamp bead pads include first lamp bead pads and at least one second lamp bead pad. A vertical projection of each first lamp bead pad on the base at least partially overlaps with a vertical projection of a first signal line on the base. A vertical projection of each second lamp bead pad on the base is outside vertical projections of the first signal lines on the base. A distance between a first lamp bead pad and the base is substantially the same as a distance between a second lamp bead pad and the base.

Abstract: A backplane, a backlight source, an illumination device and a displaying device. The backplane comprises a substrate; a first metal trace layer disposed on one surface of the substrate; an insulating layer disposed on a side, away from the substrate, of the first metal trace layer; a second metal trace layer disposed on a side, away from the substrate, of the insulating layer, an overlapping area existing between an orthographic projection of the second metal trace layer on the substrate and an orthographic projection of the first metal trace layer on the substrate; and a barrier layer disposed between the first metal trace layer and the second metal trace layer, an orthographic projection of the barrier layer on the substrate covering the overlapping area, and the barrier layer being used for preventing metals in the first metal trace layer and the second metal trace layer from growing towards each other.

Abstract: The present disclosure provides a wiring substrate and an electronic apparatus. The wiring substrate includes a substrate and a shielding signal line disposed on the substrate. The substrate includes a functional region; the functional region is provided with a plurality of pad groups; the plurality of pad groups are distributed in an array along a first direction and a second direction respectively, and the second direction intersects with the first direction. The shielding signal line includes a first portion surrounding all pad groups and second portions connected with the first portion, and the second portions are located between two adjacent pad groups along the second direction. The electronic apparatus includes the wiring substrate and an electronic element connected with the pad groups.

Abstract: Provided is a display substrate. The display substrate includes a base substrate, a plurality of conductive pads, a first organic insulating layer, and a first inorganic insulating layer. The first organic insulating layer is disposed on the base substrate provided with the conductive pads and provided with a first opening corresponding to at least one conductive pad, and the first inorganic insulating layer is disposed on a side of the first organic insulating layer facing away from the base substrate and provided with a plurality of second openings corresponding to the plurality of conductive pads. An orthographic projection of at least one conductive pad on the base substrate is within an orthographic projection of the corresponding first opening on the base substrate, and an orthographic projection of the second opening on the base substrate is within the orthographic projection of the corresponding conductive pad on the base substrate.

Abstract: An array substrate includes connecting leads, a signal channel region extending in a first direction, a first power voltage lead, and a second power voltage lead. Any one of the signal channel region includes at least two control region columns extending in the first direction, and any one of the control region columns includes a plurality of control regions arranged along the first direction. Any one of the control regions includes a pad connecting circuit and a first pad group for bonding a microchip, the first pad group is electrically connected to the first power voltage lead. The pad connection circuit includes a plurality of second pad groups, and is provided with a first end electrically connected to the first pad group, and a second end electrically connected to the second power voltage lead.

Abstract: The present disclosure relates to the field of display technology, and provides a wiring substrate, an array substrate, and a light emitting module. The wiring substrate includes a base substrate, a first metal wiring layer, and an insulating material layer stacked in sequence. The first metal wiring layer is provided with a plurality of drive leads extending along a first direction, and the insulating material layer is provided with a plurality of via holes exposing the drive leads. Through adjusting positions of the drive leads and positions of the via holes, the wiring substrate can be applied to different microchips, and used further to prepare different array substrates.

Abstract: A wiring substrate includes a substrate, at least one conductive layer(s) located on a side of the substrate, and a protective layer located on a side of the at least one conductive layer. A conductive layer includes a plurality of pad groups, and a pad group includes a plurality of conductive pads. The protective layer includes a plurality of openings; a portion of the conductive layer exposed by an opening is a conductive pad. A maximum dimension of the conductive pad in a direction parallel to the substrate is greater than or equal to 1.5 times a minimum distance between an edge of the conductive pad and an edge of the conductive layer, and less than or equal to 30 times the minimum distance between the edge of the conductive pad and the edge of the conductive layer.

Abstract: Provided is a wiring substrate, including: a base substrate; a plurality of constant voltage signal lines and a plurality of first connection lines; a plurality of first pad regions. Each of the first pad regions includes a plurality of sub-regions. Each of the sub-regions includes a plurality of pad groups. The plurality of pad groups include at least a first pad group and a last pad group. An orthographic projection of one of the first pad group and the last pad group on the base substrate is partially overlapped with an orthographic projection of one of the constant voltage signal lines on the base substrate. An orthographic projection of the other of the first pad group and the last pad group on the base substrate is partially overlapped with an orthographic projection of one of the first connection lines on the base substrate.

Abstract: An array substrate includes a base substrate, a conductive layer on a side of the base substrate, a light adjustment layer on a side of the conductive layer away from the base substrate, a plurality of signal lines on a side of the base substrate away from the conductive layer, and a protective layer between the light adjustment layer and the base substrate. The conductive layer includes a plurality of pads electrically connected with electronic elements. An orthographic projection of at least part of the light adjustment layer on the base substrate does not overlap an orthographic projection of the conductive layer on the base substrate, and is located in gaps between orthographic projections of adjacent signal lines on the base substrate. An orthographic projection of the protective layer on the base substrate at least covers the orthographic projection of the at least part on the base substrate.

Abstract: A touch panel includes a substrate, a touch driving electrode disposed on the substrate, and a touch sensing electrode disposed on the substrate, at least one of the touch driving electrode and the touch sensing electrode has a metal mesh-like structure including nodes, each node includes a first protruding structure and a second protruding structure distributed on both sides of a mesh bar, and the first protruding structure and the second protruding structure are arranged in a staggered manner along an extension direction of the mesh bar. The mesh-like structure includes a first mesh bar and a second mesh bar directly connected to both ends of the node respectively, and a center line of the first mesh bar does not coincide with a center line of the second mesh bar.

Abstract: The present disclosure provides a wiring substrate, a manufacturing method thereof, a light-emitting substrate, a display device. The wiring substrate includes a base substrate including a functional region and a bonding region, a first conductive layer at least in the functional region; a second conductive layer that is on the first conductive layer and at least in the functional region and connected to the first conductive layer; a first insulating layer on the second conductive layer and including a main part and an opening. At least one of the first and second conductive layers includes multiple electrodes in the bonding region and extending along a first direction, each electrode includes a first end adjacent to the functional region in the first direction, an orthographic projection of the main part on the base substrate at least partially overlaps with an orthographic projection of the first end on the base substrate.

Abstract: Provided are a wiring substrate and an electronic device. The wiring substrate includes a substrate; a first pad group on the substrate, the first pad group including a power supply pad and an output pad; a power signal line on the same side of the substrate as the first pad groups, the power signal line coupled with the power supply pads; a second pad group, arranged on the same side of the substrate as the first pad group, the second pad group including a plurality of sub-pad groups connected with each other, each sub-pad group at least including a first sub-pad and a second sub-pad, a first sub-pad in at least one of the plurality of sub-pad groups is coupled with the power signal line, and a second sub-pad in at least one of the plurality of sub-pad groups is coupled with the output pad of one first pad group.

Abstract: Provided are a wiring substrate and an electronic device, the wiring substrate includes a substrate; first pad group, arranged on the substrate, each of the first pad group including an output pad; a constant voltage signal line, arranged on a same side of the substrate as the first pad group; and second pad groups, including a plurality of sub-pad groups connected in parallel, each of the sub-pad groups including a plurality of pad regions connected in series.

Abstract: The present disclosure relates to the field of display technology, and provides a wiring substrate, an array substrate, and a light emitting module. The wiring substrate includes a base substrate, a first metal wiring layer, and an insulating material layer stacked in sequence. The first metal wiring layer is provided with a plurality of drive leads extending along a first direction, and the insulating material layer is provided with a plurality of via holes exposing the drive leads. Through adjusting positions of the drive leads and positions of the via holes, the wiring substrate can be applied to different microchips, and used further to prepare different array substrates.

Abstract: A light-emitting substrate having a functional area and a bonding area spaced apart in a first direction; the light-emitting substrate includes: a substrate, a plurality of driver chips located on the substrate and located in the functional area, and a plurality of conductive patterns located between the substrate and the plurality of driver chips. The plurality of driver chips include a plurality of first driver chips and a plurality of second driver chips; among the plurality of first driver chips, at least one first driver chip is located on at least one side of the plurality of second driver chips in the first direction. The first driver chip includes at least one dummy pin. A conductive pattern is electrically connected to a dummy pin.