Abstract: In examples, a package comprises a semiconductor die, a gullwing conductive terminal coupled to the semiconductor die, and a mold compound covering the semiconductor die and the conductive terminal. The conductive terminal extends outward from the mold compound. The conductive terminal includes a top surface and a bottom surface opposing the top surface, the conductive terminal includes a first bend and a second bend more distal from the mold compound than the first bend, and the bottom surface includes a first cavity extending along a width of the conductive terminal at the first bend. The top surface includes a second cavity extending along the width of the conductive terminal at the second bend.

Abstract: In examples, a semiconductor package includes a copper lead having top and bottom surfaces, an end surface, and first and second lateral surfaces orthogonal to the top, bottom, and end surfaces. The end surface, the top surface, and the bottom surface are plated with another metal, a first portion of the first lateral surface distal to a mold compound and proximal to the end surface is plated with the another metal, a second portion of the first lateral surface distal to the mold compound and proximal to the first portion of the first lateral surface is not plated with the another metal, a first portion of the second lateral surface distal to the mold compound and proximal to the end surface is plated with the another metal, and a second portion of the second lateral surface distal to the mold compound and proximal to the first portion of the second lateral surface is not plated with the another metal.

Abstract: A semiconductor package that includes a leadframe having retaining features adapted to receive a molding compound is provided. As one example, an IC package includes a leadframe of a conductive material including a die attach pad and a lead finger separated from an edge of the die attach pad. The leadframe has a first surface and a second surface opposite the first surface. The IC package also includes retaining features on the lead finger at the second surface. The IC package further includes a die on the first surface at the die attach pad. The IC package yet further includes a molding compound that encapsulates the leadframe and the die and extends into and/or around the retaining features.

Abstract: A method of fabricating an electronic device includes: mounting a semiconductor die in a unit area of a lead frame; electrically connecting the semiconductor die to a conductive feature in the unit area of the lead frame; performing a molding process to form a molded package structure that extends through multiple unit areas of the lead frame along a first column of the lead frame and extends under a mold locking structure in a side portion of the lead frame at an end of the first column to oppose separation of the molded package structure from the side portion of the lead frame; separating the first column from an adjacent second column of the lead frame; separating an electronic device of the unit area from the lead frame; and separating the side portion from the first column of the lead frame.

Abstract: In examples, a package comprises a semiconductor die, a gullwing conductive terminal coupled to the semiconductor die, and a mold compound covering the semiconductor die and the conductive terminal. The conductive terminal extends outward from the mold compound. The conductive terminal includes a top surface and a bottom surface opposing the top surface, the conductive terminal includes a first bend and a second bend more distal from the mold compound than the first bend, and the bottom surface includes a first cavity extending along a width of the conductive terminal at the first bend. The top surface includes a second cavity extending along the width of the conductive terminal at the second bend.