Forming tool for forming a contoured microelectronic spring mold
A forming tool with one or more embossing tooth, and preferably, a plurality of such embossing teeth, arranged on a substantially planar substrate, is disclosed. Each embossing tooth is configured for forming a sacrificial layer to provide a contoured surface for forming a microelectronic spring structure. Each embossing tooth has a protruding area corresponding to a base of a microelectronic spring, and a sloped portion corresponding to a beam contour of a microelectronic spring. Numerous methods for making a forming tool are also disclosed. The methods include a material removal method, a molding method, a repetitive-stamping method, tang-bending methods, and segment-assembly methods.
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This application is a continuation-in-part of co-pending U.S. patent application Ser. No. filed Feb. 12, 2001, entitled “METHOD FOR FORMING MICROELECTRONIC SPRING STRUCTURES ON A SUBSTRATE,” by Eldridge and Wenzel (Serial No. not yet assigned), which is a continuation-in-part of co-pending U.S. patent application Ser. No. 09/710,539, filed Nov. 9, 2000, entitled “LITHOGRAPHIC SCALE MICROELECTRONIC SPRING STRUCTURES WITH IMPROVED CONTOURS,” by Eldridge and Wenzel, which is a continuation-in-part of co-pending application Ser. No. 09/364,788, filed Jul. 30, 1999, entitled “INTERCONNECT ASSEMBLIES AND METHODS,” by Eldridge and Mathieu, which applications are incorporated herein, in their entirety, by reference, and which are collectively referred to herein as the “parent applications.”
BACKGROUND OF THE INVENTION1. Field of the Invention
The present invention relates to tools for making electrical contact elements for electrical devices, and more particularly to forming tools for forming moldable substrates for making lithographic-scale, microelectronic spring contacts.
2. Description of Related Art
Molding, embossing, and like forming techniques have not previously been required or used in the field of semiconductor device manufacture, microelectronic spring contact manufacture, or any related area of micro-electrical-mechanical (“MEM”) device manufacturing. However, new methods for forming microelectronic spring structures, as described for the first time in the parent applications referenced above, utilize a mold for a microelectronic spring structure which is contoured in a direction perpendicular to the underlying substrate. In many embodiments, the mold is formed by impressing a layer of sacrificial material with a forming tool. These new methods are well suited for making numerous microelectronic, very fine pitch spring structures in parallel, lithographic mass production processes that are readily repeatable and reproducible. After the formable sacrificial substrate is formed into a suitable mold, resilient spring material is deposited in the mold and patterned. Thus, the new methods are capable of making spring structures having various defined three-dimensional contoured shapes for providing improved spring characteristics, such as improved strength, stiffness, resistance to stress concentration cracking, and elastic range. However, to efficiently form the sacrificial substrate into the desired shape, a suitable forming tool (sometimes called a stamping tool) is needed. Given the complete lack of such tools in any related field of art, suitable tools are not currently known, nor are methods for making suitable tools. A need therefore exists for a forming tool for forming a sacrificial substrate used in the manufacture of microelectronic springs, and for a method of making such a forming tool.
SUMMARY OF THE INVENTIONThe present invention provides a forming tool suitable for forming a sacrificial substrate, which may in turn be used for forming microelectronic spring structures. The present invention further provides methods for making such a forming tool.
A forming tool according the present invention is provided with one or more embossing tooth, and preferably, a plurality of such embossing teeth, arranged on a substantially planar substrate. Each embossing tooth is configured for forming a sacrificial layer to provide a contoured surface in the shape of a desired spring structure. Spring structures of the defined contoured shape may then be formed by deposition of a suitable resilient material on a sacrificial layer that has been embossed using the forming tool. Thus, a sacrificial layer may be prepared for formation of a plurality of spring structures in parallel using a forming tool with a plurality of embossing teeth.
The forming tools with contoured embossing teeth according to the present invention are suitable for forming sacrificial substrates for making springs with numerous performance improvements. For example, forming tools according to the present invention may be used to readily form spring structures having a U-shaped cross-section, a V-shaped cross-section, and/or a rib running along a length of the spring. These contoured shapes, and the advantages provided thereby, are described in the co-pending application, Ser. No. 09/710,539, referenced above.
Various methods for making a forming tool according to the present invention are provided. In one embodiment, a relatively hard substrate is selected and the embossing teeth are defined by selective removal of material from the substrate. Various methods may be used to selectively remove material, including laser ablation, mechanical milling using a precision diamond saw, and gray-scale lithography using photo-patternable glass. The hard substrate with embossing teeth may be used directly as an embossing tool.
Alternatively, the hard substrate may be used to form a reusable mold for producing a plurality of identical forming tools, thereby reducing costs associated with selective material removal. In this embodiment, the hard substrate is used to form shaped impressions corresponding to the embossing teeth in a moldable layer. A layer of tool material is then deposited in the molded layer. The tool material may be a relatively hard material such as a nickel or nickel alloy, a relatively soft material such as an organic polymer, or a UV transparent material such as S-8. The molded layer is then removed from the layer of tool material to produce the forming tool. In some embodiments, the molded layer may be reused to mold another forming tool. Alternatively, the molded layer is destroyed after each use.
In another embodiment, a method for making a forming tool using the properties of a liquid meniscus is provided. First, a layer of material is formed over a substrate. Then, a recess is developed in the material, and liquid is provided in the recess to form a meniscus. The liquid is cured or hardened to stabilize the contoured shape of the meniscus. The stabilized meniscus is then used to mold an embossing tooth of a forming tool, as described above. A spring structure deposited on a sacrificial substrate that has been formed with the embossing tooth will take on the shape of the liquid meniscus.
In another embodiment of a method for making a forming tool, a thin metal sheet is etched to define a plurality of cantilevered metal tangs having the projected shape of the desired spring structures in plan view. The sheet is adhered to a planar substrate and a free tip of each tang is uniformly deflected away from the substrate using a precisely positioned spacer. A stabilizing fill material is then used to hold the thin sheet in place with the tangs in their deflected position, and the substrate is removed. The fill material is selectively removed to define embossing teeth for a forming tool. Removal of fill material underneath the tangs yields a stabilized sheet that may be used directly as a forming tool, or as a plug for making a forming tool mold. Alternatively, removal of fill material above the tangs yields a mold that may be used to form a forming tool as described above.
In another embodiment of a method for making a forming tool, thin metal tangs of bimetallic or other pre-stressed material are deposited on a substrate using a lithographic process, in the desired spring shape. Each tang is adhered to the substrate at one end. Application of heat or other method is used to create a stress gradient across the thickness of the tang, causing the tangs to bend away from the substrate at their free ends, defining contoured spring shapes. A stabilizing fill material is applied to stabilize the tangs in their contoured shape. The fill material is selectively removed to define a forming tool, or a mold for a forming tool, as previously described.
In another embodiment of a method for making a forming tool, an embossing tooth is fabricated from a UV transparent material, preferably by a lithographic process. The tooth is freed from the surrounding material and attached to a UV transparent material, such as the end of a light guide. The tooth is then used to mold contoured surfaces in a layer of UV curable material on a substrate. After each contoured surface is molded, it is cured by exposure to UV light. After a desired number of contoured surfaces have molded and cured, the uncured portions of the layer of UV curable material are removed from the substrate. The resulting substrate with cured contoured surfaces is then used to mold a forming tool, as previously described.
In another embodiment of a method for making a forming tool, thin plates or layers of material are patterned in the shape of cross-sections of a forming tool. The material may be a metal, a UV transparent material such as SU-8, or any other patternable material of sufficient strength. The patterning may be done by a precision machining method such as laser ablation, or by a photo-lithographic and etching process. The layers or plates are stacked in the desired sequence and fastened together to form a section of a forming tool. Additional sections may similarly be assembled together to form a forming tool, or plug mold for making a forming tool, as previously described.
A more complete understanding of the forming tool and method for making the same will be afforded to those skilled in the art, as well as a realization of additional advantages and objects thereof, by a consideration of the following detailed description of the preferred embodiment. Reference will be made to the appended sheets of drawings which will first be described briefly.
BRIEF DESCRIPTION OF THE DRAWINGS
The present invention satisfies the need for a forming tool for forming microelectronic spring molds, and methods for making such a forming tool. In the detailed description that follows, like element numerals are used to describe like elements illustrated in one or more figures.
An exemplary chip-level forming tool 100 is shown in
Base 102 comprises an embossing face 104 on which a contoured embossing surface 110, comprising at least one embossing tooth 112, is disposed. In an embodiment of the invention, a plurality of embossing teeth 106 are disposed on embossing face 104, as shown in
Although embossing face 104 is shown as being substantially planar underneath teeth 106, face 104 may be provided with non-planar features adjacent to teeth 106, so long as any such non-planar features do not interfere with the molding function of teeth 106. For example, embossing face 104 may be provided with recesses, streets, or through holes (not shown) interspersed between individual ones of teeth 106, for receiving excess mold material, i.e., flash, when tool 100 is impressed into a layer of such material. For further example, embossing surface 110 may be provided with protruding tooling stops or raised seals (not shown) adjacent to a periphery of the embossing face 104. Such auxiliary features, whether recessed or protruding, may be used to enhance the molding function of tool 100, but do not alter the essential function of embossing face 104 and embossing surface 110 thereon, which is to form a mold for one or more freestanding resilient microelectronic springs. Base 102 is optionally mounted to a support substrate 108 for assembly into a multi-faceted forming tool assembly, or for mounting to a stamping jig or stamping equipment.
In some embodiments of the invention, base 102 and embossing face 104 may be contoured to conform to a curved surface, such as a cylindrically curved surface. For example, base 102 may comprise a relatively thin flexible material that can be mounted to the curved surface of a cylindrical roller. In the alternative, base 102 may comprise a cylindrical roller upon which the embossing face 104 and embossing surface 110 are formed, for example, by adapting a selected one of the techniques described herein. A forming tool having an embossing face 104 that conforms to a cylindrically curved surface is particularly useful for rolling over the surface of a moldable surface. Depending on the characteristics of the molding substrate, desired shape of the mold, available manufacturing equipment, and so forth, a continuous rolling molding operation may offer advantages as compared to a sequential, reciprocating-type stamping operation. It should further be apparent that the details, features and methods described herein are, in general, equally applicable to forming tools with curved bases and embossing faces, or may readily be adapted thereto by one of ordinary skill in the art.
In some embodiments of the invention, the forming tool 100 is provided with means for controlling its temperature. For example, the base 102 may be provided with at least one channel for containing a thermal control fluid, having an inlet port and an outlet port for flow of the thermal control fluid. Various thermal control fluids may be used, such as, for example, various commercially available refrigerants for applications wherein the tool is to be cooled, or heat transfer oils for applications wherein the tool is to be heated. In the alternative, the base 102 may comprise a relatively high thermal mass of material that is maintained in a temperature controlled environment, such as in a bath of temperature-controlled fluid, between applications. Yet other alternatives for heating include electrical resistive heaters embedded in, or attached to, forming tool 100. It should be appreciated that, for some applications, it is particularly useful to maintain the forming tool at a lower-than-ambient temperature. For example, a cooled forming tool may facilitate higher throughput in applications where the molded substrate is cooled for purposes of stabilizing or hardening the substrate. For still other applications, it may be desirable to vary the temperature of the forming tool during the forming process. For example, a tool may be heated to soften the moldable substrate, and then cooled after the desired features are molded, to facilitate hardening of the moldable substrate and/or removal of the tool. For such applications, it may be desirable to provide a tool having a relatively low thermal mass for more rapid cycle times.
Details of forming tool 100 are shown in
In a typical embodiment of the invention, each protruding area 114 is substantially planar, comprises a maximally protruding portion of each tooth 112, and is aligned in the same plane as adjacent protruding areas 114 of adjacent teeth 106, as shown in
Various exemplary configurations for molding teeth are described in the specification that follows. It should be appreciated that the invention is not limited to the particular shapes disclosed herein, and encompasses any molding tool for forming a mold for a resilient freestanding microelectronic spring. In addition, the invention encompasses forming tools having teeth with various different shapes, as well as tools having only identical teeth on the embossing surface. It should further be appreciated that a forming tool may be configured to function as one of two or more forming tools for successive application to a molding substrate, without departing from the scope of the invention.
Chip-level forming tools, such as shown in
The molding surfaces (comprising protruding area 114 and sloped portion 116) of an embossing tooth do not necessarily protrude from the embossing face 104 of forming tool 100. That is, a portion or all of the molding surfaces may be disposed at, or recessed below, the embossing face 104, as shown in
In an embodiment of the invention, a single molding tooth is configured to form a mold that may be used to form a plurality of similar microelectronic spring structures at the same time. An exemplary tooth for plural structures according to this embodiment is shown in
In an alternative embodiment, the embossing teeth are elongated in height, that is, protrude from the base 102 of the forming tool a greater distance than necessary for embossing purposes.
An exemplary temperature response of a tooth 201 of tool 200 is shown in
An alternative means for decreasing the thermal response time of tool 200 comprises making the entire forming tool, including base 102, with a low thermal mass. An exemplary thermally responsive tool may be configured as shown in
Further views of exemplary embossing teeth for use with a forming tool according to the invention, and various exemplary shapes of embossing teeth, are shown in
A cross-sectional view across the width of an embossing tooth 112, taken in the direction indicated by arrows 2B in
Embossing teeth may be shaped differently to form spring structures having various shapes in plan view, as exemplified by the shapes shown in
More exotic shapes may be desirable for some applications. For example, useful shapes may be selected from a trapezoid, a U-shape, a C-shape, a J-shape, a spiral, a square wave, or a sinusoid.
Embossing teeth that are contoured in the z-direction, that is, in a direction perpendicular to embossing face 104, are an important aspect of the invention. Examples of z-contouring are provided by the contour of sloped portion 116, such as is visible in
Various exemplary methods for making a forming tool are disclosed herein, and it should be apparent that the choice of a preferred method will depend on factors such as the type of manufacturing equipment available, the characteristics of the molding materials, cost and time constraints, the desired properties of the springs, and so forth, that will vary depending on the circumstances. In some circumstances, two or more methods may be equally preferable. Additionally, some of the selected steps of the exemplary methods may be combined in various ways, and optional steps may be omitted, depending on these and similar variable factors.
Generally, the methods disclosed herein for forming forming tools are subject to a lower limit on feature size of about 0.1 micron. While there is no clearly defined upper limit on feature size, above a certain feature size, for example, features that require forming the sacrificial layer 30 to depths of greater than about 10,000 microns (about 1 cm or 400 mils, corresponding to an embossing tooth height of about 400 mils), prior art fabrication methods for sheet metal springs, such as sheet metal stamping, are likely to be more economically feasible. However, prior art methods are limited in their capability for cost-effectively making stampings tools for very closely spaced springs, i.e., springs disposed at a pitch of less than about 50 mils, which is preferable for many semiconductor applications. The methods disclosed herein are particularly preferred for making forming tools smaller than those that can be effectively manufactured using prior art methods, and more particularly towards the lower limits on feature size (i.e., a pitch of between about 5 to 50 mils and an embossing tooth height of less than about 100 mils). If desired, the forming tools can be made at essentially the same scale and pitch as typical contact pads of semiconductor devices. To reliably and cost-effectively fabricate contoured embossing surfaces of forming tools at this small scale, novel manufacturing methods are required, as disclosed herein.
Material Removal (Sculpting) MethodVarious computer controlled, precision cutting and machining tools are currently available that may be used to define the embossing surface of a forming tool according to the invention by removal of material from a substrate. For example, the embossing surface 110 of forming tool 100 may be formed from a relatively hard material using a computer-controlled, ultraviolet (“UV”) laser-ablation process, using an excimer laser, or a pulsed NdYag laser such as are available from Lambda Physik, Inc., located in Fort Lauderdale, Fla., or from Heidelberg Instruments Mikrotechnik GmbH, located in Heidelberg, Germany. In the alternative, a laser microchemical process, also called laser-assisted etching, available from Revise, Inc. located in Burlington, Mass., may be used to form the forming tool. Yet another alternative is to use a gray-scale photolithography mask, such as available from Canyon Materials, Inc., of San Diego, Calif., to form a pattern with a surface profile in a photopatternable glass or a layer of photoresist (which may be used as a mold for the forming tool). For further example, an EDM (electro-discharge machining) method may be used to form features on a forming tool. All of the foregoing methods for forming a forming tool are capable of defining features with submicron resolution, and thus may be used for forming spring structures with molded features to about 0.1 micron in size. For example, a spring structure with a cantilevered beam portion as narrow as about 0.1 microns may be made using one of the sculpting methods described above.
However, each of the foregoing sculpting techniques tends to be relatively slow and/or to require expensive manufacturing equipment. An alternative material method uses a rotating cutting tool, such as a precision diamond saw or grinding wheel. Views of a tool material substrate during steps of a material-removal method 500 using a cutting tool are shown in
At step 506, a series of parallel cuts are made in surface 202 of tool material 101, by repeated lowering the selected cutting tool (e.g., saw 204 or grinding wheel 206) into the material 101, advancing the tool in a defined direction, raising the tool, and repositioning the tool for another cut. A cross sectional view of exemplary cuts is shown in
At step 508, an appropriate cutting tool is selected and the direction of the tool path is rotated to intersect, such as at right angles, the tool path which defined the elongated teeth in step 506, thereby defining rectangular embossing teeth. Intersection angles different that 90° may be used, for example, to define triangular or trapezoidal embossing teeth. For steps 508 and 510, a preferable cutting tool comprises a saw having a thickness “t” approximately equal to the desired width of streets 216 separating the embossing teeth on tool 100, shown in plan view in
Although method 500 is suitable for making forming tools according to the invention, the costs of individual forming tools may be reduced by using a sculpted or machined forming tool 222 as a plug mold for making numerous identical forming tools. Exemplary steps of a method 700 for molding forming tools are shown in
At initial step 702, a substrate 218 comprised of a formable material is provided, preferably layered on a relatively hard support substrate 220. Formable substrate 218 may comprise one of many materials capable of being formed into a mold for a forming tool. Preferably, substrate 218 comprises a moldable or impressionable material, such as PMMA (poly methyl methacrylate, or acrylic), which can be coated on support substrate 220 to the desired thickness, which will deform when pressed with a mold or stamp, which will receive the tool material to be deposited thereon, and which can then readily be removed without damaging the tool material. Additional candidate materials for substrate 218 include polycarbonate, polyurethane, ABS plastic, various photo-resist resins such as phenol-formaldehyde novolac resins, epoxies and waxes. The substrate 218 preferably has a uniform thickness, and is thick enough to define a mold for a forming tool when contoured, for example, by impressing a forming tool 222. Various methods known in the art, for example, spin coating and lamination, may be used to deposit substrate 218 onto support substrate 220. A cross-sectional view of a substrate 218 and corresponding forming tool 222 are shown in
At step 704, a plurality of shaped impressions 227 is formed in a surface 224 of substrate 218, preferably by impressing a forming tool 222 into surface 224. Alternatively, substrate 218 comprises a liquid molding material that is injected into a mold cavity defined between the embossing face 104 of forming tool 222 and support substrate 220. The liquid molding material is then cured or hardened, as known in the art. The embossing face 104 of forming tool 222 is shaped essentially the same as an embossing face 104 of forming tool 100 previously described, because forming tool 222 serves as a plug mold for a forming tool 100. Hence, embossing face 104 of forming tool 222 is provided with embossing teeth 106, as previously described. A partial cross-sectional view of forming tool 222 impressed against (or immersed in) substrate 218 is shown in
In a preferred embodiment, when teeth 106 have been impressed or immersed into substrate 218 to the desired depth, flash fills the recessed regions between teeth 106 of forming tool 222 to define a molding surface 226. Forming tool 222 may be heated to assist deformation of substrate 218, and then cooled to harden substrate 218 into place. In an alternative embodiment, substrate 218 is selected of a material that is sufficiently deformable to flow under pressure without application of heat, and sufficiently viscous to hold its shape after tool 222 is removed. In yet another alternative embodiment, heat, UV light, or chemical catalysts are used to harden substrate 218 while under forming tool 222, and then tool 222 is removed. In yet another embodiment, ultrasonic energy is applied by tool 222 to soften substrate 218 for molding. After forming the shaped impressions 227 and after substrate 218 is sufficiently hardened, forming tool 222 is removed to reveal molding surfaces 226 in molding substrate 218, shown in
At step 706, molding surface 226 is prepared to receive the tool material selected for the forming tool to be made. In an embodiment of the invention, a metallic tool material is deposited, such as by electroplating, over molding surface 226.
At step 708, a tool material is deposited over the prepared molding surface 226. In the first embodiment, metallic materials are preferably deposited by electroplating, as shown in
At step 708, the hardened or solidified tool material is removed from the molding substrate. In either embodiment, as shown in
Exemplary steps of a method 900 of making a forming tool by repeated application of a forming tool to a formable substrate are shown in
Referring to
At step 906, forming tool 244 is impressed into the formable substrate 248.
At step 912, if more protrusions, i.e., embossing teeth 258 are desired, steps 906-910 are repeated until the desired number of cured embossing teeth 258 have been formed.
It should be appreciated that, if forming tooth 246 is not the molding counterpart of the desired embossing tooth, and is instead in the shape of the embossing tooth itself, each cured material protrusion 258 will not be in the shape of an embossing tooth but will instead be in the shape of a molding counterpart of an embossing tooth. In such case, the support substrate 220 with cured protrusions 258 will not be suitable for use as a forming tool. It may, however, be adapted to serve as a molding surface 226 for a forming tool, as shown, e.g., in
Other methods which use photo-curable polymers may also be used to form a forming tool as described above. For example, stereo lithography using a laser to selectively cure portions of a liquid polymer, such as used for rapid prototyping applications, may be used to form a forming tool, or a mold for a forming tool.
Method for Making a Forming Tool with Transparent TeethA forming tool having a plurality of transparent teeth surrounded by opaque regions is useful for use with a UV-curable (or other radiation-curable) molding material. Such a tool can be used in a fashion similar to the repetitively-applied forming tooth 246 discussed above. Advantageously, a tool with transparent teeth surrounded by opaque regions may be used to define molds for a plurality of microelectronic spring structures in a single stamping/curing step. The present invention provides a method for making such a tool.
One method for making a forming tool with opaque and transparent regions requires forming a tool out of a relatively hard and strong transparent material, such as fused silica or quartz. Regions of the tool which are to be made opaque are then covered with a thin patterned layer of opaque material, such as a layer of gold or aluminum deposited by evaporation, vapor deposition, or sputtering through a pattern mask. For this method, a tool blank of the transparent material may be formed into a forming tool using a material removal method such as previously described. For example, a photo-patternable glass, such as Schott Foturan™, can be contoured to define an embossing surface using gray-scale lithography. Alternatively, a fused silica blank can be contoured using deep reactive ion etching (“RIE”) equipment such as is available from Surface Technology Systems Ltd., of Imperial Park, Newport, United Kingdom in conjunction with a contoured photoresist mask, as follows. A surface of the tool blank is first coated with a layer of photoresist. The layer of photoresist is then contoured using gray-scale lithography. The RIE etch is performed on the layer of photo-resist, which amplifies the contoured surface of the photoresist in the underlying tool blank. However, a drawback of the methods that require forming a tool out of relatively hard materials is relatively high manufacturing cost.
Lower manufacturing costs may be realized by using the method 1100, exemplary steps of which are shown in
At step 1102, the transparent material is patterned and cured as known in the art.
At step 1106, an opaque material 266 is deposited on the molding surface, between and adhering to sidewalls 268 of embossing teeth 262. In an embodiment of the invention, a metal, such as nickel, is deposited by electroplating onto a patterned seed layer, as shown in
For some applications, it may be advantageous to form a forming tool with contoured embossing teeth by exploiting the contoured surface provided by a liquid meniscus. Method 1300, exemplary steps of which are shown in
In step 1306, the surfaces of depression 276, and in particular, the sidewalls, are preferably treated to alter their wetting properties as desired. The wetting properties can be modified by various techniques as known in the art, such as silanization. For further example, exposure to plasmas of oxygen, nitrogen/hydrogen, and other gases can change surface wetting properties. Further, increasing the surface roughness will generally increase the wetability of the surface. The sidewalls of the depression 276 are treated to alter the surface energy, which determines wetability, relative to the chosen wetting fluid. If a concave meniscus is desired, the surface energy of the sidewalls is decreased (if necessary) such that the chosen wetting fluid will cling to the sidewalls and form a concave meniscus in the depression 276. Conversely, if a convex meniscus is desired, the sidewalls are treated to repel the wetting fluid, thereby causing the liquid to form a bead having a convex meniscus. In the preferred embodiment of the invention, the selection of the sacrificial material, wetting fluid, and recess shape are such that no surface treatment of the depression 276 is needed to achieve the desired meniscus shape. In general, it is preferred that the surface of depressions 276 be easily wetted, to avoid difficulties with filling multiple recesses with a uniform quantity of fluid.
In step 1308, depression 276 is partially filled with a suitable wetting fluid 278. A suitable fluid is a liquid with a low enough viscosity and surface tension to wet depression 276, which may be solidified without significant shrinkage or otherwise distorting the desired meniscus shape. In an embodiment of the present invention, fluid 278 is a photo-patternable material such as photoresist (e.g., SU8-25 or SU8-2). Several methods may be used to get a specified volume of fluid 278 into the depression 276. Generally the depressions 276 are small, for example about 250 microns wide, 250 microns deep, and 1000 microns long. The volume of a “manhattan” (rectangular) cavity with these dimensions is 62.5 nanoliters, and special techniques must be used to accurately deposit a specified volume of liquid, which is preferably less than the recess volume. In one embodiment, a substrate having depressions 276 with a volume of less than about 100 nanoliters is spin coated with a fluid 278. The spin-coating process leaves a small amount of fluid 278 in each cavity, the volume of which depends on the fluid viscosity, surface wetting properties of the fluid 278 and depression 276, the shape of depression 276, and spin process parameters such as rotational velocity and acceleration, and radial distance from the axis of rotation. Fluid 278 may be applied by directing a fluid mist onto a rotating substrate, or by immersion. A portion of the fluid 278 is also removed by the spin coating process from depression 276, so that the fluid 278 only partially fills the depression 276, as shown in cross-section in
The relative surface energies of fluid 278 and the sidewalls of depression 276 are such that the fluid 278 has a meniscus having a first contoured shape 280 in the length direction of the depression 276, and a second contoured shape 282 in the width direction, as shown in
In step 1310, after the fluid 278 partially fills depression 276, the fluid is solidified, for example, by curing with a chemical catalyst or UV light, by heating to drive out solvents, or by cooling below its melting point. The solidified fluid 286 is then further patterned at step 1312 to define a mold for an embossing tooth. For example, as shown in
In an alternative embodiment, the properties of a resilient sheet provided with a plurality of integral tangs are used to define a forming tool. Exemplary steps of a method 1500 using a resilient sheet with integral tangs are shown in
In step 1502, a metal sheet 294 having integral tangs 296 is provided. Each tang 296 has a free end 299 and a fixed end 297. Sheet 294 is preferably a thin metal sheet, such as a stainless steel sheet about 1 to 2 mils thick. Each integral tang is preferably shaped, in plan view, to have the desired shape for an embossing tooth;
In step 1504, a fixture 300 is provided, having a substantially planar upper surface 304 and a plurality of protrusions 302 disposed on surface 304. As shown in
At step 1506, sheet 294 is aligned with fixture 300 so that each of its integral tangs 296 contacts a protrusion 302, while the remainder of sheet 294 does not contact any protrusions adjacent to any of tangs 296. While in this aligned position, sheet 294 is mounted to fixture 300, as shown in
At step 1508, while sheet 294 is mounted to fixture 300, a layer of fixative material 308 is deposited on an upper surface of sheet 294, as shown in
At step 1510, fixture 300 is removed from sheet 294 and fixative material 308. Preferably, protrusions 302 are removed along with fixture 300. At step 1512, any fixative material 308 remaining underneath lower surfaces 310 of tangs 296 is removed, preferably using a suitable solvent, such as acetone or IPA if material 308 is uncured underneath tangs 296, or using a dry etching process, such as by RIE, if the undesired portion of material 308 is cured or otherwise resistant to removal using a solvent. If a dry etching process is used, sheet 294 is preferably comprised of a material that will protect the portion of fixative material 308 above sheet 294 from over-etching. After removal of fixative material 308 from underneath tangs 296, forming tool 312 is thereby defined, as shown in
In an alternative embodiment, the properties of a stress gradient induced in tangs deposited on a substrate are used to define a forming tool. Exemplary steps of a method 1700 using tangs deposited on a substrate are shown in
At step 1702, a substrate 316 is provided as shown in
At step 1706, a patterned layer of resilient material is deposited on substrate 316 and sacrificial layer 318. The layer of resilient material is deposited in separate plan forms each of which has the projected shape, in plan view (e.g., trapezoidal, triangular, or rectangular), of an embossing tooth on the forming tool to be formed. Thus, each plan form comprises a beam area portion 321, corresponding to a sloped portion 116 of an embossing tooth, and a base area portion 323, corresponding to a protruding area 114 of an embossing tooth.
The resilient layer (comprising plan forms 320 or 322) is preferably deposited using a process such as CVD, sputtering, electroplating, or a combination of these methods. At step 1708, the resilient layer is patterned in the desired plan form shapes, such as by using a pattern mask as known in the art. Monolayer-type plans forms, such as plan form 320, preferably comprise a metallic material, such as nickel. At step 1710, a stress gradient, such as a compressive stress that is biased towards the underside 336 of plan form 320, is generated. For a monolayer type plan form, the stress gradient is preferably generated by controlling the conditions of deposition such that an increasingly residual tensile stress is generated as more material is deposited. Methods for controlling deposition to generate a residual stress are as known in the art. The resulting tensile stress, biased towards the upper surface of plan form 320, is equivalent to a compressive stress biased towards the underside 336. At step 1712, when sacrificial layer 318 is removed, such as by etching or dissolution in a solvent, the portion of plan form 320 which overlaid sacrificial layer 318 is freed, and the internal stress gradient in plan form 320 causes it to curl away from substrate 316 as shown in
In the alternative, a residual compressive stress is generated using a bilayer type plan form 322, conceptually similar to bimetallic strips used in old-fashioned, analog thermostats. A layer of first material 324 is deposited and patterned using conventional lithographic processes. A layer of second material 326 is deposited on top of the first material 324. Materials 324 and 326 are preferably metallic, and are selected such that material 324 has a greater coefficient of thermal expansion than material 326. Consequently, after sacrificial layer 318 is removed at step 1712, plan form 322 is heated to generate a compressive stress at step 1710. As with plan form 320, the compressive stress in plan form 322 causes it to curl away from substrate 316 as shown in
After step 1712,
Steps 1714 to 1718 comprise a first path for completing a method of making a forming tool, which path is analogous to steps 1508 to 1512 of method 1500 described above. At step 1714, a fixative material 308 is deposited in a uniform layer to cover substrate 316 and plan forms 320, 322 as shown in
Steps 1720 to 1726 comprise a second, alternative path which produces a forming tool having protruding embossing teeth, like forming tool 100 shown in
It should be apparent that shaped impressions 227 formed in step 1720 are analogous to shaped impressions 227 and molding surface 226 formed by step 704 of method 700. Thus, molding surface 226 may be used in the same manner as molding surface 226 is used in method 700 to make a metallic or other cast material forming tool. For example, in step 1722, a metallic tool material 101 may be deposited by electroplating, as shown in
In an alternative embodiment, cantilevered tangs are lithographically formed on a substrate, and their tips are deflected and fixed in a deflected position to define a forming tool. Exemplary steps of a method 1900 using cantilevered tangs are shown in
In step 1902, a substrate 338 is provided, which is preferably substantially planar. Unlike substrate 316 used in method 1700, substrate 338 will be retained as part of the finished forming tool. At step 1904, stand-offs 340 are deposited and patterned on substrate 338 using conventional lithographic techniques.
Optional step 1908 is performed if a stepped embossing tooth is desired, as previously described. A third layer of photoresist 352 is deposited, and patterned to have openings disposed over stand-offs 340. A layer of resilient material, preferably the same as the material used for tangs 350 and stand-offs 340, is deposited in the openings, such as by electroplating, to form stepped areas 354, shown in
At step 1910, resist layers 342, 348, and 352 are stripped to reveal free-standing, cantilevered tangs 350 standing above substrate 338 on stand-offs 340. Each tang 350 has a free tip 356, an intermediate cantilevered portion between free tip 356 and an end of the tang 350 attached to stand-off 340, as shown in
In an alternative embodiment, an embossing tooth and/or a plurality of embossing teeth assembled into a forming tool are made by defining a tooth profile in a segment taken at a defined cross section of the forming tool, and assembling the segments to define a tooth and/or a tool. Unlike other methods disclosed herein, each segment defines a side profile of an embossing tooth (or a section of an embossing tooth). In comparison, in other methods disclosed herein where a forming tool is assembled from different components, for example, method 1900 which assembles tangs and stand-offs, each of the components defines portions of a plan view shape of an embossing tooth component. Fabrication in segments is especially useful for forming embossing teeth with features as shown in
At step 2102, the desired cross-sectional shapes are defined at a design stage by sectioning the desired tool to be formed into sections. For example, if teeth having a central channel 388 (for forming a ribbed spring structure) in a length direction of sloped portion 116 as shown in
For structural strength, segments 376 are typically deposited by electroplating. Plates 376 are preferably provided with alignment features, such as alignment holes 372 and/or alignment tabs 374. The upper surface 378 of segments 376 is preferably planarized to ensure a smooth fit between adjoining segments in subsequent assembly step 2112. Resist layers 362, 363 are then removed to free segments 376. It should be apparent that various alternative methods may be used to make segments 376. For example, segments 376 may be cut from thin metal sheets using laser ablation, lithographic etching, or a precision water jet.
Once fabricated, segments 376 are assembled in order by stacking them in aligned relation.
Segmented forming tools and/or embossing teeth may also be assembled lithographically, by building up multiple connected layers on a substrate.
Defining a tooth by its side profile (not necessarily segmented into more than one section) is also useful for embossing teeth having complex side profiles. For example,
Tooth profiles may additionally comprise features such as base 414 and tabs 416 of tooth 420, shown in
Having thus described a preferred embodiment of a forming tool for forming a sacrificial substrate for making microelectronic spring structures, and methods for making the forming tool, it should be apparent to those skilled in the art that certain advantages of the within system have been achieved. It should also be appreciated that various modifications, adaptations, and alternative embodiments thereof may be made within the scope and spirit of the present invention. For example, a forming tool for use in making microelectronic spring structures has been illustrated, but it should be apparent that the inventive concepts described above would be equally applicable to forming tools for similar microelectronic and micro-mechanical structures. The invention is further defined by the following claims.
Claims
1-34. (Canceled)
35: A method for making a microelectronic spring mold forming tool comprising:
- providing a tool body comprised of tool material;
- selectively removing tool material from said tool body to form an embossing surface, said embossing surface comprising at least one embossing tooth protruding from a face of said tool body, wherein an outer surface of said embossing tooth further defines a contour of a microelectronic spring structure.
36: The method of claim 35, further comprising selecting said tool body comprised of a plastic material having a hardness exceeding the hardness of a mold material to be stamped by the forming tool.
37: The method of claim 35, further comprising mounting said embossing surface to a base having an embossing face.
38: The method of claim 35, wherein said selectively removing step comprises making a plurality of cuts in the tool material.
39: The method of claim 35, wherein said selectively removing step comprises making a first plurality of parallel cuts in a first orientation and making at least a second plurality of parallel cuts in at least a second orientation, said first and second orientations being generally co-planar with said embossing surface.
40: The method of claim 39, wherein said selectively removing step further comprises making the second plurality of cuts orthogonal to the first plurality of cuts.
41: The method of claim 39, wherein said selectively removing step further comprises making selected ones of said first plurality of cuts of varying depth.
42: The method of claim 39, wherein said selectively removing step further comprises applying a cutting tool to the tool material.
43: The method of claim 42, wherein said selectively removing step further comprises applying a cutting tool comprising a mechanical cutter.
44: The method of claim 42, wherein said selectively removing step further comprises applying a cutting tool comprising directed laser energy.
45: The method of claim 42, wherein said selectively removing step further comprises applying a cutting tool comprising a shaped grinding wheel.
46: The method of claim 45, wherein said selectively removing step further comprises rotating the grinding wheel about a grinding axis thereof, and moving the grinding wheel in grinding relation to the tool material to form at least one cut in a first orientation and making at least one second cut in at least a second orientation, said first and second orientations being generally co-planar with the embossing surface to be formed.
47: The method of claim 35, wherein said providing step further comprises providing the tool body comprised of a gray scale photopatternable material, and wherein said selectively removing step further comprises exposing a surface of the photopatternable material to light through a gray scale mask.
48: The method of claim 47, wherein said providing step further comprises providing the tool body comprised of a gray scale photopatternable glass.
49: The method of claim 35, wherein said selectively removing step further comprises forming a plurality of embossing teeth having a height between about 5 and 100 mils.
50: The method of claim 35, wherein said selectively removing step further comprises forming a plurality of embossing teeth, at least two of which are separated by less than about 20 mils.
51: The method of claim 35, wherein said selectively removing step further comprises forming a plurality of embossing teeth, at least two of which are separated by less than about 3 mils.
52: A microelectronic spring mold forming tool fabricated in accordance with the method of claim 35.
53: A method for making a microelectronic spring mold forming tool having an embossing surface comprising a plurality of protruding embossing teeth, the method comprising:
- providing a substrate comprised of a formable material;
- forming a plurality of shaped impressions in a surface of the substrate;
- depositing a layer of tool material on the surface of the substrate conforming to the shaped impressions; and
- removing the layer of tool material from the substrate, whereby a surface of the tool material comprises an embossing surface having a plurality of embossing teeth defining contours of a plurality of microelectronic spring structures.
54: The method of claim 53, wherein said forming step further comprises forming a plurality of shaped impressions, wherein each of the shaped impressions is configured to mold at least one embossing tooth having a protruding area, and a sloped portion receding from said protruding area defining a contour of a microelectronic spring structure.
55: The method of claim 54, wherein said providing step further comprises providing the formable material comprised of a layer of impressionable material on a hard substrate.
56: The method of claim 54, wherein said forming step further comprises impressing the formable material with a forming tool.
57: The method of claim 56, wherein said forming step further comprises removing the forming tool after said impressing step, and repeating said impressing step and said removing step on a different portion of the substrate until a desired number of shaped impressions has been formed thereby.
58: The method of claim 56, wherein said forming step further comprises curing the formable material while the forming tool is impressed thereon.
59: The method of claim 58, wherein said forming step further comprises curing the formable material by beaming radiation through the forming tool.
60: The method of claim 56, wherein said forming step further comprises curing the formable material by beaming UV light through the forming tool.
61: The method of claim 57, wherein said forming step further comprises curing the formable material by beaming radiation through the forming tool after said impressing step and prior to said removing step.
62: The method of claim 53, wherein said depositing step further comprises depositing a seed layer of a conductive material over the surface of the substrate, and electroplating the tool material onto the seed layer.
63: The method of claim 53, wherein said depositing step further comprises selecting said tool material from a transparent material.
64: The method of claim 53, wherein said providing step further comprises selecting said formable material from a radiation curable material.
65: The method of claim 53, wherein said providing step further comprises providing the substrate comprised of a layer of photoresist material on a hard substrate, and the step of forming a plurality of shaped impressions comprises patterning the layer of photoresist material photolithographically.
66: The method of claim 53, wherein said forming step further comprises forming the plurality of shaped impressions wherein each of the shaped impressions have a depth no greater than 100 mils.
67: The method of claim 53, wherein said forming step further comprises forming the plurality of shaped impressions wherein the most proximately located ones of said shaped impressions are separated by a pitch between about 5 and 50 mils.
68: The method according to claim 53, wherein said forming step comprises forming ones of said plurality of shaped impressions having a projected shape in a plane parallel to the surface of the substrate, the projected shape comprising a base end, a tip end, and a tapered portion between the base end and the tip end, wherein the tapered portion tapers from a first width adjacent to the base end to a second, narrower width adjacent to the tip end.
69: The method according to claim 53, wherein said forming step further comprises forming a plurality of shaped impressions comprising shaped depressions, and then partially filling ones of the plurality of shaped depressions with a liquid presenting a meniscus shape, wherein the meniscus shape of the liquid defines a molding surface of the shaped depression.
70: The method of claim 69, wherein said partially filling step comprises spin-coating the liquid over the surface of the substrate.
71: The method of claim 69, wherein said partially filling step comprises spraying the liquid onto the surface of the substrate.
72: The method of claim 69, wherein said partially filling step further comprises partially filling ones of the plurality of shaped depressions with the liquid, wherein the liquid is comprised of a photoresist material.
73: The method of claim 69, wherein said partially filling step further comprises partially filling ones of the plurality of shaped depressions with the liquid, wherein the liquid is comprised of a curable polymer, and further comprising curing the polymer after said partially filling step.
74: The method of claim 73, wherein said curing step further comprises heating the liquid to cure the polymer.
75: The method of claim 73, wherein said curing step further comprises exposing the liquid to radiation to cure the polymer.
76: The method of claim 69, further comprising solidifying the liquid by cooling after said partially filling step.
77: The method of claim 69, wherein said partially filling step further comprises partially filling ones of the plurality of shaped depressions with the liquid, wherein the liquid comprises a solid in a liquid carrier, and further comprising solidifying the liquid by removing the liquid carrier after said partially filling step.
78: A microelectronic spring mold forming tool fabricated in accordance with the method of claim 53.
79: A method for making a microelectronic spring mold forming tool, the method comprising:
- providing a fixture having a mounting surface, the mounting surface having a plurality of protrusions disposed thereon;
- providing a sheet of resilient material having a plurality of spaced-apart, integral tangs co-planar with the sheet;
- mounting the sheet of resilient material on the mounting surface of the fixture so that selected ones of the plurality of spaced-apart, integral tangs contacts selected ones of the plurality of protrusions to define a plurality of contoured tangs extending from the sheet;
- fixing selected ones of said contoured tangs in an extended position; and removing said fixture from the sheet of resilient material.
80: The method of claim 79, wherein said fixing step further comprises depositing a layer of fixative material on the sheet of resilient material.
81: The method of claim 80, further comprising selectively removing a portion of the layer of fixative material from a side of the plurality of contoured tangs.
82: The method of claim 81, wherein said first providing step further comprises selecting the sheet of resilient material comprised of a metal.
83: The method of claim 79, wherein said second providing step further comprises selecting the sheet of resilient material comprised of a metal selected from the group consisting essentially of nickel, titanium, tungsten, cobalt, chromium, iron, aluminum, copper, zinc, tin, and alloys thereof.
84: The method of claim 79, wherein said second providing step further comprises stamping a uniform sheet of resilient material to form the plurality of spaced-apart integral tangs.
85: The method of claim 79, wherein said second providing step further comprises selectively etching a uniform sheet of resilient material to form the plurality of spaced-apart integral tangs.
86: The method of claim 79, wherein said second providing step further comprises ablating a uniform sheet of resilient material to form the plurality of spaced-apart integral tangs.
87: The method of claim 80, wherein said fixing step further comprises selecting the layer of fixative material comprised of materials selected from the group consisting essentially of polymethylmethacrylates, polycarbonates, polyurethanes, AAS plastics, photoresists, novolac resins, and epoxies.
88: A microelectronic spring mold forming tool fabricated in accordance with the method of claim 79.
89: A method for making a microelectronic spring forming tool having an embossing surface comprising a plurality of protrusions thereon, the method comprising:
- providing a substrate having a surface;
- depositing a layer of resilient material on the surface of the substrate;
- patterning the layer of resilient material to define a plurality of plan forms, wherein ones of the plurality of plan forms are configured, viewed in a direction normal to the substrate surface, in the projected shape of a microelectronic spring structure, wherein each of the plan forms comprises a beam area portion and a base area portion;
- generating a stress gradient in ones of the plurality of plan forms, whereby the beam area portions of the ones of the plurality of plan forms are deflected away from the surface of the substrate and the base area portions remain attached to the substrate and the plurality of plan forms are disposed in an extended position defining contours of microelectronic spring structures;
- fixing selected ones of the plan forms in the extended position by depositing a fixative material covering the plurality of projected shapes; and
- removing said substrate from the layer of fixative material.
90: The method of claim 89, further comprising selectively removing a portion of the fixative material from a side of the plurality of plan forms.
91: The method of claim 89, wherein said depositing step further comprises depositing the resilient material selected from the group consisting of nickel, cobalt, chromium, aluminum, copper, tin zinc, iron, and alloys thereof.
92: The method of claim 89, wherein said depositing step further comprises depositing the resilient material comprised of a bi-layer composite of a first material, deposited on the surface of the substrate, and a second material, deposited on the first material.
93: The method of claim 92, wherein said depositing step further comprises depositing the first material having a first rate of thermal expansion greater than a second rate of thermal expansion of the second material.
94: The method of claim 93, wherein said generating step comprises heating the resilient material.
95: The method of claim 94, wherein said generating step comprises bombarding the first material with ions.
96: The method of claim 89, wherein said fixing step further comprises selecting the fixative material comprised of materials selected from the group consisting essentially of polymethylmethacrylates, polycarbonates, polyurethanes, ABS plastics, photoresists, novolac resins, and epoxies.
97: A microelectronic spring mold forming tool fabricated in accordance with the method of claim 89.
98: A method for making a microelectronic spring forming tool having an embossing surface comprising at least one protrusion thereon, the method comprising:
- defining a plurality of cross-sectional shapes from a sequence of cross-sections taken through the embossing surface of the microelectronic spring forming tool;
- forming a plurality of segments in a layer of material, wherein each segment is shaped according to one of the plurality of cross-sectional shapes; and assembling the plurality of segments in order of the sequence of cross-sections to form the embossing surface.
99: The method of claim 98, wherein said forming step further comprises selectively etching a uniform sheet of resilient material to form the plurality of segments.
100: The method of claim 98, wherein said forming step further comprises ablating a uniform sheet of resilient material to form the plurality of segments.
101: The method of claim 98, wherein said forming step further comprises patterning a layer of photo-patternable material using a lithographic process to form the plurality of segments.
102: The method of claim 101, wherein said forming step further comprises electroplating a metal onto the layer of photo-patternable material after said patterning step to form the plurality of segments.
103: The method of claim 98, wherein said forming step further comprises stamping a uniform sheet of resilient material to form the plurality of segments.
104: The method of claim 98, wherein said assembling step is performed by forming in sequence, in said forming step, each segment of the sequence of cross-sections assembled to a segment immediately preceding it in the sequence.
105: A microelectronic spring mold forming tool fabricated in accordance with the method of claim 98.
106. (Canceled)
107: A method for making a microelectronic spring mold forming tool having an embossing surface comprising a plurality of protrusions thereon, the method comprising:
- providing a substrate having a surface;
- depositing a plurality of stand-offs on the surface of the substrate;
- attaching a plurality of tangs to the plurality of stand-offs, wherein each of the plurality of tangs is attached, at a fixed end thereof, to at least one of the plurality of stand-offs, and has a free tip distal from the fixed end and an intermediate cantilevered portion between the fixed end and the free tip;
- deflecting the free tip of each of the plurality of tangs towards the substrate; fixing the plurality of tangs in a deflected position; and
- depositing a filler material between the plurality of tangs and the substrate.
108: The method of claim 107, further comprising depositing the filler material in a layer covering the plurality of tangs and the substrate, and then selectively removing the filler material from everywhere except between the plurality of tangs and the substrate.
109: The method of claim 107, wherein said depositing step further comprises depositing the stand-offs comprised of a material selected from the group consisting of nickel, cobalt, chromium, aluminum, copper, tin, zinc, iron, and alloys thereof.
110: The method of claim 107, wherein said attaching step further comprises selecting the plurality of tangs comprised of a material selected from the group consisting of nickel, aluminum, copper, tin, zinc, iron, and alloys thereof.
111: The method of claim 107, further comprising depositing a material comprising a stepped area disposed over the standoff.
112: The method of claim 107, wherein said fixing step further comprises selecting the filler material comprised of materials selected from the group consisting essentially of polymethylmethacrylates, polycarbonates, polyurethanes, ABS plastics, photoresists, novolac resins, and epoxies.
113: A microelectronic spring mold forming tool fabricated in accordance with the method of claim 107.
Type: Application
Filed: Aug 16, 2004
Publication Date: Jan 27, 2005
Applicant:
Inventors: Benjamin Eldridge (Danville, CA), Stuart Wenzel (San Francisco, CA)
Application Number: 10/919,151