Method and apparatus for making a ball and socket joint and joint made by same
A molding-in-place technique for joint assemblies, such as a ball joint. The technique is particularly well suited for molding “in-place” a linkage structure about a joint structure. The technique uses a molding assembly having a plurality of centering and sealing structures for sealingly centering the linkage structure about the joint structure. A desired mold material is injected between the linkage structure and the joint structure “in-place” to provide a self-toleranced, self-retained, molded-in-place joint assembly.
The present invention relates generally to the field of joint assemblies, and more particularly to movable joint assemblies, such as a ball joint. A molding-in-place technique is provided for molding a joint structure and surrounding linkage member in-place to form an integral, self-toleranced, self-retained, movable joint assembly for a desired application.
Existing joint assemblies typically comprises a ball and socket mechanism, which is formed by a multi-step process of forming a ball structure, forming a socket structure, and then assembling the ball structure and the socket structure. The ball structure is generally formed by a molding process or by molding a ball onto a stud or linkage. The socket structure is generally formed by a separate molding process, using the desired geometry of the ball structure as a basis for the geometry for the socket structure. Unfortunately, the multiple steps generally result in a poor fit between the ball and socket. For example, the dimensional variations between the ball and socket may result in a tighter or looser fit than desired.
There is a need, therefore, for an improved molding technique to improve the fit between the ball and socket and to prevent the problems caused by the dimensional variations between the ball and socket. Accordingly, it would be advantageous to mold the joint assembly in-place, thereby preventing the tolerance problems caused by the dimensional variations between the ball and socket.
SUMMARY OF THE INVENTIONThe present technique provides a system and method for molding “in-place” a linkage structure about a joint structure. The technique uses a molding assembly having a plurality of centering and sealing structures for sealingly centering the linkage structure about the joint structure. A desired mold material is injected between the linkage structure and the joint structure “in-place” to provide a self-toleranced, self-retained, molded-in-place joint assembly.
In one aspect, the present technique provides a method of forming a mechanical joint. The method comprises molding a studded ball movably within a desired structure to form the mechanical joint. The studded ball is configured for coupling to a desired mechanical linkage.
In another aspect, the present technique provides a molding method for a mechanical joint. The method comprises injecting mold material into a cavity between a studded ball and a support structure for the studded ball. The method also comprises self-tolerancing the studded ball movably within the mold material.
In another aspect, the present technique provides a joint system. The system comprises a joint support structure and a studded joint member disposed within the joint support structure. The system also comprises a desired material molded-in-place about the studded joint member and internally retained within the joint support structure, wherein the studded joint member is movable and self-toleranced within the desired material.
In another aspect, the present technique provides a mold system for a ball joint assembly comprising a molding assembly configured to self-tolerance and mold-in-place the ball joint assembly. The molding assembly comprises a stud receptacle for a studded joint member, a first centering structure for the studded joint member, a second centering structure for a support structure disposed about the studded joint member, and a mold injection nozzle for injecting the desired mold material.
BRIEF DESCRIPTION OF THE DRAWINGSThe foregoing and other advantages of the invention will become apparent upon reading the following detailed description and upon reference to the drawings in which:
Turning now to the drawings and referring first to
As illustrated in
As illustrated, the injection and securement sections 12 and 14 are configured to seal and align desired mold geometries about the ball member 20 and a substrate assembly 24, which may have a variety of linkage and support structures for the molded-in-place joint assembly 16. For example, the substrate assembly may embody a collar that is symmetrically disposed about the ball member 20.
The injection section 12 has an injection cavity 26 for injecting an injection material 28 through a curved mold portion 30. The injection material 28 may be any suitable mold material, such as a plastic or metallic substance. For example, a low friction material may be used to improve the bearing surface between the ball member 20 and the substrate assembly 24. The injection section 12 also has a mold portion 32 to form a retention structure 34 for securing the mold structure 90 in place around the ball member 20, as illustrated in
The injection section 12 also has orientation tabs 40 extending between the curved mold portion 30 and the mold portion 32. Each of these orientation tabs 40 has a forward edge 42 configured to contact the outer edge 36 of the substrate assembly 24. As the injection and securement sections 12 and 14 are disposed about the studded ball 18, the forward edges 42 contact and align the substrate assembly 24 about the ball member 20 to ensure a uniform and properly aligned mold. Any suitable number of orientation tabs 40 may be used to facilitate alignment. For example, three orientation tabs 40 may be symmetrically disposed about the injection cavity 26 (i.e., at 120 degrees apart). Accordingly, as illustrated in
The securement section 14 includes a central receptacle 44 for the studded ball 18 and a spring loaded collar(s) 46 disposed in a receptacle(s) 48 to provide a continuous seal between the substrate assembly 24 and the securement section 14. A spring assembly 50 is disposed in the receptacle 48 to provide a spring force for the spring-loaded collar 46, which may comprise a single symmetrical collar such as a ring-shaped collar. The spring-loaded collar 46 also accommodates any dimensional variations or tolerances in the substrate assembly 24 or various other components. The spring-loaded collar 46 is configured to contact an outer edge 52 of the substrate assembly 24 adjacent a mold portion 54, which is provided in the securement section 14 to form a retention structure 56 opposite the retention structure 34. As mentioned above, the molding system 10 may alternatively form an internal retention structure, such as along the internal surface 38 of the substrate assembly 24. The securement section 14 also has an alignment structure 58 disposed adjacent the mold portion 54. The alignment structure 58 is configured to contact the ball member 20 during molding and ensure proper alignment of the ball member 20 within the substrate assembly 24 and the injected material 28. The alignment structure 58 also forms a sealed mold geometry for the injection material 28 as the pressure of the injection material 28 forces the ball member 20 against the alignment structure 58. The molding system 10 also may utilize an alignment collar 60 on the studded ball 18 to facilitate alignment of the ball member 20 relative to the substrate assembly 38 and injection material 28.
The molding system 10 proceeds by selecting and preparing a mold material for the molding process (block 64 of
After the mold material has been selected and prepared (block 64) and the ball joint has been sufficiently heated (block 66), the ball joint is inserted into a receptacle of the mold assembly (block 68). For example, as illustrated in
The substrate assembly is then centered relative to the ball joint to ensure the desired mold thickness and orientation of the substrate assembly relative to the ball joint (block 72). For example, as illustrated in
The molding system 10 then proceeds to inject mold material about the ball joint (block 76). For example, the injection material 28 may be injected through the injection cavity 26 and into the mold cavity between the substrate assembly 24 and the ball member 20. As illustrated in
The mold material may then be solidified between the substrate assembly and the ball joint (block 80). For example, the mold material may be allowed to solidify at room temperature, a coolant or cooler environment may be applied to the structure to accelerate cooling, or any other solidification step may be utilized within the scope of the molding system 10. It also should be noted that the temperature differential between the ball joint and the substrate assembly, as discussed above, facilitates solidification of the mold material. For example, the act of heating the ball joint ensures that the mold material solidifies from the substrate assembly inwardly toward the ball joint, thereby forming an insulative structure that keeps the mold material from contracting onto and sticking to the ball joint. In this manner, the substrate assembly essentially acts as a heat sink for the heated ball joint. Thus, the present technique helps reduce shrinkage of the mold material and it controls the tightness of the fit between the mold material and the ball joint. The result is a self-toleranced molded-in-place joint assembly, such as the molded-in-place joint assembly 16 illustrated in
The molding system 10 then proceeds to remove the molded-in-place ball joint from the mold assembly (block 80). The molded-in-place ball joint may be further modified and refined or it may be immediately incorporated into a desired assembly (block 86). For example, the molded-in-place ball joint may be incorporated into a suspension system of a vehicle or any other movable joint application.
As illustrated in
The mold structure 90 also may comprise one or more materials, which are molded onto the ball member 20 as a composite mold or as a multi-layered mold. For example, the mold structure 90 may be formed in multiple molding steps, which progressively build layers of low friction materials, heat resistant materials, corrosion resistant materials, impermeable materials, durable materials, and various other functional material layers. The final mold layer would then secure, or self-retain, the ball member 20 within the substrate assembly 24.
In the embodiment illustrated in
The molding system 10 is further illustrated with reference to
While the invention may be susceptible to various modifications and alternative forms, specific embodiments have been shown by way of example in the drawings and have been described in detail herein. However, it should be understood that the invention is not intended to be limited to the particular forms disclosed. Rather, the invention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention as defined by the following appended claims.
Claims
1-34. (canceled)
35. A joint system, comprising:
- a joint support structure;
- a studded joint member disposed within the joint support structure; and
- a desired material molded-in-place about the studded joint member and internally retained within the joint support structure, wherein the studded joint member is movable and self-toleranced within the desired material.
36. The joint system of claim 35, wherein the studded joint member comprises a ball-shaped head.
37. The joint system of claim 36, wherein the ball-shaped head is self-centered within the joint support structure.
38. The joint system of claim 37, wherein the desired material comprises a plastic.
39. The joint system of claim 37, wherein the joint support structure comprises an internal socket for the ball-shaped head.
40. The joint system of claim 37, wherein desired material molded-in-place about the studded joint member forms an inner bearing surface about the ball-shaped head.
41. The joint system of claim 40, wherein the inner bearing surface comprises thermodynamically enhanced characteristics provided by a temperature differential between the studded joint member and the joint support structure during in-place-molding of the desired material.
42. The joint system of claim 41, wherein the thermodynamically enhanced characteristics comprise a desired material contraction about the ball-shaped head.
43. A mold system for a ball joint assembly, comprising:
- a molding assembly configured to self-tolerance and mold-in-place the ball joint assembly, comprising: a stud receptacle for a studded joint member; a first centering structure for the studded joint member; a second centering structure for a support structure disposed about the studded joint member; and a mold injection nozzle for injecting the desired mold material.
44. The mold system of claim 43, comprising a thermodynamic differentiator configured to provide a temperature difference between the studded joint member and the support structure.
45. The mold system of claim 44, wherein the thermodynamic differentiator comprises a heater for the studded joint member.
46. The mold system of claim 43, wherein the first centering structure comprises a ring-shaped section configured to abut the studded joint member.
47. The mold system of claim 46, wherein the mold injection nozzle is configured for pressurably injecting the desired mold material against the studded joint member to force the studded joint member sealingly against the first centering structure.
48. The mold system of claim 43, comprising a spring-loaded assembly configured to abut the support structure.
49. The mold system of claim 43, wherein the second centering structure comprises a plurality of centering tabs.
50. The mold system of claim 49, wherein the plurality of centering tabs comprises geometry configured to facilitate a desired thickness of the desired mold material about the studded joint member.
51. The mold system of claim 50, wherein the plurality of centering tabs comprises at least three symmetrically arranged tabs, which are configured to contact the support structure.
Type: Application
Filed: Jan 20, 2005
Publication Date: Jun 9, 2005
Inventors: Jason Trotter (Des Plaines, IL), Robert Dutzi (Palatine, IL)
Application Number: 11/038,699