Patents by Inventor Zuhra Niazimbetova

Zuhra Niazimbetova has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of filling through-holes to reduce voids and other defects
    Patent number: 10508357
    Abstract: Direct current plating methods inhibit void formation, reduce dimples and eliminate nodules. The method involves electroplating copper at a high current density followed by a pause in electroplating and then turning on the current to electroplate at a lower current density to fill through-holes.
    Type: Grant
    Filed: December 20, 2016
    Date of Patent: December 17, 2019
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Nagarajan Jayaraju, Leon Barstad, Zuhra Niazimbetova, Joanna Dziewiszek
  • Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyrazole compounds and bisepoxides
    Patent number: 10508349
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyrazole compounds and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Grant
    Filed: June 13, 2017
    Date of Patent: December 17, 2019
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Ravi Pokhrel, Matthew Thorseth, James Byrnes, Mark Scalisi, Zuhra Niazimbetova, Joanna Dziewiszek
  • Polymers containing benzimidazole moieties as levelers
    Patent number: 10201097
    Abstract: Polymers of reaction products of dihalogens and compounds containing benzimidazole moieties are included in metal electroplating compositions to provide level metal deposits on substrates.
    Type: Grant
    Filed: November 20, 2013
    Date of Patent: February 5, 2019
    Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: Lingli Duan, Yang Li, Tong Sun, Shaoguang Feng, Chen Chen, Zuhra Niazimbetova, Maria Rzeznik
  • Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features
    Patent number: 10190228
    Abstract: Copper electroplating baths and methods enable the plating of photoresist defined megafeatures at high current densities which have substantially uniform morphology and reduced nodule development. The copper electroplating baths include a mixture of heterocyclic nitrogen containing copolymers which provide megafeatures having a good % TIR and % WID balance.
    Type: Grant
    Filed: March 7, 2017
    Date of Patent: January 29, 2019
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Matthew Thorseth, Rebecca Hazebrouck, Mark Scalisi, Zuhra Niazimbetova, Joanna Dziewiszek
  • Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds
    Patent number: 10100421
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: October 16, 2018
    Assignees: Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyridyl alkylamines and bisepoxides
    Patent number: 10104782
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyridyl alkylamines and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: October 16, 2018
    Assignees: Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds
    Patent number: 10006136
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole compounds, bisepoxides and halobenzyl compounds to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: June 26, 2018
    Assignees: Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLC
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Julia Kozhukh, Erik Reddington, Mark Lefebvre
  • Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides
    Patent number: 9932684
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of ?-amino acids and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Grant
    Filed: July 27, 2016
    Date of Patent: April 3, 2018
    Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF PYRAZOLE COMPOUNDS AND BISEPOXIDES
    Publication number: 20170370014
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyrazole compounds and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Application
    Filed: June 13, 2017
    Publication date: December 28, 2017
    Inventors: Ravi Pokhrel, Matthew Thorseth, James Byrnes, Mark Scalisi, Zuhra Niazimbetova, Joanna Dziewiszek
  • COPPER ELECTROPLATING BATHS AND ELECTROPLATING METHODS CAPABLE OF ELECTROPLATING MEGASIZED PHOTORESIST DEFINED FEATURES
    Publication number: 20170283970
    Abstract: Copper electroplating baths and methods enable the plating of photoresist defined megafeatures at high current densities which have substantially uniform morphology and reduced nodule development. The copper electroplating baths include a mixture of heterocyclic nitrogen containing copolymers which provide megafeatures having a good % TIR and % WID balance.
    Type: Application
    Filed: March 7, 2017
    Publication date: October 5, 2017
    Inventors: Matthew Thorseth, Rebecca Hazebrouck, Mark Scalisi, Zuhra Niazimbetova, Joanna Dziewiszek
  • METHOD OF FILLING THROUGH-HOLES TO REDUCE VOIDS AND OTHER DEFECTS
    Publication number: 20170233886
    Abstract: Direct current plating methods inhibit void formation, reduce dimples and eliminate nodules. The method involves electroplating copper at a high current density followed by a pause in electroplating and then turning on the current to electroplate at a lower current density to fill through-holes.
    Type: Application
    Filed: December 20, 2016
    Publication date: August 17, 2017
    Inventors: Nagarajan Jayaraju, Leon Barstad, Zuhra Niazimbetova, Joanna Dziewiszek
  • METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF PYRIDYL ALKYLAMINES AND BISEPOXIDES
    Publication number: 20170042037
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyridyl alkylamines and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Application
    Filed: July 27, 2016
    Publication date: February 9, 2017
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF IMIDAZOLE COMPOUNDS, BISEPOXIDES AND HALOBENZYL COMPOUNDS
    Publication number: 20170037528
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole compounds, bisepoxides and halobenzyl compounds to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Application
    Filed: July 27, 2016
    Publication date: February 9, 2017
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Julia Kozhukh, Erik Reddington, Mark Lefebvre
  • METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF ALPHA AMINO ACIDS AND BISEPOXIDES
    Publication number: 20170037527
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of ?-amino acids and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Application
    Filed: July 27, 2016
    Publication date: February 9, 2017
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • METHOD OF ELECTROPLATING PHOTORESIST DEFINED FEATURES FROM COPPER ELECTROPLATING BATHS CONTAINING REACTION PRODUCTS OF IMIDAZOLE AND BISEPOXIDE COMPOUNDS
    Publication number: 20170037526
    Abstract: Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of imidazole and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.
    Type: Application
    Filed: July 27, 2016
    Publication date: February 9, 2017
    Inventors: Matthew Thorseth, Zuhra Niazimbetova, Yi Qin, Julia Woertink, Joanna Dziewiszek, Erik Reddington, Mark Lefebvre
  • POLYMERS CONTAINING BENZIMIDAZOLE MOIETIES AS LEVELERS
    Publication number: 20160255729
    Abstract: Polymers of reaction products of dihalogens and compounds containing benzimidazole moieties are included in metal electroplating compositions to provide level metal deposits on substrates.
    Type: Application
    Filed: November 20, 2013
    Publication date: September 1, 2016
    Applicants: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLC
    Inventors: Lingli Duan, Yang Li, Tong Sun, Shaoguang Feng, Chen Chen, Zuhra Niazimbetova, Maria Rzeznik