IC package discharge apparatus

An IC package discharge apparatus is constructed to include a machine base, the machine base having pitch-adjustable IC package carrier tube passages arrange din parallel for receiving IC package carrier tubes, a vibrator controlled to oscillate the machine base, a set of contact switches respectively installed in the IC package carrier tube passages and adapted to shut down the vibrator after removal of IC package carrier tubes from the IC package carrier tube passages, and a set of sensors respectively installed in the IC package carrier tube passages and adapted to count the number of IC packages passed into the IC package carrier tubes in the IC package carrier tube passages and to shut down the vibrator when every sensor counted up to a predetermined number.

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Description
FIELD OF THE INVENTION

[0001] The present invention relates to a material discharge apparatus and, more specifically, to an IC package discharge apparatus for use in an IC package foundry for arranging examined IC packages in good order for further processing.

BACKGROUND OF THE INVENTION

[0002] During the fabrication of IC packages, the fabricated IC packages must be carried to an examination station and examined. Only qualified IC packages can be picked up and packed for sale or use. After examination, mechanical arms are operated to pick up qualified IC packages from the examination station to an IC package discharge apparatus, which automatically arranges loaded IC packages in good order into IC package carrier tubes for further packing. Conventional IC package discharge apparatus for this purpose commonly use a vibrator to force IC packages out of a collecting trough into IC package passages. However conventional IC package discharge apparatus are still not satisfactory in function. One drawback of conventional IC package discharge apparatus is their bulky size that requires much installation space. Another drawback of conventional IC package discharge apparatus is their low operational efficiency. During operation, the operator must manually control the vibrator.

SUMMARY OF THE INVENTION

[0003] It is one object of the present invention to provide an IC package discharge apparatus, which is compact and requires less installation space.

[0004] It is another object of the present invention to provide an IC package discharge apparatus, which smoothly loads qualified IC packages into IC package carrier tubes, and stops the loading operation of IC packages into IC package carrier tubes when all IC package carrier tubes are filled up with qualified IC package.

[0005] To achieve these objects of the present invention, the IC package discharge apparatus comprises a machine base, said machine base comprising a plurality of IC package carrier tube passages extended in longitudinal direction and arranged in parallel, and a plurality of IC package passages extended in longitudinal direction in line with said IC package carrier tube passages respectively at a rear side for the loading of IC packages and disposed at a higher elevation than said IC package carrier tube passages; a vibrator controlled to oscillate the machine base back and forth in longitudinal direction; a plurality of contact switches respectively mounted in the IC package carrier tube passages and electrically connected to the vibrator, the contact switches each comprising a switching lever suspended in one of the IC package carrier tube passages and moved between a first position where the switching lever receives no pressure and the vibrator is off, and a second position where the switching lever is pressed by an IC package carrier tube and the vibrator is on; and a plurality of sensors respectively mounted in the IC package carrier tube passages and electrically connected to the vibrator and adapted to detect movement of IC packages through respective IC package carrier tubes loaded in the IC package carrier tube passages, to count the number of IC packages passing through respective IC package carrier tubes loaded in the IC package carrier tube passages, and to stop the vibrator from oscillating the machine base when all of the sensors counted up to a predetermined number.

BRIEF DESCRIPTION OF THE DRAWINGS

[0006] FIG. 1 is a perspective view of an IC package discharge apparatus according to a preferred embodiment of the present invention.

[0007] FIG. 2 is a top view of the IC package discharge apparatus according to the preferred embodiment of the present invention.

[0008] FIG. 3 is a right side view of the IC package discharge apparatus according to the preferred embodiment of the present invention.

[0009] FIG. 4 is a front view of the IC package discharge apparatus according to the preferred embodiment of the present invention.

[0010] FIG. 5 is a rear side view of the IC package discharge apparatus according to the preferred embodiment of the present invention.

[0011] FIG. 6 is a schematic drawing showing the structure of the rear half of the IC package discharge apparatus according to the preferred embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

[0012] Referring to FIGS. from 1 through 6, an IC package discharge apparatus in accordance with a preferred embodiment of the present invention is shown comprised of a machine base 10, a vibrator 20, a plurality of contact switches 30, a plurality of sensors 40, and an auxiliary rack 50.

[0013] The machine base 10 comprises a plurality of fixed rails 11, a first movable device 12, a first lock 123, a second movable device 14, a second lock 143, a third movable device 15, a third lock 154, and a top plate 17. The fixed rails 11 are longitudinally fixedly mounted on the top near the rear side and arranged in parallel at an equal pitch. The first movable device 12 comprises a narrow elongated transverse base strip 121 horizontally slidably inserted through a respective transverse through hole (not shown) on each fixed rail 11, and a plurality of longitudinal ribs 122 respectively protruded from the top of the transverse base strip 121 and alternatively spaced from one another by the fixed rails 11. The fixed rails 11 define with the longitudinal ribs 122 a plurality of IC package passages 13 extended in longitudinal direction and arranged in parallel. By means of moving the first movable device 12 relative to the fixed rails 11, the pitch of the IC package passages 13 is relatively adjusted. The first lock 123 is installed in one end, namely, the right side of the first movable device 12 for locking the first movable device 12. The second movable device 14 is mounted on two sliding blocks at a transverse sliding track (not shown) on the top of the machine base 10 in front of the fixed rails 11 and the transverse base strip 121 for horizontal movement in transverse direction, comprising a narrow elongated transverse base strip 141 and a plurality of longitudinal teeth 142 perpendicularly forwardly extended from the transverse base strip 141 and arranged in parallel corresponding to the fixed rails 11. The second lock 143 is installed in one end, namely, the right side of the second movable device 14 for locking the second movable device 14. The third movable device 15 is mounted on another two sliding blocks at the aforesaid transverse sliding track for horizontal movement in transverse direction, comprising a transverse base strip 151 disposed in front of the transverse base strip 141 of the second movable device 14 at an equal elevation, a plurality of longitudinal teeth 152 perpendicularly backwardly extended from the transverse base strip 151 and alternatively spaced from one another by the longitudinal teeth 142 of the second movable device 14, and a plurality of bearing rods 153 perpendicularly backwardly extended from the transverse base strip 151 and respectively formed integral with the teeth 152 at the right side. The bearing rods 153 and the transverse base strip 151 are disposed in a flush manner. The teeth 142 of the second movable device 14 define with the teeth 152 of the third movable device 15 a plurality of IC package carrier tube passages 16 extended in longitudinal direction and arranged in parallel, i.e., one tooth 142 of the second movable device 14 define with one tooth 152 of the third movable device 15 an IC package carrier tube passage 16. When moving the second movable device 14 or the third movable device 15 horizontally in transverse direction, the pith of the IC package carrier tube passages 16 is relatively changed. The teeth 142 and 152 each have a beveled side edge extended to the respective front end such that each IC package carrier tube passage 60 has a tapered front end expanding forwards (see FIG. 2). IC package carrier tubes 60 are respectively inserted into the IC package carrier tube passages 16 from the rear side toward the front side. The bottom of the IC package carrier tube passages 16 (i.e., the top of the bearing rods 153) is lower than the bottom of the IC package passages 13, and the elevational difference between the bottom of each IC package carrier tube passage 16 and the bottom of the IC package passages 13 is approximately equal to the wall thickness of the IC package carrier tubes 60. The third lock 154 is installed in the left side of the third movable device 15 for locking the third movable device 15. The top plate 17 is transversely mounted on the machine base 10 over the second movable device 14 and the third movable device 15.

[0014] The vibrator 20 is provided at the bottom side of the machine base 10, and controlled to oscillate the machine base 10 alternatively forwards and backwards (because the structure and function of the vibrator 20 are of the known art not within the scope of the present invention, no further detailed description is necessary).

[0015] The contact switches 30, as shown in FIG. 6, are mounted in the machine base 10 at a bottom side corresponding to the IC package carrier tube passages 16, and electrically connected to the vibrator 20. Each contact switch 30 comprises a lever 31 extending upwards into one IC package carrier tube passage 16, and a roller 32 pivoted to the free end of the lever 31. Normally, the lever 31 receives no pressure and, is disposed in vertical, namely, the first position (see the real line shown in FIG. 6). When an IC package carrier tube 60 inserted into one IC package carrier tube passage 16, the lever 31 is forced backwards and turned to a tilted position, namely, the second position (see the imaginary line shown in FIG. 6). When the lever 31 of the contact switch 30 moved the first position, it means that the corresponding IC package carrier tube passage 16 does not have an IC package carrier tube 60 inserted therein. One the contrary, when the lever 31 moved to the second position, it means that the corresponding IC package carrier tube passage 16 has an IC package carrier tube 60 inserted therein. When one contact switch 30 detected the corresponding IC package carrier tube passage 16 without an IC package carrier tube 60, the contact switch 30 immediately provides a particular signal to the vibrator 20, stopping the vibrator 20 from vibrating the machine base 10.

[0016] The sensors 40 are respectively mounted in the IC package carrier tube passages 16 within the machine base 10, each comprised of an infrared emitter 41 and an infrared receiver 42. As shown in FIG. 6, the infrared emitter 41 is provided in the middle of the bottom of one IC package carrier tube passage 16 and controlled to emit infrared light upwards, and the receiver 42 is suspended above the corresponding IC package carrier tube passage 16, for example, installed in the top plate 17 corresponding to the infrared emitter 41 and electrically connected to the vibrator 20. When IC packages 70 passed through the spaces between the infrared emitters 41 and infrared receivers 42 of the sensors 40, the infrared light from the infrared emitters 41 are blocked (the aforesaid IC package carrier tubes 60 are made of transparent plastics that admits light), thereby causing the sensors 40 to start a respective counting circuit (not shown). When all counting circuits respectively counted up to a predetermined number, it means that all IC package passage tubes 60 have been filled up with a predetermined number of IC packages, and at this time the sensors 40 provide a signal to stop the vibrator 20 from vibrating the machine base 10.

[0017] The auxiliary rack 50 comprises two sector-like sideboards 51 bilaterally forwardly extended from the front side of the machine base 10 and arranged in parallel, each having a plurality of through holes 52 disposed at different elevations along the arch thereof, and a transverse rod 53 selectively connected between the through holes 52 of the sector-like sideboards 51 at the desired elevation.

[0018] The above statement describes the structural features of the IC package discharge apparatus. Normally, the second movable device 14 is adjusted to the position shown in FIGS. 1 and 2 and then locked, keeping the longitudinal teeth 142 aimed at the fixed rails 11 respectively. More specifically speaking, the left side of each longitudinal tooth 142 is biased to the right side in comparison with the left side of the corresponding fixed rail 11 (i.e., the right side of the IC package carrier tube passage 16 is biased to the right side in comparison with the right side of the corresponding IC package passage 13), and the difference therebetween is approximately equal to the wall thickness of the IC package carrier tubes 60. Before use, the positions of the first movable device 12 and the third movable device 15 are adjusted to adjust the pitch of the IC package passages 13 and the pitch of the IC package carrier tube passages 16 subject to the width of the IC packages 70 to be packed and the width of the IC package carrier tubes 60 to be used (remark: the left side of each IC package carrier tube 16 is biased to the left in comparison with the left side of the corresponding IC package passage, and the difference therebetween is approximately equal to the wall thickness of the IC package carrier tubes 60. When in use, IC package carrier tubes 60 are longitudinally mounted in the IC package discharge apparatus and stopped at the front side edge of the transverse base strip 121 of the first movable device 12 with the rear halves of the loaded IC package carrier tubes 60 respectively inserted into the IC package carrier tube passages 16 and retained in place by the longitudinal teeth 142;152 and the front halves of the loaded IC package carrier tubes 60 passed under and peripherally disposed in contact with the transverse rod 53 (the elevation of the transverse rod 53 is adjustable).

[0019] During operation, qualified IC packages are transferred from the examination station of the production line to the IC package passages 13 of the IC package discharge apparatus by mechanical arms, and the vibrator 20 is driven to oscillate the machine base 10 obliquely alternatively back and forth; thereby causing loaded IC packages 70 to be forced forwards and moved into the IC package carrier tubes 60. The bottom sides of the IC package passages 13 is slightly higher than the bottom sides of the IC package carrier tube passages 16, and the elevational difference is approximately equal to the wall thickness of the IC package carrier tubes 60, so that the wall thickness of the IC package carrier tubes 60 does not hinder forward movement of the loaded IC packages 70 from the IC package passages 13 to the inside of the IC package carrier tubes 60.

[0020] When all the installed IC package carrier tubes 60 are filled up with IC packages 70, the sensors 70 stop the vibrator 20 (the mechanical arms are stopped at the same time). At this time, the operator can remove the IC package carrier tubes 60 with the loaded IC packages 70, and then insert hollow IC package carrier tubes 60 into the IC package carrier tube passages 16 again. When all IC package delivery passages 16 are respectively inserted with a respective IC package carrier tube 60, the contact switches 30 immediately drive the vibrator 20 to oscillate the machine base 10 again (at the same time the mechanical arms are started to transfer IC packages from the examination station of the production line to the IC package passages of the IC package discharge apparatus).

[0021] As indicated above, the IC package discharge apparatus of the present invention smoothly loads qualified IC packages into IC package carrier tubes and stops the loading operation of IC packages into IC package carrier tubes when all IC package carrier tubes are filled up with qualified IC packages, and forces qualified IC packages forwards again upon loading of new empty IC package carrier tubes. Therefore, the invention greatly improves the working efficiency in packing qualified IC packages. Further, the IC package discharge apparatus is compact, which requires less installation space.

Claims

1. An IC package discharge apparatus comprising:

a machine base, said machine base comprising a plurality of IC package carrier tube passages extended in longitudinal direction and arranged in parallel, and a plurality of IC package passages extended in longitudinal direction in line with said IC package carrier tube passages respectively at a rear side for the loading of IC packages and disposed at a higher elevation than said IC package carrier tube passages;
a vibrator controlled to oscillate said machine base back and forth in longitudinal direction;
a plurality of contact switches respectively mounted in said IC package carrier tube passages and electrically connected to said vibrator, said contact switches each comprising a switching lever suspended in one of said IC package carrier tube passages and moved between a first position where said switching lever receives no pressure and said vibrator is off, and a second position where said switching lever is pressed by an IC package carrier tube and said vibrator is on; and
a plurality of sensors respectively mounted in said IC package carrier tube passages and electrically connected to said vibrator and adapted to detect movement of IC packages through respective IC package carrier tubes loaded in said IC package carrier tube passages, to count the number of IC packages passing through respective IC package carrier tubes loaded in said IC package carrier tube passages, and to stop said vibrator from oscillating said machine base when all of said sensors counted up to a predetermined number.

2. The IC package discharge apparatus as claimed in claim 1, wherein said contact switches are respectively mounted in said IC package carrier tube passages at a bottom side, and the switching levers of said contact switches each having a free end pivoted with a roller suspended in said IC package carrier tube passages, the switching levers of said contact switches being disposed in vertical when in the first position, the switching levers of said contact switches being tilted in direction toward rear ends of said IC package carrier tube passages when in the second position.

3. The IC package discharge apparatus as claimed in claim 1, wherein said sensors each are comprised of an infrared emitter and an infrared receiver respectively installed in said IC package carrier tube passages at two sides.

4. The IC package discharge apparatus as claimed in claim 1, wherein said machine base comprises a plurality of fixed rods longitudinally fixedly mounted on a top side thereof and arranged in parallel, and a plurality of longitudinal ribs connected in parallel and respectively inserted in between said fixed rods and defining with said fixed rods said IC package carrier tube passages and synchronously transversely movable relative to said fixed rods to adjust the pitch of said IC package carrier tube passages.

5. The IC package discharge apparatus as claimed in claimed 1, wherein said machine base comprises a plurality of fixed longitudinal rod members and a plurality of movable longitudinal rod members alternatively arranged on a top side thereof, said movable longitudinal rod members defining with said fixed longitudinal rod members said IC package passages, said movable longitudinal rod members being connected in parallel and synchronously transversely movable relative to said fixed longitudinal rod members to adjust the pitch of said IC package passages.

Patent History
Publication number: 20030150869
Type: Application
Filed: May 3, 2002
Publication Date: Aug 14, 2003
Applicant: CHI YHEI TECH INTERNATIONAL CO., LTD. (Tai Ping City)
Inventor: Chien-Wen Lee (Taichung)
Application Number: 10137334
Classifications
Current U.S. Class: Replacement Source Or Stack Movement Relative To Discharge Means (221/104)
International Classification: B65H003/00;