Abstract: This disclosure relates to a primary alcohol composition of linear and branched C11, C13, C15, C17, C19 or C21 primary alcohols, wherein at least 50% of the branched alcohol chains are mono-branched chains with a branch at the second carbon atom relative to the hydroxyl carbon. Branching is selective and has been found to be preferably at least 80% in the 2-carbon position (the beta carbon) of the alcohol. This disclosure also relates to a process using an isomerized linear alpha olefin (LAO) as a feed for hydroformylation to produce the lightly branched C11, C13, C15, C17, C19 or C21 primary alcohols.

Abstract: Catalyst preforming rates during hydroformylation may decrease in the presence of carbonates. Carbonate mitigation methods may comprise treating a hydroformylation reaction product with an aqueous carboxylic acid under oxidizing conditions to form a deactivated catalyst aqueous solution having a pH of about 4 or less, reducing the hydroformylation reaction product to form a reduced reaction product, conveying a gas stream through the reduced reaction product to strip carbon dioxide therefrom, contacting caustic aqueous solution with the stripped reduced reaction product to form partially spent caustic aqueous solution, combining at least a portion of the partially spent caustic aqueous solution with the deactivated catalyst aqueous solution to form a combined aqueous mixture sufficiently acidic to decompose carbonate, and extracting a Group 9 transition metal carboxylate from the combined aqueous mixture into an organic phase.

Abstract: A method for isomerizing alpha olefins to produce an isomerization mixture comprising branched olefins can comprise contacting an olefinic feed including one or more C10-C20 alpha olefins with a catalyst under skeletal isomerization conditions, wherein the catalyst comprises a molecular sieve having an MRE topology; and obtaining an isomerization mixture comprising one or more C10-C20 branched olefins.

Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.

Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.

Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.

Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.

Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.

Abstract: Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.