Combined structure of a thermal chamber and a thermal tower
A combined structure of a thermal chamber and a thermal tower, the structure suits heat generating products such as a CPU of a computer, a projector, an LCD color monitor, a TV set etc., and comprises: a hollow vacuum thermal chamber or vapor chamber forming a base, of which the upper surface has at least an opening; and at least a vacuum thermal tower or heat pipe combined with the opening of the vacuum thermal chamber, the inner spaces of the thermal chamber (or vapor chamber) and the thermal tower (or heat pipe) are communicated with each other. Thereby, heat can be fast conducted and scattered through the vacuum thermal chamber or vapor chamber and the vacuum thermal tower or heat pipe.
1. Field of the Invention
The present invention relates to a combined structure of a thermal chamber and a thermal tower; and especially relates to a heat sinking device of which the base is in the form of a hollow vacuum thermal chamber or vapor chamber, the upper surface of the base is combined with at least a vacuum thermal tower or heat pipe, wherein the inner spaces of the thermal chamber and the thermal tower are communicated with each other. The structure suits a CPU of a computer, a projector, an LCD color monitor, a TV set and other heat generating electronic products.
2. Description of the Prior Art
The art of computer information and techniques of the manufacturers of it have been developed very fast and updated from day to day, the assemblies in a CPU derived from them have had more and more circuits, thus energy consumption has been continuously increased, and problems of heat sinking can not help being mentioned again in order that heat accumulation by high speed operation of a CPU in a computer that induces raising of temperature and damage of the CPU can be avoided. In conventional CPU heat-sinking devices, it is often seen that a fan driven by electric power scatters heat absorbed by a heat-sinking body from an heat source object into a sealed housing of a mainframe in order to get a goal of forced convection; however, this has the defects of substantial electric power consumption, large volume, large noise, slow speed of heat sinking as well as vibration. And, at present time, there is a use of a thermal tower having no air pressure, wherein the thermal tower set with working fluid to efficiently increase the speed of heat sinking.
A conventional heat-sinking device also has the chance of using a vacuum thermal tower, as the one shown in
In view of these defects to be gotten rid of and to increase the efficiency of heat sinking, the present invention is developed.
SUMMARY OF THE INVENTIONThe primary object of the present invention is to provide a combined structure of a thermal chamber and a thermal tower, by mutual connecting of the thermal chamber and the thermal tower, the efficiency of heat sinking can be increased.
To achieve the above stated object, the combined structure of a thermal chamber and a thermal tower of the present invention comprises: a hollow vacuum thermal chamber forming a base, of which the upper surface is provided at least with an opening; and at least a vacuum thermal tower combined with the opening of the vacuum thermal chamber, the inner spaces of the thermal chamber and the thermal tower are communicated with each other. And the thermal tower can be added therearound with heat-sinking fins.
Thereby, heat generating electronic products such as a CPU of a computer, a projector, an LCD color monitor, a TV set etc. can get excellent heat-sinking effects by heat conducting by means of the vacuum thermal chamber and the vacuum thermal tower.
The present invention will be apparent after reading the detailed description of the preferred embodiments thereof in reference to the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
The present invention is characterized in using the combined structure of a vacuum thermal chamber and at least a vacuum thermal tower or column to increase heat conductive heat-sinking effect, and to avoid damage or inferior function of products by overly large accumulating heat from heat generating sources.
Referring to
The hollow vacuum thermal tower or thermal column 20 has on the upper end thereof a vacuum sealed-opening 21, and has the other end thereof the opened opening which is combined to the opening 23 to make the interior spaces communicated with each other.
Thereby as shown in
Referring
The upright hollow cylindrical vacuum thermal tower or thermal column 20 is combined at the periphery thereof with a plurality of heat sinking fins 26 parallel to the flat vacuum thermal chamber or vapor chamber 22 to increase the area and the effect of heat scattering.
Referring
Referring
Referring to
Therefore, by drawing air to make a vacuum, the flat vacuum thermal chamber or vapor chamber 22 in the form of the base can be combined on the bottom thereof with a heat generating electronic device; heat can be effectively scattered through the combined structure stated above, and thereby the life of use of the electronic device can be elongated.
The present invention thereby has the following advantages:
-
- 1. After drawing air to make a vacuum of a conventional upright thermal tower, a plate is welded to the bottom of the thermal tower to increase the contact area of the thermal tower with a heat generating body to increase the effect of heat sinking; however, the speed of heat sinking of it is far smaller than that of the combined structure of a vacuum thermal chamber and a vacuum thermal tower of the present invention having the interior spaces of them mutually communicated, thereby, the present invention has higher efficiency of heat sinking.
- 2. The interior spaces of the vacuum thermal chamber and the vacuum thermal tower of the present invention are mutually communicated, so that the vacuum sealed-opening of the present invention can be provided on the upper end of the vacuum thermal tower, or on a side of the vacuum thermal chamber, thus the present invention is more convenient in operation.
In conclusion, the present invention can surely get its expected object to provide a vacuum heat-sinking device. The embodiments given are only for illustrating the present invention, and not for giving any limitation to the scope of the present invention. It will be apparent to those skilled in this art that various modifications or changes without departing from the spirit of this invention shall also fall within the scope of the appended claims. Having now particularly described and ascertained the nature of the present invention having its industrial value, we declare that what we claim are:
Claims
1. A combined structure of a thermal chamber and a thermal tower, said structure comprises:
- a hollow vacuum thermal chamber forming a base, of which an upper surface is provided at least with an opening; and
- at least a vacuum thermal tower combined with said opening of said vacuum thermal chamber, the inner spaces of said thermal chamber and said thermal tower are communicated with each other;
- thereby, heat is conducted and scattered through said thermal chamber and said thermal tower.
2. The combined structure of a thermal chamber and a thermal tower as in claim 1, wherein:
- said vacuum thermal tower has on an upper end thereof a vacuum sealed-opening.
3. The combined structure of a thermal chamber and a thermal tower as in claim 1, wherein:
- a vacuum sealed-opening is provided on a side of said vacuum thermal chamber.
4. The combined structure of a thermal chamber and a thermal tower as in claim 1, wherein:
- the bottom of said vacuum thermal chamber is connected with a heat generating body in use.
5. The combined structure of a thermal chamber and a thermal tower as in claim 1, wherein:
- said vacuum thermal tower is upright and is provided at the periphery thereof with a plurality of heat sinking fins to increase heat sinking function.
6. The combined structure of a thermal chamber and a thermal tower as in claim 1, wherein:
- said vacuum thermal tower is a vacuum thermal tower or a vacuum thermal column having air therein drawn to make a vacuum.
7. The combined structure of a thermal chamber and a thermal tower as in claim 1, wherein:
- said vacuum thermal tower is an inversed “U” shaped vacuum thermal tower.
8. The combined structure of a thermal chamber and a thermal tower as in claim 1, wherein:
- said thermal tower includes a plurality of heat pipes all of a smaller diameter.
9. The combined structure of a thermal chamber and a thermal tower as in claim 8, wherein:
- said heat pipes are embedded in a plurality of heat sinking fins with an opening provided centrally thereof.
Type: Application
Filed: Aug 7, 2003
Publication Date: Feb 10, 2005
Inventor: Ching-Chih Chen (Taipei)
Application Number: 10/635,558