Temperature-controlled rework system
A temperature-controlled rework system comprises a manifold assembly adapted to direct a cooling gas flow toward an area of a printed circuit board adjacent a rework zone to reduce a temperature of the adjacent area to below a temperature of the rework zone. The system also comprises a temperature control system adapted to monitor the temperature of the adjacent area.
The present invention relates generally to the field of electronic equipment and, more particularly, to a temperature-controlled rework system.
BACKGROUND OF THE INVENTIONAs the functionality and sophistication of electronic equipment increases, the complexity of the electronic equipment also increases. For example, electronic equipment often comprise a single- or multi-layer printed circuit board containing a variety of electronic components, such as application specific integrated circuits. Additionally, the density of the electronic components on the printed circuit board also increases.
In the course of testing, assembly or use, electronic components on the printed circuit board may require removal or replacement. However, the density of the components on the printed circuit board generally makes component replacement a difficult and delicate task. For example, one method for replacing an electronic component includes directing a stream of high temperature gas toward the component to soften or re-liquefy the solder coupling the component to the circuit board. However, adjacent components become a concern because the high temperature gas may re-liquefy adjacent component solder-connections, thereby possibly causing a disconnection between the adjacent component and the circuit board. Additionally, the high temperature gas flow may detrimentally affect the adjacent component.
SUMMARY OF THE INVENTIONIn accordance with one embodiment of the present invention, a temperature-controlled rework system comprises a manifold assembly adapted to direct a cooling gas flow toward an area of a printed circuit board adjacent a rework zone to reduce a temperature of the adjacent area to below a temperature of the rework zone. The system also comprises a temperature control system adapted to monitor the temperature of the adjacent area.
In accordance with another embodiment of the present invention, a rework manifold assembly comprises a manifold having a plurality of apertures adapted to direct a gas flow to an area of a printed circuit board adjacent a rework zone. The rework manifold also comprises a plurality of supports adapted to support the manifold.
BRIEF DESCRIPTION OF THE DRAWINGSFor a more complete understanding of the present invention and the advantages thereof, reference is now made to the following descriptions taken in connection with the accompanying drawings in which:
The preferred embodiments of the present invention and the advantages thereof are best understood by referring to
Briefly, air flow system 22 delivers a relatively cool or low temperature gas flow to manifold assembly 20 for cooling or maintaining areas of printed circuit board 14 adjacent to rework zone 28 at a reduced temperature to substantially prevent the re-liquification of solder attachments of adjacent components 12, thereby maintaining the adjacent components 12 at a reduced temperature and protecting the adjacent components 12 from elevated temperatures which may otherwise detrimentally affect the adjacent components 12. In the embodiment illustrated in
Temperature control system 24 is used to monitor the temperature of areas of printed circuit board 14 adjacent rework zone 28. Controller 26 is coupled to temperature control system 24 and air flow system 22 to regulate the reduced temperature air flow delivered to manifold assembly 20 based on temperatures of areas of printed circuit board 14 adjacent to rework zone 28. Controller 26 may comprise a computer, workstation, or other type of processing device or system. Controller 26 may be used to regulate the temperature of the reduced temperature air flow delivered to manifold assembly 20 and/or regulate the volume of the reduced temperature air flow delivered to manifold assembly 20. Thus, in operation, temperature control system 24 monitors and determines temperature conditions of areas adjacent to rework zone 28 so that controller 26 may regulate the reduced temperature air flow delivered to manifold assembly 20 via air flow system 22 to prevent adjacent areas and components 12 of printed circuit board 14 from being exposed to elevated temperatures which may otherwise detrimentally affect the adjacent components 12.
As illustrated in
In the embodiment illustrated in
Thus, in operation, high temperature gas flow 30 is directed downwardly to rework zone 28 to re-liquefy solder attaching a particular component 12 disposed within rework zone 28. Meanwhile, reduced temperature gas flow 58 is delivered from air flow system 22 to manifold assembly 20 where manifold 50 distributes reduced temperature gas flow 58 to areas adjacent to rework zone 28 to maintain the adjacent areas at a reduced temperature. Based on a temperature and/or temperature profile of areas adjacent rework zone 28 as determined via temperature control system 24, controller 26 regulates the temperature and/or flow rate of the reduced temperature gas flow 58 delivered to manifold assembly 20 via air flow system 22. Thus, system 10 reduces the temperature of the areas of printed circuit board 14 adjacent to rework zone 28 and provides a method of maintaining adjacent areas and components 12 of printed circuit board 14 preferably at a reduced temperature relative to rework zone 28, thereby protecting adjacent components 12 from elevated temperatures which may otherwise detrimentally affect the adjacent components 12.
Claims
1-21. (canceled)
22. A rework system, comprising:
- a manifold assembly adapted to deliver a low temperature gas flow to an area of a printed circuit board adjacent a rework zone, the manifold assembly adapted to cooperate with a nozzle for directing a high temperature gas flow toward the rework zone.
23. The system of claim 22, wherein the manifold assembly comprises an opening for receiving the nozzle.
24. The system of claim 22, wherein the manifold assembly comprises a manifold having plurality of apertures for delivering the low temperature gas flow.
25. The system of claim 22, wherein the manifold assembly is adapted to deliver the low temperature gas flow about a perimeter of the rework zone.
26. The system of claim 22, wherein the manifold assembly comprises a plurality of supports adapted to support a manifold of the manifold assembly a desired distance from the printed circuit board.
27. The system of claim 22, wherein the manifold assembly comprises a plurality of flexible supports.
28. The system of claim 22, wherein the manifold assembly comprises a plurality of supports adapted to accommodate height variations of the printed circuit board.
29. The system of claim 22, wherein the manifold assembly comprises a plurality of supports adapted to support a manifold of the manifold assembly a desired distance from the printed circuit board in response to a force applied to the manifold toward the printed circuit board.
30. A rework assembly, comprising:
- means for delivering a low temperature gas flow to an area of a printed circuit board adjacent a rework zone; and
- means formed in the delivering means for cooperating with a means for directing a high temperature gas flow toward the rework zone.
31. The system of claim 30, wherein the delivering means comprises means for delivering the low temperature gas flow about a perimeter of the rework zone.
32. The system of claim 30, wherein the delivering means comprises means for supporting a manifold of the delivering means a desired distance from the printed circuit board.
33. The system of claim 30, wherein the delivering means comprises means for accommodating height variations of the printed circuit board.
34. The system of claim 30, wherein the delivering means comprises means for supporting a manifold of the delivering means a desired distance from the printed circuit board in response to a force applied to the manifold toward the printed circuit board.
35. A rework system, comprising:
- a nozzle adapted to direct a high temperature gas flow toward a rework zone of a printed circuit board; and
- a manifold assembly disposed about a perimeter of the nozzle for delivering a low temperature gas flow about the perimeter of the rework zone.
36. The system of claim 35, wherein the manifold assembly comprises a centrally disposed opening for receiving the nozzle.
37. The system of claim 35, wherein the manifold assembly comprises a plurality of flexible supports.
38. The system of claim 35, wherein the manifold assembly is adapted to accommodate height variations of the printed circuit board.
39. The system of claim 35, wherein the manifold assembly comprises a plurality of supports for supporting a manifold a desired distance from the printed circuit board.
40. The system of claim 35, wherein the manifold assembly comprises a plurality of supports for supporting a manifold a desired distance from the printed circuit board in response to a force applied to the manifold toward the printed circuit board.
Type: Application
Filed: Apr 13, 2005
Publication Date: Aug 11, 2005
Inventor: Richard Luebs (Windsor, CO)
Application Number: 11/104,951