Patents by Inventor Zukhra I. Niazimbetova
Zukhra I. Niazimbetova has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11732374Abstract: Reaction products of amines and polymers containing saturated heterocyclic moieties may be used as levelers in metal electroplating baths. The reaction products may plate metal with good surface properties and good physical reliability.Type: GrantFiled: January 17, 2020Date of Patent: August 22, 2023Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLCInventors: Lingli Duan, Chen Chen, Tong Sun, Zukhra I. Niazimbetova, Maria Anna Rzeznik
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Patent number: 10892802Abstract: A method of providing spatial diversity for critical data delivery in a beamformed mmWave small cell is proposed. The proposed spatial diversity scheme offers duplicate or incremental data/signal transmission and reception by using multiple different beams for the same source and destination. The proposed spatial diversity scheme can be combined with other diversity schemes in time, frequency, and code, etc. for the same purpose. In addition, the proposed spatial diversity scheme combines the physical-layer resources associated with the beams with other resources of the same or different protocol layers. By spatial signaling repetition to avoid Radio Link Failure (RLF) and Handover Failure (HOF), mobility robustness can be enhanced. Mission-critical and/or time-critical data delivery can also be achieved without relying on retransmission.Type: GrantFiled: October 7, 2019Date of Patent: January 12, 2021Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLCInventors: Lingli Duan, Chen Chen, Shaoguang Feng, Zukhra I. Niazimbetova, Maria Anna Rzeznik
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Patent number: 10738039Abstract: Reaction products of diamines with the reaction products of monoamines and bisanhydrides are included as additives in metal electroplating baths. The metal electroplating baths have good throwing power and deposit metal layers having substantially planar surfaces. The metal plating baths may be used to deposit metal on substrates with surface features such as through-holes and vias.Type: GrantFiled: April 28, 2015Date of Patent: August 11, 2020Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLCInventors: Lingli Duan, Chen Chen, Shaoguang Feng, Zukhra I. Niazimbetova, Maria Anna Rzeznik
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Publication number: 20200149175Abstract: Reaction products of amines and polymers containing saturated heterocyclic moieties may be used as levelers in metal electroplating baths. The reaction products may plate metal with good surface properties and good physical reliability.Type: ApplicationFiled: January 17, 2020Publication date: May 14, 2020Inventors: Lingli Duan, Chen Chen, Tong Sun, Zukhra I. Niazimbetova, Maria Anna Rzeznik
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Patent number: 10604856Abstract: Reaction products of amines and polymers containing saturated heterocyclic moieties may be used as levelers in metal electroplating baths. The reaction products may plate metal with good surface properties and good physical reliability.Type: GrantFiled: April 28, 2015Date of Patent: March 31, 2020Assignees: Rohm and Haas Electronics Materials LLC, Dow Global Technologies LLCInventors: Lingli Duan, Chen Chen, Tong Sun, Zukhra I. Niazimbetova, Maria Anna Rzeznik
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Publication number: 20200031818Abstract: A method of providing spatial diversity for critical data delivery in a beamformed mmWave small cell is proposed. The proposed spatial diversity scheme offers duplicate or incremental data/signal transmission and reception by using multiple different beams for the same source and destination. The proposed spatial diversity scheme can be combined with other diversity schemes in time, frequency, and code, etc. for the same purpose. In addition, the proposed spatial diversity scheme combines the physical-layer resources associated with the beams with other resources of the same or different protocol layers. By spatial signaling repetition to avoid Radio Link Failure (RLF) and Handover Failure (HOF), mobility robustness can be enhanced. Mission-critical and/or time-critical data delivery can also be achieved without relying on retransmission.Type: ApplicationFiled: April 28, 2015Publication date: January 30, 2020Inventors: Lingli DUAN, Chen Chen, Shaoguang Feng, Zukhra I. Niazimbetova, Maria Anna Rzeznik
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Patent number: 10435380Abstract: Reaction products of primary and secondary diamines and bisanhydrides are included as additives in metal electroplating baths. The metal electroplating baths have good throwing power and deposit metal layers having substantially planar surfaces. The metal plating baths may be used to deposit metal on substrates with surface features such as through-holes and vias.Type: GrantFiled: October 11, 2018Date of Patent: October 8, 2019Assignees: Rohm and Haas Electronic Materials LLC, Dow Global Technologies LLCInventors: Lingli Duan, Chen Chen, Shaoguang Feng, Zukhra I. Niazimbetova, Maria Anna Rzeznik
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Patent number: 10106512Abstract: Reaction products of primary and secondary diamines and bisanhydrides are included as additives in metal electroplating baths. The metal electroplating baths have good throwing power and deposit metal layers having substantially planar surfaces. The metal plating baths may be used to deposit metal on substrates with surface features such as through-holes and vias.Type: GrantFiled: April 28, 2015Date of Patent: October 23, 2018Assignees: Dow Global Technologies LLC, Rohm and Haas Electronic Materials LLCInventors: Lingli Duan, Chen Chen, Shaoguang Feng, Zukhra I. Niazimbetova, Maria Anna Rzeznik
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Publication number: 20180135194Abstract: Reaction products of amines and polymers containing saturated heterocyclic moieties may be used as levelers in metal electroplating baths. The reaction products may plate metal with good surface properties and good physical reliability.Type: ApplicationFiled: April 28, 2015Publication date: May 17, 2018Inventors: Lingli DUAN, Chen CHEN, Tong SUN, Zukhra I. NIAZIMBETOVA, Maria Anna RZEZNIK
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Publication number: 20180093957Abstract: Reaction products of primary and secondary diamines and bisanhydrides are included as additives in metal electroplating baths. The metal electroplating baths have good throwing power and deposit metal layers having substantially planar surfaces. The metal plating baths may be used to deposit metal on substrates with surface features such as through-holes and vias.Type: ApplicationFiled: April 28, 2015Publication date: April 5, 2018Inventors: LINGLI DUAN, Chen CHEN, Shaoguang FENG, Zukhra I. NIAZIMBETOVA, Maria Anna RZEZNIK
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Patent number: 8747643Abstract: Copper plating baths containing a leveling agent that is a reaction product of one or more of certain cyclodiaza-compounds with one or more epoxide-containing compounds that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.Type: GrantFiled: August 22, 2011Date of Patent: June 10, 2014Assignee: Rohm and Haas Electronic Materials LLCInventors: Zukhra I. Niazimbetova, Maria Anna Rzeznik
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Publication number: 20130048505Abstract: Copper plating baths containing a leveling agent that is a reaction product of one or more of certain cyclodiaza-compounds with one or more epoxide-containing compounds that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.Type: ApplicationFiled: August 22, 2011Publication date: February 28, 2013Applicant: Rohm and Haas Electronic Materials LLCInventors: Zukhra I. NIAZIMBETOVA, Maria Anna Rzeznik
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Patent number: 8268158Abstract: Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.Type: GrantFiled: August 11, 2011Date of Patent: September 18, 2012Assignee: Rohm and Haas Electronic Materials LLCInventors: Zukhra I. Niazimbetova, Elie H. Najjar, Maria Anna Rzeznik, Erik Reddington
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Patent number: 8268157Abstract: Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.Type: GrantFiled: March 15, 2010Date of Patent: September 18, 2012Assignee: Rohm and Haas Electronic Materials LLCInventor: Zukhra I. Niazimbetova
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Patent number: 8262895Abstract: Copper plating baths containing a leveling agent that is a reaction product of a certain benzimidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.Type: GrantFiled: March 15, 2010Date of Patent: September 11, 2012Assignee: Rohm and Haas Electronic Materials LLCInventors: Zukhra I. Niazimbetova, Maria Anna Rzeznik
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Publication number: 20120034371Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.Type: ApplicationFiled: August 15, 2011Publication date: February 9, 2012Applicant: Rohm and Haas Electronic Materials LLCInventors: Erik Reddington, Gonzalo Urrutia Desmaison, Zukhra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
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Publication number: 20110318479Abstract: Disclosed are metal plating compositions and methods. The metal plating compositions provide good leveling performance and throwing power.Type: ApplicationFiled: September 6, 2011Publication date: December 29, 2011Applicant: Rohm and Haas Electronic Materials LLCInventors: Erik REDDINGTON, Gonzalo Urrutia DESMAISON, Zukhra I. NIAZIMBETOVA, Donald E. CLEARY, Mark LEFEBVRE
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Publication number: 20110290660Abstract: Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.Type: ApplicationFiled: August 11, 2011Publication date: December 1, 2011Applicant: Rohm and Haas Electronic Materials LLCInventors: Zukhra I. NIAZIMBETOVA, Elie H. Najjar, Maria Anna Rzeznik, Erik Reddington
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Patent number: 8048284Abstract: Disclosed are metal plating compositions for plating a metal on a substrate. The metal plating compositions include compounds which influence the leveling and throwing performance of the metal plating compositions. Also disclosed are methods of depositing metals on a substrate.Type: GrantFiled: April 2, 2008Date of Patent: November 1, 2011Assignee: Rohm and Haas Electronic Materials LLCInventors: Erik Reddington, Gonzalo Urrutia Desmaison, Zukhra I. Niazimbetova, Donald E. Cleary, Mark Lefebvre
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Publication number: 20110220513Abstract: Copper plating baths containing a leveling agent that is a reaction product of a certain benzimidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.Type: ApplicationFiled: March 15, 2010Publication date: September 15, 2011Applicant: Rohm and Haas Electronic Materials LLCInventors: Zukhra I. Niazimbetova, Maria Anna Rzeznik