Abstract: This application provides a printed circuit board. The printed circuit board includes a first outer conducting layer, a second outer conducting layer, and at least one insulation medium layer sandwiched between the first outer conducting layer and the second outer conducting layer. The printed circuit board includes a gold finger area and a soldering area. A total thickness of all conducting layers in the gold finger area is greater than that of all conducting layers in the soldering area. Because the total thickness of all conducting layers in the gold finger area is relatively thick, resistance of the gold finger area can be reduced, and a through-current capability of the gold finger area is improved. In addition, the total thickness of all conducting layers in the soldering area is relatively thin, so that a sufficient soldering temperature and a good soldering effect can be ensured.