Patents by Inventor Zvika Cohen

Zvika Cohen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9731498
    Abstract: Apparatus to apply a fluid to a substrate, the apparatus includes a first roller to rotate about an axis and apply a fluid to a first side of the substrate. The first roller includes an outlet to provide gas to the substrate to guide the movement of the substrate subsequent to the application of fluid to the substrate.
    Type: Grant
    Filed: October 28, 2013
    Date of Patent: August 15, 2017
    Assignee: Hewlett-Packard Indigo B.V.
    Inventors: Alex Feygelman, Zvika Cohen, Mordechai Arenson, Ziv Yosef
  • Publication number: 20160271933
    Abstract: Apparatus to apply a fluid to a substrate, the apparatus includes a first roller to rotate about an axis and apply a fluid to a first side of the substrate. The first roller includes an outlet to provide gas to the substrate to guide the movement of the substrate subsequent to the application of fluid to the substrate.
    Type: Application
    Filed: October 28, 2013
    Publication date: September 22, 2016
    Applicant: Hewlett-Packard Indigo, B.V.
    Inventors: Alex FEYGELMAN, Zvika COHEN, Mordechai ARENSON, Ziv YOSEF
  • Patent number: 9440453
    Abstract: An embossing apparatus comprises an embossing die comprising a printed relief pattern, and a resilient surface for pressing media against the embossing die to emboss features corresponding to the printed relief pattern on the media, in which the printed relief pattern comprises a number of layers of a deposited material, and in which a number of layers of the deposited material closest to the top of the printed relief pattern comprises a deposited material with a relatively lower coefficient of adhesion than layers of the deposited material disposed under the deposited material closest to the top of the printed relief pattern. A printed relief pattern for embossing media comprises a number of preliminary layers, the preliminary layers comprising a first material, and a number of terminal layers, the terminal layers comprising a second material, in which the second material has a lower adhesive coefficient than the first material.
    Type: Grant
    Filed: February 25, 2015
    Date of Patent: September 13, 2016
    Assignee: Hewlett-Packard Indigo B.V.
    Inventors: Zvika Cohen, Eyal Peleg, Shahar Stein, Itzik Shaul
  • Patent number: 9244388
    Abstract: In an example, rollers are disclosed, wherein one of the rollers has a resilient outer layer, and one of the rollers comprises a coned portion.
    Type: Grant
    Filed: March 30, 2011
    Date of Patent: January 26, 2016
    Assignee: Hewlett-Packard Indigo B.V.
    Inventors: Shachar Berger, Zvika Cohen, Oran Levintant
  • Publication number: 20150174915
    Abstract: An embossing apparatus comprises an embossing die comprising a printed relief pattern, and a resilient surface for pressing media against the embossing die to emboss features corresponding to the printed relief pattern on the media, in which the printed relief pattern comprises a number of layers of a deposited material, and in which a number of layers of the deposited material closest to the top of the printed relief pattern comprises a deposited material with a relatively lower coefficient of adhesion than layers of the deposited material disposed under the deposited material closest to the top of the printed relief pattern. A printed relief pattern for embossing media comprises a number of preliminary layers, the preliminary layers comprising a first material, and a number of terminal layers, the terminal layers comprising a second material, in which the second material has a lower adhesive coefficient than the first material.
    Type: Application
    Filed: February 25, 2015
    Publication date: June 25, 2015
    Inventors: Zvika Cohen, Eyal Peleg, Shahar Stein, Itzik Shaul
  • Patent number: 9056520
    Abstract: An embossing apparatus comprises an embossing die comprising a printed relief pattern, and a resilient surface for pressing media against the embossing die to emboss features corresponding to the printed relief pattern on the media, in which the printed relief pattern comprises a number of layers of a deposited material, and in which a number of layers of the deposited material closest to the top of the printed relief pattern comprises a deposited material with a relatively lower coefficient of adhesion than layers of the deposited material disposed under the deposited material closest to the top of the printed relief pattern. A printed relief pattern for embossing media comprises a number of preliminary layers, the preliminary layers comprising a first material, and a number of terminal layers, the terminal layers comprising a second material, in which the second material has a lower adhesive coefficient than the first material.
    Type: Grant
    Filed: January 31, 2012
    Date of Patent: June 16, 2015
    Assignee: Hewlett-Packard Indigo B.V.
    Inventors: Zvika Cohen, Eyal Peleg, Shahar Stein, Itzik Shaul
  • Publication number: 20140023400
    Abstract: In an example, rollers are disclosed, wherein one of the rollers has a resilient outer layer, and one of the rollers comprises a coned portion.
    Type: Application
    Filed: March 30, 2011
    Publication date: January 23, 2014
    Inventors: Shachar Berger, Zvika Cohen, Oran Levintant
  • Publication number: 20130192479
    Abstract: An embossing apparatus comprises an embossing die comprising a printed relief pattern, and a resilient surface for pressing media against the embossing die to emboss features corresponding to the printed relief pattern on the media, in which the printed relief pattern comprises a number of layers of a deposited material, and in which a number of layers of the deposited material closest to the top of the printed relief pattern comprises a deposited material with a relatively lower coefficient of adhesion than layers of the deposited material disposed under the deposited material closest to the top of the printed relief pattern. A printed relief pattern for embossing media comprises a number of preliminary layers, the preliminary layers comprising a first material, and a number of terminal layers, the terminal layers comprising a second material, in which the second material has a lower adhesive coefficient than the first material.
    Type: Application
    Filed: January 31, 2012
    Publication date: August 1, 2013
    Inventors: Zvika Cohen, Eyal Peleg, Shahar Stein, Itzik Shaul
  • Patent number: 8224210
    Abstract: In one embodiment, an image developer includes a developer roller rotatable along a photoconductor for presenting a layer of ink to the photoconductor and a cleaner for cleaning ink from the developer roller. The cleaner includes a first cleaning roller rotatable along the developer roller for removing ink from the developer roller and a second cleaning roller rotatable against the first cleaning roller for mechanically removing ink from the first cleaning roller. In one embodiment, the second cleaning roller deforms against the first cleaning roller such that the cross-sectional length of contact between the first and second cleaning rollers is in the range of 20% to 38% of the circumference of the first cleaning roller. In one embodiment, the second cleaning roller has a density in the range of 90 kg/m3 to 150 kg/m3.
    Type: Grant
    Filed: April 8, 2010
    Date of Patent: July 17, 2012
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Oran Levintant, Shachar Berger, Forest Patton, John W. Godden, Christian Schmid, Amir Ofir, Zvika Cohen
  • Publication number: 20110249989
    Abstract: In one embodiment, an image developer includes a developer roller rotatable along a photoconductor for presenting a layer of ink to the photoconductor and a cleaner for cleaning ink from the developer roller. The cleaner includes a first cleaning roller rotatable along the developer roller for removing ink from the developer roller and a second cleaning roller rotatable against the first cleaning roller for mechanically removing ink from the first cleaning roller. In one embodiment, the second cleaning roller deforms against the first cleaning roller such that the cross-sectional length of contact between the first and second cleaning rollers is in the range of 20% to 38% of the circumference of the first cleaning roller. In one embodiment, the second cleaning roller has a density in the range of 90 kg/m3 to 150 kg/m3.
    Type: Application
    Filed: April 8, 2010
    Publication date: October 13, 2011
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Oran Levintant, Shachar Berger, Forest Patton, John W. Godden, Christian Schmid, Amir Ofir, Zvika Cohen