Patents by Inventor Zuhra I. NIAZIMBETOVA

Zuhra I. NIAZIMBETOVA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230279577
    Abstract: Through-holes of a substrate are initially plated with copper to form an incomplete bridge in the middle of the through-holes by a phase shift pulse plating process on both sides of the substrate simultaneously. This is followed by pulse plating the entire substrate to complete the filling of the through-holes.
    Type: Application
    Filed: February 1, 2023
    Publication date: September 7, 2023
    Inventors: Nagarajan Jayaraju, Derek J. Thoresen, Joanna J. Dziewiszek, Jimmy John, Zuhra I. Niazimbetova
  • Patent number: 10196751
    Abstract: Polymers of reaction products of polyamines and nitrogen containing cyclic compounds are included in metal electroplating compositions to provide level metal deposits on substrates.
    Type: Grant
    Filed: November 6, 2013
    Date of Patent: February 5, 2019
    Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: Lingli Duan, Zuhra I. Niazimbetova, Chen Chen, Tong Sun, Maria Rzeznik
  • Patent number: 10190226
    Abstract: Reaction products of heterocyclic nitrogen compounds, polyepoxide compounds and polyhalogen compounds may be used as levelers in metal electroplating baths, such as copper electroplating baths, to provide good throwing power. Such reaction products may plate metal with good surface properties and good physical reliability.
    Type: Grant
    Filed: July 12, 2016
    Date of Patent: January 29, 2019
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Julia Kozhukh, Zuhra I. Niazimbetova
  • Patent number: 10041182
    Abstract: Reaction products of one or more amino acids and one or more epoxies are included in copper and copper alloy electroplating baths to provide good throwing power. Such reaction products may plate copper and copper alloys with good surface properties and good physical reliability.
    Type: Grant
    Filed: April 12, 2017
    Date of Patent: August 7, 2018
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Zuhra I Niazimbetova, Maria Anna Rzeznik
  • Patent number: 9783903
    Abstract: Reaction products of halogenated pyrimidines and nucleophilic linker units are included in metal electroplating baths to provide good throwing power. The electroplating baths can be used to plate metal, such as copper, tin and alloys thereof on printed circuit boards and semiconductors and fill through-holes and vias.
    Type: Grant
    Filed: December 6, 2013
    Date of Patent: October 10, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Julia Kozhukh, Zuhra I. Niazimbetova, Maria Anna Rzeznik
  • Patent number: 9783905
    Abstract: Reaction products of one or more amino acids and one or more epoxies are included in copper and copper alloy electroplating baths to provide good throwing power. Such reaction products may plate copper and copper alloys with good surface properties and good physical reliability.
    Type: Grant
    Filed: December 30, 2014
    Date of Patent: October 10, 2017
    Assignee: Rohm and Haas Electronic Mateirals LLC
    Inventors: Zuhra I Niazimbetova, Maria Anna Rzeznik
  • Patent number: 9725816
    Abstract: Amino sulfonic acid based polymers are reaction products of amino sulfonic acids, an amine, polyepoxide compounds and epihalohydrin. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability.
    Type: Grant
    Filed: December 30, 2014
    Date of Patent: August 8, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Weijing Lu, Zuhra I Niazimbetova, Maria Anna Rzeznik
  • Publication number: 20170218533
    Abstract: Reaction products of one or more amino acids and one or more epoxies are included in copper and copper alloy electroplating baths to provide good throwing power. Such reaction products may plate copper and copper alloys with good surface properties and good physical reliability.
    Type: Application
    Filed: April 12, 2017
    Publication date: August 3, 2017
    Inventors: Zuhra I NIAZIMBETOVA, Maria Anna RZEZNIK
  • Patent number: 9611560
    Abstract: Sulfonamide based polymers are reaction products of sulfonamides and epoxides. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability.
    Type: Grant
    Filed: December 30, 2014
    Date of Patent: April 4, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Weijing Lu, Zuhra I Niazimbetova, Maria Anna Rzeznik
  • Patent number: 9598786
    Abstract: Amino sulfonic acid based polymers are reaction products of amino sulfonic acids, an amine, polyepoxide compounds and epihalohydrin. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability.
    Type: Grant
    Filed: January 13, 2016
    Date of Patent: March 21, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Weijing Lu, Zuhra I. Niazimbetova, Maria Anna Rzeznik
  • Patent number: 9562300
    Abstract: Sulfonamide based polymers are reaction products of sulfonamides and epoxides. The polymers may be used as levelers in copper electroplating baths, to provide good throwing power. Such reaction products may plate copper or copper alloys with good surface properties and good physical reliability.
    Type: Grant
    Filed: December 28, 2015
    Date of Patent: February 7, 2017
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Weijing Lu, Zuhra I Niazimbetova, Maria Anna Rzeznik
  • Patent number: 9518324
    Abstract: Copolymers of diglycidyl ether terminated polysiloxane compounds and non-aromatic polyamines are used in the preparation of dielectric materials for electroless metal plating. The copolymers may be used in the manufacture of printed circuit boards such as in cleaning and conditioning through-holes prior to electroless metallization.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: December 13, 2016
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Julia Kozhukh, Zuhra I. Niazimbetova, Kristen M. Milum
  • Patent number: 9499912
    Abstract: Copolymers of diglycidyl ether terminated polysiloxane compounds and non-aromatic polyamines are used in the preparation of dielectric materials for electroless metal plating. The copolymers may be used in the manufacture of printed circuit boards such as in cleaning and conditioning through-holes prior to electroless metallization.
    Type: Grant
    Filed: May 26, 2014
    Date of Patent: November 22, 2016
    Inventors: Julia Kozhukh, Zuhra I. Niazimbetova, Kristen M. Milum
  • Publication number: 20160319447
    Abstract: Reaction products of heterocyclic nitrogen compounds, polyepoxide compounds and polyhalogen compounds may be used as levelers in metal electroplating baths, such as copper electroplating baths, to provide good throwing power. Such reaction products may plate metal with good surface properties and good physical reliability.
    Type: Application
    Filed: July 12, 2016
    Publication date: November 3, 2016
    Applicant: Rohm and Haas Electronic Materials LLC
    Inventors: Julia Kozhukh, Zuhra I. Niazimbetova
  • Patent number: 9435045
    Abstract: Reaction products of guanidine compounds or salts thereof, polyepoxide compounds and polyhalogen compounds may be used as levelers in metal electroplating baths, such as copper electroplating baths, to provide good throwing power. Such reaction products may plate with good surface properties of the metal deposits and good physical reliability.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: September 6, 2016
    Inventors: Julia Kozhukh, Zuhra I. Niazimbetova, Maria Anna Rzeznik
  • Patent number: 9439294
    Abstract: Reaction products of heterocyclic nitrogen compounds, polyepoxide compounds and polyhalogen compounds may be used as levelers in metal electroplating baths, such as copper electroplating baths, to provide good throwing power. Such reaction products may plate metal with good surface properties and good physical reliability.
    Type: Grant
    Filed: April 16, 2014
    Date of Patent: September 6, 2016
    Inventors: Julia Kozhukh, Zuhra I. Niazimbetova
  • Publication number: 20160237579
    Abstract: Polymers of reaction products of polyamines and nitrogen containing cyclic compounds are included in metal electroplating compositions to provide level metal deposits on substrates.
    Type: Application
    Filed: November 6, 2013
    Publication date: August 18, 2016
    Applicants: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: Lingli Duan, Zuhra I. Niazimbetova, Chen Chen, Tong Sun, Maria Rzeznik
  • Patent number: 9403762
    Abstract: Reaction products of guanidine compounds or salts thereof, polyepoxide compounds and polyhalogen compounds may be used as levelers in metal electroplating baths, such as copper electroplating baths, to provide good throwing power. Such reaction products may plate with good surface properties of the metal deposits and good physical reliability.
    Type: Grant
    Filed: November 21, 2013
    Date of Patent: August 2, 2016
    Inventors: Julia Kozhukh, Zuhra I Niazimbetova, Maria Anna Rzeznik
  • Patent number: 9404193
    Abstract: Reaction products of guanidine compounds or salts thereof, polyepoxide compounds and polyhalogen compounds may be used as levelers in metal electroplating baths, such as copper electroplating baths, to provide good throwing power. Such reaction products may plate with good surface properties of the metal deposits and good physical reliability.
    Type: Grant
    Filed: March 24, 2016
    Date of Patent: August 2, 2016
    Inventors: Julia Kozhukh, Zuhra I. Niazimbetova, Maria Anna Rzeznik
  • Publication number: 20160208400
    Abstract: Reaction products of guanidine compounds or salts thereof, polyepoxide compounds and polyhalogen compounds may be used as levelers in metal electroplating baths, such as copper electroplating baths, to provide good throwing power. Such reaction products may plate with good surface properties of the metal deposits and good physical reliability.
    Type: Application
    Filed: March 24, 2016
    Publication date: July 21, 2016
    Inventors: Julia KOZHUKH, Zuhra I. NIAZIMBETOVA, Maria Anna RZEZNIK