Abstract: A bulb-type LED lamp having a replaceable light source module includes a lamp head module, a lamp casing module and a light source module. The lamp head module has an electrical-conductive connection portion. One end of the lamp casing module is connected to the lamp head module. The light source module comprises a substrate, a plurality of LEDs electrically connected to the substrate, and a sleeve disposed in the lamp casing module to be electrically connected to the substrate. The sleeve has an electrical-conductive insertion portion assembled with the electrical-conductive connection portion. By this structure, a damaged light source module can be replaced rapidly. A user needs not to by a new whole set lamp so as to save the cost maintenance. Further, a surface thermal contact is generated between the metallic pressing plate and the heat-conducting plate to increase the heat-conducting area and efficiency.

Abstract: An LED fixture include a mask structure and an LED module. The mask structure includes a cooling fin set of buckling type, an upper socket and a lower socket. The cooling fin set is constituted by a plurality of cooling fins that are encircled and inter-buckled to each other. An interior enclosed by the cooling fin set is formed into an accommodating space and a fitting hole connecting the accommodating space. The upper socket is assembled to one side of the fitting hole, while the lower socket is assembled to another side of the fitting hole. Meanwhile, the upper socket and the lower socket are respectively fastened by the cooling fin set through a clipping-and-abutting manner. The LED module is arranged by accommodating in the accommodating space and is connected to the cooling fin set as well. Accordingly, the entirely cooling effectiveness is promoted and the using lifetime is prolonged.

Abstract: An LED fixture include a mask structure and an LED module. The mask structure includes a cooling fin set of buckling type, an upper socket and a lower socket. The cooling fin set is constituted by a plurality of cooling fins that are encircled and inter-buckled to each other. An interior enclosed by the cooling fin set is formed into an accommodating space and a fitting hole connecting the accommodating space. The upper socket is assembled to one side of the fitting hole, while the lower socket is assembled to another side of the fitting hole. Meanwhile, the upper socket and the lower socket are respectively fastened by the cooling fin set through a clipping-and-abutting manner. The LED module is arranged by accommodating in the accommodating space and is connected to the cooling fin set as well. Accordingly, the entirely cooling effectiveness is promoted and the using lifetime is prolonged.

Abstract: A heat dissipating device with protection function is used for assembling around a heat generation element. The heat dissipating device includes a plurality of heat dissipating fins. The heat dissipating fins have a circular array with each heat dissipating fin connecting to another. A receiving space is defined in a central position of the heat dissipating fins for positioning the heat generating element. Each heat dissipating fin includes a laminated body. The laminated body includes an inner lateral edge and an outer lateral edge opposite to the inner lateral edge. A flange is backwardly formed on a section of the outer lateral edge. A user can avoid to be cut by the flange when disassembling the heat dissipating device.

Abstract: An assembled structure of a large-sized LED lamp includes a substrate. One surface of the substrate is provided with a plurality of LED modules. Each LED module comprises a circuit board and a plurality of LEDs fixedly connected to the circuit board. A lamp mask is locked onto the substrate to cover and protect the LED modules. A sealing material is provided between the lamp mask and the substrate to protect the permeation of liquid. Further, at the positions of the other surface of the substrate, heat-dissipating modules are provided to correspond to each LED module, respectively. The heat-dissipating modules are used to dissipate heat generated from the LEDs. A lamp cover is covered to the exterior of the heat-dissipating modules. The lamp cover is locked onto the substrate. With the modulization of each constituent element, the detachment, assembly and repair of the present invention can be much simpler and more convenient.

Abstract: An assembled structure of a large-sized LED lamp includes a substrate. One surface of the substrate is provided with a plurality of LED modules. Each LED module comprises a circuit board and a plurality of LEDs fixedly connected to the circuit board. A lamp mask is locked onto the substrate to cover and protect the LED modules. A sealing material is provided between the lamp mask and the substrate to protect the permeation of liquid. Further, at the positions of the other surface of the substrate, heat-dissipating modules are provided to correspond to each LED module, respectively. The heat-dissipating modules are used to dissipate heat generated from the LEDs. A lamp cover is covered to the exterior of the heat-dissipating modules. The lamp cover is locked onto the substrate. With the modulization of each constituent element, the detachment, assembly and repair of the present invention can be much simpler and more convenient.

Abstract: A pressing mechanism presses the LED chip firmly to the base and includes a pressing device. The pressing device includes two parallel metal plates extended integrally from topside of the base and disposed on two sides of the LED chip. The metal plate includes a first pin connected to the base and a second pin extended parallel atop the base. The separation between the pressing plate and the base is slightly larger than the thickness of the LED chip. According to another preferred embodiment of the present invention, the pressing plate is a pressing clip. The pressing clip includes a connection end of substantially L shape and a floating end of substantially U shape. According to still another preferred embodiment of the present invention, the pressing mechanism includes two screws to fix the LED chip to the base on two radial sides of the LED chip.

Abstract: The present invention is directed to a LED lamp and the heat-dissipating structure thereof. The heat-dissipating structure is used to dissipate the heat generated by the LED and comprises a first heat-dissipating body and a second heat-dissipating body. The first heat-dissipating body has a casing with an opening formed thereon. The second heat-dissipating body is connected on the first heat-dissipating body and comprises at least one heat pipe and a plurality of heat-dissipating fins connected to the heat pipe. With this arrangement, the LED continuously operates under a suitable working temperature and the life of the LED can thus be prolonged.