Patents by Inventor Zurina Zukiffly

Zurina Zukiffly has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • HYPER THERMALLY ENHANCED SEMICONDUCTOR PACKAGE SYSTEM
    Publication number: 20060103008
    Abstract: A semiconductor package system is provided including mounting a semiconductor chip to a substrate having a substrate opening. A first heat slug is attached to a first surface of the semiconductor chip at least partially encapsulating the semiconductor chip. A second heat slug is attached to the second surface of the semiconductor chip through the substrate opening.
    Type: Application
    Filed: September 24, 2005
    Publication date: May 18, 2006
    Applicant: STATS CHIPPAC LTD.
    Inventors: You Yang Ong, Zurina Zukiffly, Saat Shukri Embong