Abstract: The technology generally relates to determining a status of an optical channel between two components. For example, the components may be connected via an optical link including a plurality of optical channels. A first portion of the optical channels may be in use such that a second portion of the optical channels may be redundant channels. The component may include a test generator that transmits and receives a data pattern over each channel. The test generator may determine, based on the received data pattern, a status of each of the channels. If the status of a given channel is a failure status, the component may divert data for the given channel to a redundant channel.

Abstract: The technology generally relates to high bandwidth memory (HBM) and optical connectivity stacking. Disclosed systems and methods herein allow for 3D-stacking of HBM dies that are interconnected with an optical interface in a manner that allows for compact, high-performance computing. An optical chiplet can be configured to be placed onto a stack of HBM dies, with a cooling die that is positioned between the HBM dies and the optical chiplet. The optical chiplet may be configured to connect the HBM optics module package to one or more other components of the package via to one or more optical fibers.

Abstract: The technology generally relates to disaggregating memory from an application specific integrated circuit (“ASIC”) package. For example, a high-bandwidth memory (“HBM”) optics module package may be connected to an ASIC package via one or more optical links. The HBM optics module package may include HBM dies(s), HBM chiplet(s) and an optical chiplet. The optical chiplet may be configured to connect the HBM optics module to one or more optical fibers that form an optical link with one or more other components of the ASIC package. By including an optical chiplet in the HBM optics module package, the HBM optics module package may be disaggregated from an ASIC package.

Abstract: The technology generally relates to determining a status of an optical channel between two components. For example, the components may be connected via an optical link including a plurality of optical channels. A first portion of the optical channels may be in use such that a second portion of the optical channels may be redundant channels. The component may include a test generator that transmits and receives a data pattern over each channel. The test generator may determine, based on the received data pattern, a status of each of the channels. If the status of a given channel is a failure status, the component may divert data for the given channel to a redundant channel.

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.

Abstract: An electromagnetic interference (“EMI”) sheet attenuator includes a planar conductive layer, a first flexible substrate and a second flexible substrate. The first flexible substrate overlies the metal backing layer and including a conductive pattern on a surface of the first flexible substrate. The second flexible substrate overlies the first flexible substrate and also includes the conductive pattern. The conductive pattern on the second flexible substrate is aligned with the conductive pattern on the first flexible substrate.

Abstract: The present disclosure discusses an improved optical transceiver. The optical transceiver of the present disclosure includes an optical transmitter and an optical receiver coupled to an area of a printed circuit board that includes a plurality of thermal microvias. The thermal microvias are coupled to a heat sink or other heat dissipater and provide a path from the components of the optical transceiver to the heat dissipater for heat to travel.

Abstract: An optical connector assembly includes a spring, a ferrule, a first housing, and a second housing connected to the first housing. The ferrule includes a ferrule body and a lens. The ferrule body defines a fiber receiver configured to receive optical fibers of an optical cable and a first spring receiver configured to receive the spring. The lens is arranged to optically communicate light propagated by the received optical fibers for free-space optical communication. The first housing defines a first opening configured to slidably receive and guide the ferrule for movement along a first longitudinal axis. The second housing defines a second opening configured to receive the optical cable therethrough along a second longitudinal axis, and a second spring receiver configured to receive the spring. The spring biases movement of the ferrule in the first housing away from the second housing.

Abstract: The present disclosure discusses an improved optical transceiver. The optical transceiver of the present disclosure includes an optical transmitter and an optical receiver coupled to an area of a printed circuit board that includes a plurality of thermal microvias. The thermal microvias are coupled to a heat sink or other heat dissipater and provide a path from the components of the optical transceiver to the heat dissipater for heat to travel.

Abstract: The present disclosure discusses an improved optical transceiver. The optical transceiver of the present disclosure includes an optical transmitter and an optical receiver that are spatially separated. In some implementations, the optical receiver and optical transmitter are staggered from one another. Each of the optical receiver and the optical transmitter and housed within a separate optical lens. In some implementations, the separation of the components reduces mechanical, thermal, and electrical cross talk between the optical transmitter and the optical receiver. The separation of the components can also ease the constraints of the optical alignment between the optical transmitter and the optical receiver and each of their respective lenses.

Abstract: Systems and methods for achieving eye safety of an optical transceiver are provided. An optical module can be configured to output a first optical signal. A first photodetector can be configured to output a signal indicative of a presence or absence of a second optical signal. A controller can be coupled to the optical module and the first photodetector and can be configured to control the output of the optical module. In response to a determination that an output of the first photodetector indicates the second optical signal is absent, the controller can control the optical module to output the first signal at a decreased average optical power. In response to a determination that an output of the first photodetector indicates the second optical signal is present, the controller can control the optical module to output the first signal at an increased average optical power.

Abstract: An optical attenuation system that includes first and second attenuators providing different attenuations of corresponding received optical signals. The first attenuator receives an optical signal emitted by a transmitter of a first transceiver and delivers the received optical signal to a receiver of a second transceiver. The second attenuator receives an optical signal emitted by a transmitter of the second transceiver and delivers the received optical signal to a receiver of the first transceiver. A method may include determining first and second optical attenuations for the first and second attenuators, respectively, and for at least one attenuator, arranging a first fiber optic cable having a first core size in series with a second fiber optic cable having a second core size to provide the determined corresponding optical attenuation.

Abstract: A floating heat sink device is provided that attaches to a cage in a floating configuration that enables the heat sink device to move, or “float”, as the parallel optical communications device secured to the cage moves relative to the cage. Because the heat sink device floats with movement of the parallel optical communications device, at least one surface of the parallel optical communications device maintains continuous contact with at least one surface of the heat sink device at all times. Ensuring that these surfaces are maintained in continuous contact at all times ensures that heat produced by the parallel optical communications device will be transferred into and absorbed by the floating heat sink device.

Abstract: A floating heat sink device is provided that attaches to a cage in a floating configuration that enables the heat sink device to move, or “float”, as the parallel optical communications device secured to the cage moves relative to the cage. Because the heat sink device floats with movement of the parallel optical communications device, at least one surface of the parallel optical communications device maintains continuous contact with at least one surface of the heat sink device at all times. Ensuring that these surfaces are maintained in continuous contact at all times ensures that heat produced by the parallel optical communications device will be transferred into and absorbed by the floating heat sink device.

Abstract: Wirebonds are formed to couple an opto-electronic device chip having two or more opto-electronic devices to a signal processing chip. Two or more mutually adjacent wirebond groups, each corresponding to one of the opto-electronic devices, are formed. For example, each wirebond group can include a first wirebond coupling a P-terminal of the opto-electronic device of the wirebond group to the signal processing chip, a second wirebond coupling an N-terminal of the opto-electronic device of the wirebond group to the signal processing chip, and a third wirebond coupling the opto-electronic device chip to the signal processing chip.

Abstract: Wirebonds are formed to couple an opto-electronic device chip having two or more opto-electronic devices to a signal processing chip. Two or more mutually adjacent wirebond groups, each corresponding to one of the opto-electronic devices, are formed. For example, each wirebond group can include a first wirebond coupling a P-terminal of the opto-electronic device of the wirebond group to the signal processing chip, a second wirebond coupling an N-terminal of the opto-electronic device of the wirebond group to the signal processing chip, and a third wirebond coupling the opto-electronic device chip to the signal processing chip.