Patents by Inventor Zsolt Horvath
Zsolt Horvath has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20060279904Abstract: A capacitor structure may be incorporated into an interposer or substrate associated with an IC chip to stabilize the input/output signals, such as power and ground, between the IC chip and a printed circuit board. In accordance with one embodiment, the capacitor structure may include a plurality of individual capacitors connected together to form a monolithic capacitor blade having a length, width, and height, wherein each of the length and height of the blade spans multiple of the individual capacitors. The blade includes multiple electrical conductive paths extending the height of the capacitor blade. According to another embodiment, the capacitor structure includes multiple interleaved power and ground layers separated by insulating layers. The power layers connect to power leads and the ground layers connect to ground leads.Type: ApplicationFiled: August 21, 2006Publication date: December 14, 2006Inventors: Stanford Crane, Zsolt Horvath, Josh Nickle, Myoung-soo Jeon, Charley Ogata, Vincent Alcaria, Patrick Codd
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Patent number: 7123465Abstract: A capacitor structure may be incorporated into an interposer or substrate associated with an IC chip to stabilize the input/output signals, such as power and ground, between the IC chip and a printed circuit board. In accordance with one embodiment, the capacitor structure may include a plurality of individual capacitors connected together to form a monolithic capacitor blade having a length, width, and height, wherein each of the length and height of the blade spans multiple of the individual capacitors. The blade includes multiple electrical conductive paths extending the height of the capacitor blade. According to another embodiment, the capacitor structure includes multiple interleaved power and ground layers separated by insulating layers. The power layers connect to power leads and the ground layers connect to ground leads.Type: GrantFiled: September 24, 2004Date of Patent: October 17, 2006Assignee: Silicon Bandwidth, Inc.Inventors: Stanford W. Crane, Jr., Zsolt Horvath, Josh Nickel, Myoung-soo Jeon, Charley Ogata, Vincent Alcaria, Patrick Codd
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Patent number: 7070340Abstract: Optoelectronic packaging assemblies for optically and electrically interfacing a protected electro-optical device or system to both an optical fiber and to external circuitry. Such assemblies are comprised of body components that are comprised of plastic that coated or plated with a conductive material. Electrical contact pins in the form of transmission lines are used to couple external electrical signals with the package. The optoelectronic packaging assemblies are dimensioned with small cavities and with steps, breaks, walls, and/or fins molded into the body components. The optoelectronic packaging assemblies further include an optical input receptacle for receiving an optical ferrule and an optical fiber. The optoelectronic packaging assembly provides for cooling, such as by heat sink fins and/or a thermal-electric-cooler. The transmission line pins and body components are dimensioned to mate with a standardized circuit board having transmission line traces.Type: GrantFiled: February 14, 2002Date of Patent: July 4, 2006Assignee: Silicon Bandwidth Inc.Inventors: Stanford W. Crane, Jr., Myoung-Soo Jeon, Joshua G. Nickel, Zsolt Horvath
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Publication number: 20060067031Abstract: A capacitor structure may be incorporated into an interposer or substrate associated with an IC chip to stabilize the input/output signals, such as power and ground, between the IC chip and a printed circuit board. In accordance with one embodiment, the capacitor structure may include a plurality of individual capacitors connected together to form a monolithic capacitor blade having a length, width, and height, wherein each of the length and height of the blade spans multiple of the individual capacitors. The blade includes multiple electrical conductive paths extending the height of the capacitor blade. According to another embodiment, the capacitor structure includes multiple interleaved power and ground layers separated by insulating layers. The power layers connect to power leads and the ground layers connect to ground leads.Type: ApplicationFiled: September 24, 2004Publication date: March 30, 2006Inventors: Stanford Crane, Zsolt Horvath, Josh Nickel, Myoung-soo Jeon, Charley Ogata, Vincent Alcaria, Patrick Codd
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Publication number: 20040252953Abstract: Optoelectronic packaging assemblies for optically and electrically interfacing an electro-optical device to an optical fiber and to external circuitry. An optoelectronic packaging assembly includes a submount for holding an optical bench with an electro-optical device. Electrically conductive pins provide electrical contact to the electro-optical device. The optoelectronic packaging assembly includes an optical input receptacle for receiving an optical ferrule and an optical fiber. The optical input receptacle assists optical coupling of the electro-optical device to the optical fiber. The optoelectronic packaging assembly provides for cooling using a heat-sink or a thermal-electric-cooler. Beneficially, the optoelectronic packaging assembly is sealed using a cover.Type: ApplicationFiled: December 15, 2003Publication date: December 16, 2004Inventors: Stanford W. Crane, Zsolt Horvath
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Patent number: 6700138Abstract: A modular semiconductor die package is provided. The semiconductor die package includes a polymer base for mounting at least one semiconductor die. A polymer cap is operatively secured over the base forming a cavity. The cap includes a light transmissive member operatively positioned to allow light of predetermined wavelengths to pass between at least a portion of the surface of the die and the light transmissive member. A plurality of conductive leads extend through the base to form connections with the semiconductor die(s) positioned in the cavity.Type: GrantFiled: February 25, 2002Date of Patent: March 2, 2004Assignee: Silicon Bandwidth, Inc.Inventors: Stanford W. Crane, Jr., Jennifer Colegrove, Zsolt Horvath, Myoung-soo Jeon, Joshua Nickel, Lei-Ming Yang
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Publication number: 20040026757Abstract: A modular semiconductor die package is provided. The semiconductor die package includes a polymer base for mounting at least one semiconductor die. A polymer cap is operatively secured over the base forming a cavity. The cap includes a light transmissive member operatively positioned to allow light of predetermined wavelengths to pass between at least a portion of the surface of the die and the light transmissive member. A plurality of conductive leads extend through the base to form connections with the semiconductor die(s) positioned in the cavity.Type: ApplicationFiled: August 8, 2003Publication date: February 12, 2004Applicant: Silicon Bandwidth, Inc.Inventors: Stanford W. Crane, Jennifer Colegrove, Zsolt Horvath, Myoung-Soo Jeon, Joshua Nickel, Lei-Ming Yang
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Patent number: 6663294Abstract: Optoelectronic packaging assemblies for optically and electrically interfacing an electro-optical device to an optical fiber and to external circuitry. An optoelectronic packaging assembly includes a submount for holding an optical bench with an electro-optical device. Electrically conductive pins provide electrical contact to the electro-optical device. The optoelectronic packaging assembly includes an optical input receptacle for receiving an optical ferrule and an optical fiber. The optical input receptacle assists optical coupling of the electro-optical device to the optical fiber. The optoelectronic packaging assembly provides for cooling using a heat-sink or a thermal-electric-cooler. Beneficially, the optoelectronic packaging assembly is sealed using a cover.Type: GrantFiled: August 29, 2001Date of Patent: December 16, 2003Assignee: Silicon Bandwidth, Inc.Inventors: Stanford W. Crane, Jr., Zsolt Horvath
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Publication number: 20030160314Abstract: A modular semiconductor die package is provided. The semiconductor die package includes a polymer base for mounting at least one semiconductor die. A polymer cap is operatively secured over the base forming a cavity. The cap includes a light transmissive member operatively positioned to allow light of predetermined wavelengths to pass between at least a portion of the surface of the die and the light transmissive member. A plurality of conductive leads extend through the base to form connections with the semiconductor die(s) positioned in the cavity.Type: ApplicationFiled: February 25, 2002Publication date: August 28, 2003Inventors: Stanford W. Crane, Jennifer Colegrove, Zsolt Horvath, Myoung-soo Jeon, Joshua Nickel, Lei-Ming Yang
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Publication number: 20030044130Abstract: Optoelectronic packaging assemblies for optically and electrically interfacing a protected electro-optical device or system to both an optical fiber and to external circuitry. Such assemblies are comprised of body components that are comprised of plastic that coated or plated with a conductive material. Electrical contact pins in the form of transmission lines are used to couple external electrical signals with the package. The optoelectronic packaging assemblies are dimensioned with small cavities and with steps, breaks, walls, and/or fins molded into the body components. The optoelectronic packaging assemblies further include an optical input receptacle for receiving an optical ferrule and an optical fiber. The optoelectronic packaging assembly provides for cooling, such as by heat sink fins and/or a thermal-electric-cooler. The transmission line pins and body components are dimensioned to mate with a standardized circuit board having transmission line traces.Type: ApplicationFiled: February 14, 2002Publication date: March 6, 2003Inventors: Stanford W. Crane, Myoung-Soo Jeon, Joshua G. Nickel, Zsolt Horvath
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Publication number: 20030044128Abstract: Optoelectronic packaging assemblies for optically and electrically interfacing an electro-optical device to an optical fiber and to external circuitry. An optoelectronic packaging assembly includes a submount for holding an optical bench with an electro-optical device. Electrically conductive pins provide electrical contact to the electro-optical device. The optoelectronic packaging assembly includes an optical input receptacle for receiving an optical ferrule and an optical fiber. The optical input receptacle assists optical coupling of the electro-optical device to the optical fiber. The optoelectronic packaging assembly provides for cooling using a heat-sink or a thermal-electric-cooler. Beneficially, the optoelectronic packaging assembly is sealed using a cover.Type: ApplicationFiled: August 29, 2001Publication date: March 6, 2003Inventors: Stanford W. Crane, Zsolt Horvath