Heating and cooling appliance for use in a vehicle
A heating and cooling appliance for use in a vehicle has an outer box, a thermal box, an inner box, at least one semiconductor chip and at least one heatsink assembly. The outer box is mounted in the vehicle to conform to interior equipment and furnishings of the vehicle and has a switch. The thermal box is mounted in the outer box and has multiple insulated walls and at least one heat-conducting wall. The inner box is mounted in the thermal box. The semiconductor chip is attached to the heat-conducting wall and connected electrically to the switch. The heatsink assembly is attached to the semiconductor chip and mounted securely on the thermal box. Changing the position of the switch will change the operating mode of the semiconductor chip to either heat or cool the heat-conducting wall and the contents of the inner box.
1. Field of the Invention
The present invention relates to a heating and cooling appliance, especially to a heating and cooling appliance for use in a vehicle.
2. Description of the Prior Arts
When people drive or take trips in vehicles, people often bring hot drinks or cold drinks onto the vehicles. The hot drinks and the cold drinks quickly approach ambient temperature in the vehicles unless placed in a heating or cooling appliance. However, heating chests and portable refrigerators occupy a large volume in vehicles.
To overcome the shortcomings, the present invention provides a heating and cooling appliance for use in a vehicle to mitigate or obviate the aforementioned problems.
SUMMARY OF THE INVENTIONThe main objective of the present invention is to provide a heating and cooling appliance for use in a vehicle. The heating and cooling appliance for use in a vehicle has an outer box, a thermal box, an inner box, at least one semiconductor chip and at least one heatsink assembly. The outer box is mounted in the vehicle to conform to interior equipment and furnishings of the vehicle and has a switch. The thermal box is mounted in the outer box and has multiple insulated walls and at least one heat-conducting wall. The inner box is mounted in the thermal box. The semiconductor chip is attached to the heat-conducting wall and connected electrically to the switch on the outer box. The heatsink assembly is attached to the semiconductor chip and mounted securely on the thermal box. Changing the position of the switch will change the operating mode of the semiconductor chip to either heat or cool the heat-conducting wall and the contents of the inner box.
Other objectives, advantages and novel features of the invention will become more apparent from the following detailed description when taken in conjunction with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
With reference to
With further reference to
The thermal box (20) is hollow, is mounted in the inner space through the opening in the outer box (10) and has four outer sidewalls, a top opening, a top edge, multiple insulated walls (21) and at least one heat-conducting wall (22). The insulated walls (21) are formed in the outer sidewalls. Each heat-conducting wall (22) is formed in an insulated wall (21) and corresponds uniquely to a vent (12).
The inner box (30) is hollow, is mounted through the top opening in the thermal box (20) and has a top opening, a top edge, an outer sidewall, an optional flange (31) and an optional fluid passage (32). The flange (31) is formed on and extends out perpendicular from the top edge of the inner box (30) and attaches to the top edge of the thermal box (20). The fluid passage (32) is formed around the outer sidewall of the inner box (30) and is filled with a heat-conducting fluid.
Each semiconductor chip (40) is attached uniquely to a heat-conducting wall (22), corresponds to the fluid passage (32), electrically connects to the switch (11) and has an inside surface, an outside surface and heatsink grease (41). The inside surface is attached to the heat-conducting wall (22). The heatsink grease (41) is spread on the outside surface. Changing the position of the switch (11) will change the operation mode of the semiconductor chip (40). When the switch (11) is in the closed position, the semiconductor chip (40) stops operating. When the switch (11) is the heating position, the semiconductor chip (40) generates heat. When the switch (11) is in the cooling position, the semiconductor chip (40) cools.
With further reference to
The heating and cooling appliance as described has numerous advantages. The outer box (10) conforms to the interior equipment and furnishings of the vehicle and does not occupy unnecessary spaces. The switch (11) can change the operation way of the semiconductor chip (40). Then the semiconductor chip (40) can give out heat or cold as the user wish. When the heating and cooling appliance has multiple semiconductor chips, and the inner box has the fluid passage so the heating or cooling effects will be distributed evenly.
Even though numerous characteristics and advantages of the present invention have been set forth in the foregoing description, together with details of the structure and features of the invention, the disclosure is illustrative only. Changes may be made in the details, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims
1. A heating and cooling appliance in a vehicle comprising
- an outer box adapted to be mounted in a vehicle to conform to interior equipment and furnishings of the vehicle and having a top; four sides; an inner space; an opening formed in the top and communicating with the inner space; a switch mounted on the top; and at least one vent formed in a side;
- a thermal box being hollow, mounted in the inner space through the opening in the outer box and having four outer sidewalls; a top opening; a top edge; multiple insulated walls formed in the outer sidewalls; and at least one heat-conducting wall, and each heat-conducting wall formed in one of the heat insulated walls and corresponding to the at least one vent;
- an inner box being hollow, mounted through the top opening in the thermal box and having a top opening; a top edge; and an outer sidewall;
- at least one semiconductor chip, and each semiconductor chip attached to the at least one heat-conducting wall, electrically connecting to the switch and having an inside surface attached to the heat-conducting wall; an outside surface; and heatsink grease spread on the outside surface; and
- at least one heatsink assembly, and each heatsink assembly attached to the outside surface of one of the at least one semiconductor chip, mounted securely on a one of the at least one heat-conducting wall and having a heatsink fin assembly attached to the outside surface of the corresponding semiconductor chip, attached to the corresponding heat-conducting wall and having a base attached to the outside surface of the corresponding semiconductor chip, mounted securely on the corresponding heat-conducting wall and having an inside surface attached to the outside surface of the corresponding semiconductor chip; and an outside surface; and multiple fins formed on the outside surface of the base and having a distal end; and a fan mounted securely on the distal end of the fins and electrically connecting to the switch.
2. The heating and cooling appliance in a vehicle as claimed in claim 1, wherein the inner box further has a flange formed on and extending out perpendicular from the top edge of the inner box.
3. The heating and cooling appliance in a vehicle as claimed in claim 1, wherein the inner box further has a fluid passage formed around the outer sidewall of the inner box and filled with a heat-conducting fluid.
4. The heating and cooling appliance in a vehicle as claimed in claim 2, wherein the inner box further has a fluid passage formed around the outer sidewall of the inner box and filled with a heat-conducting fluid.
Type: Application
Filed: Jan 18, 2005
Publication Date: Jul 20, 2006
Inventor: Jiunn-Yih Wang (Taipei)
Application Number: 11/035,886
International Classification: F25B 21/02 (20060101);