Thermal dissipation device
A thermal dissipation device includes a heat sink; and at least a heat pipe that pastes on the surface of the heat sink to conduct the thermal to the heat sink efficiently for thermal dissipation.
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The present invention relates to a thermal dissipation device, especially to a thermal dissipation device used on the heating electrical components for thermal dissipation performance.
BACKGROUND OF THE INVENTION Thermal dissipation devices are very popular in the electrical devices, such as a computer, which CPU has one thermal dissipation device (i.e. cooler) with a fan for increasing the heat conduction performance. If the performance of the thermal dissipation device is not good, CPU will be over heating and the processing speed of CPU will also be affected, or even forces this CPU burning out. Therefore, a good thermal dissipation device is a very important component for high efficiency electronic devices (such as a computer).
An objective of the present invention is to provide a new thermal dissipation device able to conduct thermal efficiently, increase thermal dissipation area, enhance the thermal dissipation performance, decrease space and optimize the heat sink performance of the fan.
BRIEF DESCRIPTION OF THE INVENTIONAccording to the present invention, a thermal dissipation device includes a heat sink; and at least a heat pipe that pastes on the surface of the heat sink to conduct the thermal to the heat sink efficiently for thermal dissipation.
In accordance with one aspect of the present invention, the thermal dissipation device also includes a base site to be connected with a heating electronic component.
In accordance with one aspect of the present invention, the heat sink of the thermal dissipation device is used to connect with a fan.
In accordance with one aspect of the present invention, the heat sink of the thermal dissipation device is cylindrical that is implemented by several heat sink fins.
In accordance with one aspect of the present invention, the heat pipe of the thermal dissipation device is soldered up the surface of the heat sink.
The present invention may best be understood through the following description with reference to the accompanying drawings, in which:
BRIEF DESCRIPTION OF THE DRAWINGS
To sum up, the thermal dissipation device of the present invention is a newly advantaged design to conduct thermal efficiently, increase thermal surface area, minimize the space, and enhance thermal performance of the heat sink and the fan. Any outlook modification, such as the number of heat pipe or the shape of the heat sink, is included in the present invention if the heat pipe pasted on the external surface of the heat sink.
While the invention has been described in terms of what are presently considered to be the most practical and preferred embodiments, it is to be understood that the invention need not be limited to the disclosed embodiment. On the contrary, it is intended to cover various modifications and similar arrangements included within the spirit and scope of the appended claims which are to be accorded with the broadest interpretation so as to encompass all such modifications and similar structures.
Claims
1. A thermal dissipation device including:
- a heat sink; and
- at least a heat pipe that pastes on the surface of said heat sink to conduct the thermal to said heat sink efficiently for thermal dissipation.
2. The device according to claim 1 wherein said thermal dissipation device further includes a base site to be connected with a heating electronic component.
3. The device according to claim 1 wherein said heat sink of said thermal dissipation device is used to connect with a fan.
4. The device according to claim 1 wherein said heat sink of said thermal dissipation device is cylindrical that is implemented by several heat sink fins.
5. The device according to claim 1 wherein said heat pipe of said thermal dissipation device is soldered up the surface of said heat sink.
Type: Application
Filed: Jul 26, 2005
Publication Date: Aug 24, 2006
Applicant:
Inventor: Ryan Chen (Taipei City)
Application Number: 11/189,339
International Classification: F28D 15/00 (20060101);