Abstract: The present invention relates to photoresist compositions comprising a base resin such as a monomer capable of radical polymerization upon photoinitiation, and photoinitiator molecules such as a diketone, and multicolor photolithography methods. Photoresist compositions comprise photoinitiator molecules that are exposed to a first radiation source, thereby exciting the photoinitiator molecules from a ground state to a pre-activated state. The pre-activated state molecules are then exposed to a second radiation source in selected locations, thereby deactivating the pre-activated state molecules in the selected locations. Any remaining pre-activated state molecules are exposed to a third radiation source, exciting such remaining pre-activated state photoinitiator molecules to an activated state. Polymerization of the base resin is then initiated.

Abstract: The present invention relates to photoresist compositions comprising a base resin such as a monomer capable of radical polymerization upon photoinitiation, and photoinitiator molecules such as a diketone, and multicolor photolithography methods. Photoresist compositions comprise photoinitiator molecules that are exposed to a first radiation source, thereby exciting the photoinitiator molecules from a ground state to a pre-activated state. The pre-activated state molecules are then exposed to a second radiation source in selected locations, thereby deactivating the pre-activated state molecules in the selected locations. Any remaining pre-activated state molecules are exposed to a third radiation source, exciting such remaining pre-activated state photoinitiator molecules to an activated state. Polymerization of the base resin is then initiated.