Patents by Inventor Zvi Bendat
Zvi Bendat has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 6818543Abstract: The present invention provides a process and apparatus for mounting semiconductor components to substrates. More particularly, the apparatus includes a placing mechanism positioned on a support frame for placing the semiconductor components to the substrates. A reflow oven/furnace is integrated into the apparatus, thereby eliminating the need to transport the semiconductor components and substrates to an external furnace. Another feature of the present invention involves providing an improved vacuum substrate chuck array adapted for efficient application of suction to substrates carried thereby. Yet another feature of the invention involves a fluxless reflow process for inhibiting oxidation of eutectic solders provided on substrates.Type: GrantFiled: July 29, 2002Date of Patent: November 16, 2004Assignee: Lilogix, Inc.Inventors: Zvi Bendat, Henry Chou, Lionel Powell
-
Patent number: 6781775Abstract: An optical probe for use in accurately aligning the surfaces of microelectronic components that are to be joined together includes an optical device adapted to superimpose the images of a pair of components positioned on either side of the device. The optical device comprises an optical beam-splitter and plurality of prisms having mirror surfaces arranged so that the superposition of images takes place at the partially reflective interface within the beam-splitter. The resulting superimposed image of the die and substrate is displaced laterally from the microelectronic components so that the image is not projected onto either component.Type: GrantFiled: October 16, 2002Date of Patent: August 24, 2004Inventors: Zvi Bendat, Miroslaw Sokol
-
Publication number: 20040075918Abstract: An optical probe for use in accurately aligning the surfaces of microelectronic components that are to be joined together includes an optical device adapted to superimpose the images of a pair of components positioned on either side of the device. The optical device comprises an optical beam-splitter and plurality of prisms having mirror surfaces arranged so that the superposition of images takes place at the partially reflective interface within the beam-splitter. The resulting superimposed image of the die and substrate is displaced laterally from the microelectronic components so that the image is not projected onto either component.Type: ApplicationFiled: October 16, 2002Publication date: April 22, 2004Applicant: LILOGIX, INC.d/b/a RD AUTOMATIONInventors: Zvi Bendat, Miroslaw Sokol
-
Patent number: 6651866Abstract: The present invention relates to a new and improved device adapted for mounting semiconductor components to substrates. More particularly, the device includes a housing and a first member rotatably mounted to the housing. A first interface is formed between the first member and the housing. The device also has a second member mounted in the first member and movable in an axial direction relative to the first member between a first position and a second position. The second member has an engaging mechanism at an end thereof for engaging a semiconductor component. A second interface is formed between the first and second members. The device is also provided with a supplying mechanism for supplying pressurized air to the first and second interfaces so as to form a first air bearing at the first interface and a second air bearing at the second interface.Type: GrantFiled: October 17, 2001Date of Patent: November 25, 2003Assignee: Lilogix, Inc.Inventors: Zvi Bendat, Felix Zeigerman
-
Publication number: 20030075939Abstract: The present invention provides a process and apparatus for mounting semiconductor components to substrates. More particularly, the apparatus includes a placing mechanism positioned on a support frame for placing the semiconductor components to the substrates. A reflow oven/furnace is integrated into the apparatus, thereby eliminating the need to transport the semiconductor components and substrates to an external furnace. Another feature of the present invention involves providing an improved vacuum substrate chuck array adapted for efficient application of suction to substrates carried thereby. Yet another feature of the invention involves a fluxless reflow process for inhibiting oxidation of eutectic solders provided on substrates.Type: ApplicationFiled: July 29, 2002Publication date: April 24, 2003Applicant: LI LOGIX, INC., d/b/a RD AUTOMATIONInventors: Zvi Bendat, Henry Chou, Lionel Powell
-
Publication number: 20030071106Abstract: The present invention relates to a new and improved device adapted for mounting semiconductor components to substrates. More particularly, the device includes a housing and a first member rotatably mounted to the housing. A first interface is formed between the first member and the housing. The device also has a second member mounted in the first member. The second member is movable in an axial direction relative to the first member between a first position, in which the second member extends from the first member, and a second position, in which the second member is retracted from the first position. The second member has an engaging mechanism at an end thereof for engaging a semiconductor component when the second member is in its first position. A second interface is formed between the first and second members.Type: ApplicationFiled: October 17, 2001Publication date: April 17, 2003Inventors: Zvi Bendat, Felix Zeigerman
-
Patent number: 6474710Abstract: Mounting apparatus for electronic parts includes a mounting head and a suction-operated gripping mechanism for selectively gripping an object positioned adjacent one side of the gripping mechanism. A suction-operated attaching mechanism is also provided for selectively and removably attaching the gripping mechanism to the mounting head, whereby the gripping mechanism is removable from the mounting head and is hence replaceable. The mounting apparatus also has a viewing mechanism, including a camera, for viewing an object gripped by the gripping mechanism. The viewing mechanism is located on an opposite side of the gripping mechanism. The gripping mechanism has a light-transmitting portion positioned in such a manner that an object gripped by the gripping mechanism can be viewed by the camera through the gripping mechanism.Type: GrantFiled: January 11, 2002Date of Patent: November 5, 2002Assignee: Lilogix, Inc.Inventors: Zvi Bendat, Miroslaw Sokol
-
Publication number: 20020060464Abstract: Mounting apparatus for electronic parts includes a mounting head and a suction-operated gripping mechanism for selectively gripping an object positioned adjacent one side of the gripping mechanism. A suction-operated attaching mechanism is also provided for selectively and removably attaching the gripping mechanism to the mounting head, whereby the gripping mechanism is removable from the mounting head and is hence replaceable. The mounting apparatus also has a viewing mechanism, including a camera, for viewing an object gripped by the gripping mechanism. The viewing mechanism is located on an opposite side of the gripping mechanism. The gripping mechanism has a light-transmitting portion positioned in such a manner that an object gripped by the gripping mechanism can be viewed by the camera through the gripping mechanism.Type: ApplicationFiled: January 11, 2002Publication date: May 23, 2002Applicant: RD AUTOMATIONInventors: Zvi Bendat, Miroslaw Sokol
-
Patent number: 6203082Abstract: Mounting apparatus for electronic parts is disclosed. More particularly, the mounting apparatus includes a mounting head and a suction-operated gripping mechanism for selectively gripping an object positioned adjacent one side of the gripping mechanism. A suction-operated attaching mechanism is also provided for selectively and removably attaching the gripping mechanism to the mounting head, whereby the gripping mechanism is removable from the mounting head and is hence replaceable. The mounting apparatus also has a viewing mechanism, including a camera, for viewing an object gripped by the gripping mechanism. The viewing mechanism is located on an opposite side of the gripping mechanism. The gripping mechanism has a light-transmitting portion positioned in such a manner that an object gripped by the gripping mechanism can be viewed by the camera through the gripping mechanism.Type: GrantFiled: July 12, 1999Date of Patent: March 20, 2001Assignee: RD AutomationInventors: Zvi Bendat, Miroslaw Sokol
-
Patent number: 4899921Abstract: An aligner bonder for joining parts of a miniature semiconductor component, for example, comprises supports for holding the parts with surfaces facing, positioning provisions for adjusting relative positions and inclinations of the parts and for bringing the facing surfaces together for bonding. A first inclined two-sided mirror directs light from a pair of illuminators to the surfaces. Images of the surfaces are diverted from the inclined reflective mirror faces to optical paths and then to video cameras. Individual video circuitry and illuminator adjustments permit adjustment of each video image. The images are combined in a single video image displayed on a monitor. The supports for the parts are positionally adjusted to bring the video images into alignment. To adjust parallelism, autocollimators and associated reference image cross hairs project reference images via another inclined two-sided mirror to the surfaces of the parts or parallel reference surfaces.Type: GrantFiled: October 28, 1988Date of Patent: February 13, 1990Assignee: The American Optical CorporationInventors: Zvi Bendat, David A. Leggett