Abstract: Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.

Abstract: Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.

Abstract: Particles are removed from electronic components, such as components of data storage devices by use of an electrochemical process. An electronic component is immersed in an electrochemical bath, and a voltage is applied across the +ve electrode and ?ve electrode in an amount sufficient to remove charged particles present on a surface of the electronic component.

Abstract: Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.

Abstract: Described are methods for processing microelectronic device substrates by a lapping step, e.g., a final lapping step, wherein the step includes the use of an elastomeric pressure-sensitive adhesive to secure the microelectronic device substrate to a carrier that holds the substrate to a surface of the carrier during the lapping step, and wherein the pressure-sensitive adhesive can be a non-polysilicone based adhesive having mechanical properties that include a tan delta that is below about 0.2.

Abstract: Particles are removed from electronic components, such as components of data storage devices by use of an electrochemical process. An electronic component is immersed in an electrochemical bath, and a voltage is applied across the +ve electrode and ?ve electrode in an amount sufficient to remove charged particles present on a surface of the electronic component.

Abstract: Disclosed herein are embodiments of a method of making a lubricant composition for lapping a ceramic material. The method includes mixing a base lubricant component and a powdered wax composition component to form the lubricant composition. The powdered wax composition component includes a powdered wax dispersion or a powdered wax emulsion. The amount of powdered wax composition component mixed with the base lubricant component is from 0.01 to 10 percent by weight of the lubricant composition. Also disclosed herein are embodiments of related lubricant compositions and/or methods of using the lubricant to lap a ceramic substrate (e.g., one or more bars of sliders).

Abstract: Disclosed herein are embodiments of a method of making a lubricant composition for lapping a ceramic material. The method includes mixing a base lubricant component and a powdered wax composition component to form the lubricant composition. The powdered wax composition component includes a powdered wax dispersion or a powdered wax emulsion. The amount of powdered wax composition component mixed with the base lubricant component is from 0.01 to 10 percent by weight of the lubricant composition. Also disclosed herein are embodiments of related lubricant compositions and/or methods of using the lubricant to lap a ceramic substrate (e.g., one or more bars of sliders).