Guide flow heat sink

Abstract

A heat sink includes a heatsink board, and a cooling fan. The heatsink board includes a top plate, a bottom plate, and a plurality of separation plates forming a plurality of guide layers between the top plate, the separation plates and the bottom plate. Each of the guide layers is formed with a plurality of hollow flow channels. Thus, each of the flow channels provides an air guide effect, and the cooling fan provides a force convection effect, so that the heat of the heat source absorbed by the top plate and the bottom plate is carried away and is drained outward from the heatsink board, thereby enhancing the heat dissipation effect of the heat sink.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a guide flow heat sink, and more particularly to a heat sink that can increase the contact surface area between the heat sink and the air, thereby enhancing the heat dissipation effect of the heat sink.

2. Description of the Related Art

The CPU (central processing unit) of a computer is operated at a high speed, and easily produces a high temperature. The conventional heat sink is mounted on the CPU of the computer to carry away the heat produced from the CPU of the computer.

The conventional heat sink in accordance with the prior art shown in FIG. 1 comprises a heat conducting layer F bonded on the surface of the CPU “B”, a heatsink plate A mounted on the heat conducting layer F and having a plurality of heat dissipation fins C to increase the heat dissipation effect, and a cooling fan D mounted on the heatsink plate A for carrying the heat produced by the CPU “B”.

However, the contact area between the conventional heat sink and the CPU “B” is not large enough, thereby limiting and decreasing the heat dissipation effect of the conventional heat sink.

SUMMARY OF THE INVENTION

The primary objective of the present invention is to provide a heat sink that can increase the contact surface area between the heat sink and the air, thereby enhancing the heat dissipation effect of the heat sink.

Another objective of the present invention is to provide a heat sink that can increase the force convection effect between the heat sink and the air, thereby enhancing the heat dissipation effect of the heat sink.

A further objective of the present invention is to provide a heat sink, wherein each of the flow channels of each of the guide layers provides an air guide effect, and the cooling fan provides a force convection effect, so that the heat of the heat source absorbed by the top plate and the bottom plate is carried away and is drained outward from the heatsink board, thereby enhancing the heat dissipation effect of the heat sink.

In accordance with the present invention, there is provided a heat sink, comprising:

• • a heatsink board including a top plate, a bottom plate, a plurality of separation plates mounted between the top plate and the bottom plate to form a plurality of guide layers between the top plate, the separation plates and the bottom plate, and each of the guide layers being formed with a plurality of hollow flow channels.

Further benefits and advantages of the present invention will become apparent after a careful reading of the detailed description with appropriate reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic plan view of a conventional heat sink in accordance with the prior art;

FIG. 2 is a partially cut-away top plan view of a heat sink in accordance with the preferred embodiment of the present invention;

FIG. 2A is a side plan cross-sectional view of the heat sink in accordance with the preferred embodiment of the present invention;

FIG. 3 is a locally cross-sectional enlarged view of the heat sink taken along circle 3 as shown in FIG. 2;

FIG. 4 is a locally cross-sectional enlarged view of the heat sink taken along circle 4 as shown in FIG. 2;

FIG. 5 is a partially cut-away top plan view of a heat sink in accordance with another embodiment of the present invention;

FIG. 6 is a plan cross-sectional operational view of the heat sink taken along line 6-6 as shown in FIG. 5;

FIG. 7 is a plan cross-sectional operational view of the heat sink taken along line 6-6 as shown in FIG. 5;

FIG. 8 is a plan cross-sectional operational view of a heat sink in accordance with another embodiment of the present invention;

FIG. 9 is a partially cut-away top plan view of a heat sink in accordance with another embodiment of the present invention;

FIG. 10 is a locally cross-sectional enlarged view of the heat sink taken along circle 10 as shown in FIG. 9;

FIG. 11 is a locally cross-sectional enlarged view of the heat sink taken along circle 11 as shown in FIG. 9;

FIG. 12 is a side plan cross-sectional view of a heat sink in accordance with another embodiment of the present invention; and

FIG. 13 is a side plan cross-sectional view of a heat sink in accordance with another embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Referring to the drawings and initially to FIGS. 2-4, a heat sink in accordance with the preferred embodiment of the present invention comprises a heatsink board 1, and a cooling fan 2 mounted on the heatsink board 1.

The heatsink board 1 includes a top plate 10, a bottom plate 11, a plurality of separation plates 12 mounted between the top plate 10 and the bottom plate 11 to form a plurality of guide layers 13 between the top plate 10, the separation plates 12 and the bottom plate 11. In the preferred embodiment of the present invention, the heatsink board 1 includes two separation plates 12 to form three guide layers 13. In addition, the top plate 10 or the bottom plate 11 contacts a heat source 3 to absorb the heat produced by the heat source 3. Each of the guide layers 13 is formed with a plurality of hollow flow channels 14 (see FIG. 2A).

The cooling fan 2 is mounted on a side of the heatsink board 1.

In such a manner, each of the flow channels 14 of each of the guide layers 13 provides an air guide effect, and the cooling fan 2 provides a force convection effect, so that the heat of the heat source 3 absorbed by the top plate 10 or the bottom plate 11 is carried away and is drained outward from the heatsink board 1, thereby enhancing the heat dissipation effect of the heat sink.

As shown in FIGS. 3 and 4, the cooling fan 2 provides a force convection effect, so that the ambient air is introduced into one side of the heatsink board 1 to carry away the heat of the heat source 3 and is drained outward from the other side of the heatsink board 1, thereby enhancing the heat dissipation effect of the heat sink.

Referring to FIGS. 5 and 6, the top plate 10 is formed with an air vent 16, and the heatsink board 1 includes a hollow receiving chamber 15 formed between the guide layers 13 and between the flow channels 14 to connect each of the flow channels 14 of each of the guide layers 13. Preferably, the receiving chamber 15 communicates with the air vent 16 to connect the air vent 16 to each of the flow channels 14 of each of the guide layers 13. The cooling fan 2 is mounted in the heatsink board 1. Preferably, the cooling fan 2 is mounted on one of the separation plates 12 and is located in the receiving chamber 15.

As shown in FIG. 6, the cooling fan 2 provides a force convection effect to introduce the air into the air vent 16 of the top plate 10. In such a manner, the air is introduced from the air vent 16 of the top plate 10 and each of the flow channels 14 of the upper guide layer 13 to each of the flow channels 14 of the lower guide layers 13 so as to carry away and drain the heat of the heat source 3.

As shown in FIG. 7, the cooling fan 2 provides a force convection effect to introduce the air outward from the air vent 16 of the top plate 10. In such a manner, the air is introduced from each of the flow channels 14 of the lower guide layers 13 to each of the flow channels 14 of the upper guide layer 13 and the air vent 16 of the top plate 10 so as to carry away and drain the heat of the heat source 3.

Referring to FIG. 8, the air vent 16 of the top plate 10 is undefined. The cooling fan 2 provides a force convection effect to introduce the air outward from the heatsink board 1. In such a manner, the air is introduced from each of the flow channels 14 of the lower guide layers 13 to each of the flow channels 14 of the upper guide layer 13 so as to carry away and drain the heat of the heat source 3.

Referring to FIGS. 9-11, the cooling fan 2 is mounted on a side of the heatsink board 1. The heatsink board 1 includes a guide hood 4 mounted on a side of the heatsink board 1, and the cooling fan 2 is mounted in the guide hood 4. The guide hood 4 is formed with a receiving space 40 connected to each of the flow channels 14 of each of the guide layers 13.

As shown in FIGS. 10 and 11, the cooling fan 2 provides a force convection effect to introduce the air outward from the heatsink board 1. In such a manner, the air is introduced from each of the flow channels 14 of the lower guide layers 13 to each of the flow channels 14 of the upper guide layer 13 so as to carry away and drain the heat of the heat source 3.

Referring to FIGS. 12 and 13, the flow channels 14 have different geometric shapes.

Although the invention has been explained in relation to its preferred embodiment(s) as mentioned above, it is to be understood that many other possible modifications and variations can be made without departing from the scope of the present invention. It is, therefore, contemplated that the appended claim or claims will cover such modifications and variations that fall within the true scope of the invention.

Claims

1. A heat sink, comprising:

a heatsink board including a top plate, a bottom plate, a plurality of separation plates mounted between the top plate and the bottom plate to form a plurality of guide layers between the top plate, the separation plates and the bottom plate, and each of the guide layers being formed with a plurality of hollow flow channels.

2. The heat sink in accordance with claim 1, wherein the top plate contacts a heat source to absorb heat produced by the heat source.

3. The heat sink in accordance with claim 1, wherein the bottom plate contacts a heat source to absorb heat produced by the heat source.

4. The heat sink in accordance with claim 1, further comprising a cooling fan mounted in the heatsink board.

5. The heat sink in accordance with claim 4, wherein the top plate 10 is formed with an air vent, and the heatsink board includes a hollow receiving chamber formed between the guide layers and between the flow channels to connect each of the flow channels of each of the guide layers, and the cooling fan is mounted on one of the separation plates and is located in the receiving chamber.

6. The heat sink in accordance with claim 5, wherein the receiving chamber communicates with the air vent to connect the air vent to each of the flow channels of each of the guide layers.

7. The heat sink in accordance with claim 5, wherein the air vent of the top plate is closed.

8. The heat sink in accordance with claim 1, further comprising a cooling fan mounted on a side of the heatsink board.

9. The heat sink in accordance with claim 8, wherein the heatsink board includes a guide hood mounted on a side of the heatsink board, and the cooling fan is mounted in the guide hood.

10. The heat sink in accordance with claim 9, wherein the guide hood is formed with a receiving space connected to each of the flow channels of each of the guide layers.