Blade assembly cover
A gang blade assembly which controls the trajectory of detritus from a ball grid array substrate dicing operation is described. The assembly includes a cover which partially encases a hub with a plurality of blades. A brush is mounted on the cover to disrupt an air flow created by rotation of the hub and blades. The brush extends beneath the cover and has bristles which contact the hub. The bristles also serve to clear the hub of any detritus produced during dicing. More than one brush may be mounted on the cover.
The invention relates to protection devices used with dicing blades which cut semiconductor packages and devices from ball grid array substrates or similar configurations.
BACKGROUNDOne processing step in the fabrication of semiconductor products is the dicing of a substrate upon which a plurality of semiconductor devices is fabricated. Generally, circular saws are used for this dicing process. Known configurations of circular saws used in the semiconductor industry include a plurality of circular blades ganged onto a blade assembly, which dice along a plurality of parallel lines simultaneously and at predetermined spacings.
A problem encountered with the known dicing process is that cut material, or detritus, sprays in many directions. The spray of the detritus exposes workers to safety hazards, and creates a messy work environment. To overcome these problems, covers have been installed over the ganged blade assemblies. With specific reference to
In some instances an additional deflector may also be used, as shown in
Nonetheless, the gang blade assemblies 10, 110 have a disadvantage. The speed of rotation of the blade device 20 creates an air flow which lifts portions of the detritus within the cover 12 where it can contact with the blades 22. Further, the detritus often is deposited in front of the blades, and this loose debris can also contact the blades 22. Such contact may inflict damage on the blades 22, forcing premature replacement or repair of the gang blade assembly 10, 110 or of the blade device 20.
There is therefore a need for a protective assembly which mitigates collection and build up of detritus within the cover 12.
SUMMARYThe invention provides a blade assembly that includes a blade device and a cover partially encasing said blade device. The blade device includes a hub and at least one blade on the hub. In addition, a brush is mounted on the cover and extends toward the hub.
One aspect of the invention provides a blade assembly, comprising a blade device that has a hub and at least one blade on the hub, a cover partially encasing the blade device, and first and second brushes mounted on said cover and extending toward said hub.
The invention further provides a cover assembly for use with a gang blade assembly. The cover assembly includes a cover having a leading side and a top side, at least one bracket mounted on the cover, and at least one brush mounted on the at least one bracket. The at least one brush includes bristles bristles which extend under the top side toward the leading side.
The invention additionally provides a method of controlling the trajectory of detritus during a substrate dicing operation. The method includes the steps of placing a protective cover at least partially around the periphery of a blade assembly that includes a hub and at least one blade, rotating the hub and the at least one blade, dicing a ball grid array substrate with the rotating blade, the dicing producing detritus, and disrupting an air flow caused by the rotating.
These and other advantages and features of the invention will be more readily understood from the following detailed description of the invention which is provided in connection with the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
Referring now to
The cover 212 differs from the cover 12 in that it lacks a trailing side. Instead, the cover 212 includes only a top side 213 and a flange or leading side 215. At a location at which the trailing side would be located, a bracket 218 is mounted on the cover 212. The bracket 218 serves a dual purpose. The bracket 218 holds a deflector 216 and also holds a brush 219. The brush 219 is held so as to be tangential to the hub 24, thereby allowing bristles 221 to come into contact with the hub 24. The deflector 216 extends upwardly away from the hub 24 and arches outwardly away from the bristles 221.
An environment in which the gang blade assembly 210 may be used is in the semiconductor fabrication industry as a ball grid array substrate dicing apparatus, having substrate dicing blades 22, for dicing a substrate 50 (
Another important function of the brush 219 is that it disrupts the air flow produced by the rotation of the hub 24. As noted above regarding known gang blade assemblies, such as, for example, those illustrated in
Another embodiment is illustrated in
Illustrated in
While the invention has been described in detail in connection with exemplary embodiments known at the time, it should be readily understood that the invention is not limited to such disclosed embodiments. Rather, the invention can be modified to incorporate any number of variations, alterations, substitutions or equivalent arrangements not heretofore described, but which are commensurate with the spirit and scope of the invention. For example, although some of the illustrated gang blade assemblies (
Claims
1. A blade assembly, comprising:
- a blade device, comprising: a hub; at least one semiconductor cutting blade on said hub; a cover partially encasing said blade device; and a brush mounted on said cover and extending toward said hub and extending across said at least one blade on said hub, wherein said brush is located on a line tangent to an outer edge of said blade device, and wherein said brush includes bristles which contact said hub.
2. The blade assembly of claim 1, wherein said hub is generally circular in profile.
3. (canceled)
4. The blade assembly of claim 1, wherein said bristles contact said hub perpendicular to a surface of the hub.
5. The blade assembly of claim 1, wherein said brush extends across all the at least one blade on said hub.
6. The blade assembly of claim 1, comprising a plurality of semiconductor cutting blades spaced apart from each other on said hub.
7. The blade assembly of claim 1, comprising a water nozzle directed toward said at least one semiconductor cutting blade.
8. The blade assembly of claim 7, comprising a shield mounted on a leading side of said cover.
9. The blade assembly of claim 1, further comprising a bracket, wherein said brush is mounted on said bracket.
10. The blade assembly of claim 9 further comprising a deflector mounted on said bracket.
11. The blade assembly of claim 10 wherein said deflector extends above said cover.
12. The blade assembly of claim 11 wherein said deflector extends below said cover.
13. The blade assembly of claim 9 wherein said cover includes a trailing side, said bracket being mounted on said trailing side.
14. The blade assembly of claim 13 wherein said cover includes a leading side.
15. The blade assembly of claim 14 wherein said cover includes a top side extending between said trailing and leading sides.
16. The blade assembly of claim 15 wherein said top side is arched.
17-46. (canceled)
47. A blade assembly for cutting semiconductor products, comprising:
- a blade device, comprising: a hub; and at least one semiconductor cutting blade on said hub; a cover over said blade device; at least one brush mounted on said cover, wherein said brush includes bristles which contact a surface of said hub.
Type: Application
Filed: Mar 30, 2006
Publication Date: Aug 3, 2006
Inventor: Ernest Hamilton (Meridian, ID)
Application Number: 11/392,788
International Classification: B26D 1/00 (20060101);