Textile information carrier and method for producing a textile information carrier

Abstract

A textile information carrier is described, consisting of a textile label or textile goods and a textile detection wafer having a textile carrier, which is joined to the textile label or the textile goods. A textile antenna and an electronic chip module connected to the textile antenna are disposed in or on the textile carrier.

Description

BACKGROUND OF THE INVENTION

The invention relates to a textile information carrier and a method for producing a textile information carrier.

Textile goods are usually provided with textile labels by the manufacturer, clothing manufacturer, distributor or designer, which contain optically readable information on the composition of the goods, instructions for the care and cleaning and information on the garment size, origin, trademark or trade name as well as the designer.

Especially in high-quality textile goods, designer labels, so-called Jacquard labels are used for identification or labels printed with the inscription of the producer or the trademark, so-called satin labels are used, these being manufactured in expensive processes to make imitations difficult.

In order to be able to more easily identify imitations or incorrect labels or also to identify textile goods during manufacture, processing, during transportation, during storage, during distribution and during care and cleaning, electronic data carriers are being increasingly used which contain redundant or additional information on the optically readable textile label and which can only be read by means of a special reader. The advantage of information stored on electronic data carriers is that this is largely tamper-proof and insensitive to contamination and cleaning agents and it can also be read without optical sight.

SUMMARY OF THE INVENTION

It is the object of the invention to provide a textile information carrier which links the information of an electronic data carrier to information of a textile label such as Jacquard labels or satin labels or a textile product such as inside pocket or inner lining of a garment and maintains the textile properties of the textile label or the textile goods.

This object is solved by a textile information carrier consisting of a textile label or textile goods and a textile detection wafer joined to the textile label or the textile goods, commprising a textile carrier in or on which are disposed a textile antenna and an electronic chip module connected to the textile antenna.

In the textile information carrier according to the information, the textile label or the textile goods, e.g. the jacket inner pocket or the inner lining of a garment on the one hand and the textile detection wafer on the other hand are first manufactured separately and then connected. A textile detection wafer designates a textile carrier with a textile antenna and an electronic chip module.

As a result, the structure and the configuration of the textile label or the textile goods as well as its manufacturing method can be retained unchanged. This is especially advantageous in designer labels for high-quality textile goods which are conventionally woven in an expensive computer-controlled needle weaving method in a continuous strip and then cut.

The textile detection wafer comprising the textile carrier with the textile antenna and the chip module can be manufactured in a standardised manner independently of the textile label or the textile goods and is suitable for connection to different textile labels or textile goods. Apart from the electronic chip module itself and electrically conductive components of the textile antenna, which nevertheless exhibit textile properties however, all the other components of the textile information carrier are made of textile material so that the textile property, especially the flexibility is safeguarded.

The textile detection wafer with its inner side carrying the electronic chip module is advantageously joined to the textile label or the textile goods so that it is reversibly detachable or irreversibly undetachable.

As a result, the electronic chip module is not visible and is protected from mechanical damage. In the case of reversibly detachable textile detection wafers, the textile detection wafer can be removed, for example, after a manufacturing or transportation process if the information is no longer required subsequently or is not to be used by unauthorised persons.

In the case of an irreversibly undetachably connected textile detection wafer, the information should remain permanently linked to the textile label or the textile goods. This makes tampering difficult and impossible without destroying the bond between textile label or textile goods on the one hand and the textile detection wafer on the other hand.

The textile detection wafer can be joined to the textile label or the textile goods by welding or bonding or coating or laminating or gluing or by means of an adhesive film or by means of a patch connection produced under heat and pressure.

The textile detection wafer is joined directly to the textile label or the textile goods by fusing of fibres or filaments or indirectly by an adhesive material. The textile properties of the joined layers of the textile detection wafer and the textile label or textile goods are thus retained.

The connection preferably consists of discrete connecting points or very fine perforated adhesive film. As a result of the restriction to discrete connection points or a very fine, that is thin and flexible, perforated adhesive film, any stiffening of the joined layers of the textile detection wafer and the textile label or the textile goods is avoided.

Furthermore, the connection can consist of self-adhesive embroidery yarn which is embroidered onto the textile carrier of the textile detection wafer.

The embroidered-on self-adhesive embroidery yarn produces a grid which likewise provides discrete connecting points or discrete connecting lines and thus avoids any stiffening of the joined layers of the textile detection wafer and the textile label or the textile goods as a result of the connection not being over the entire surface.

Alternatively, the textile detection wafer can be joined to the textile label or the textile goods by a sewing or embroidery process.

With the textile structure of this join, any stiffening of the joined layers of the textile detection wafer or the textile label or the textile goods is also avoided.

The antenna can be woven-in in a common textile manufacturing process of the textile carrier.

The antenna can be manufactured together with the manufacture of the textile antenna in one work process. The antenna is thereby directly integrated into the textile carrier of the textile detection wafer.

Alternatively, the antenna can be embroidered onto the textile detection wafer in a separate textile manufacturing process.

In the embroidery embodiment there is a greater freedom in the geometrically constructive configuration of the antenna. Whereas in weaving the antenna can only be woven-in in the direction of manufacture or transverse thereto, embroidery allows the antenna to be arranged in any directions and changes of direction.

The textile carrier can be joined to the adhesive film before the embroidery process.

Since the textile carrier as an embroidery base is present still uncut and therefore the dimensions are larger compared to the dimensions of the textile detection wafer, previous joining to an adhesive film is more economical and can be carried out without impairing the subsequently embroidered antenna structure.

The woven antenna preferably consists of a hybrid yarn comprising at least one synthetic and/or natural fibre or synthetic and/or natural multifibres and/or at least one synthetic and/or natural filament or of synthetic and/or natural multifilaments and of at least one electrically conductive filament.

Such a hybrid yarn has a higher tearing resistance than a yarn consisting exclusively of electrically conductive filaments. As a result, it can be processed on conventional industrial textile machines.

The embroidered antenna preferably consists of an upper thread and a lower thread of which one of the threads consists of a hybrid yarn comprising at least one synthetic and/or natural fibre or synthetic and/or natural multifibres and/or at least one synthetic and/or natural filament or of synthetic and/or natural multifilaments and of at least one electrically conductive filament and the other thread consists of a yarn comprising at least one synthetic and/or natural fibre or synthetic and/or natural multifibres and/or at least one synthetic and/or natural filament or of synthetic and/or natural multifilaments.

The textile properties of upper and lower threads are thereby matched to one another so that processing on conventional industrial textile machines is likewise possible in this case.

The at least one synthetic and/or natural fibre or the synthetic and/or natural multifibres and/or the at least one synthetic and/or natural filament or the synthetic and/or natural multifilaments can be twisted or intermingled/textured and then twisted with the at least one electrically conductive filament.

The tearing resistance of the electrically conductive filament is hereby improved. Since the electrically conductive filament undergoes a permanent elongation in the event of an expansion and subsequent contraction of the hybrid yarn, the overlength of the electrically conductive filament can be distributed uniformly around the synthetic and/or natural fibre or the synthetic and/or natural multifibres and/or the synthetic and/or natural filament or the synthetic and/or natural multifilaments.

The synthetic fibres or synthetic multifibres or synthetic filaments or synthetic multifilaments advantageously form a polyamide or polyester textured yarn.

This material is especially tear-resistant and can easily be processed on industrial textile machines.

The electrically conductive filaments are preferably copper or brass or aluminium monofilaments or multifilaments.

A good electrical conductivity is hereby achieved. In addition, the material is flexible with low spring elasticity and therefore can easily be processed in combination with natural or synthetic fibres or filaments on industrial textile machines.

The electrically conductive filaments can also be polyamide or polyester monofilaments or multifilaments with vapour-coated or electrolytically coated metal surfaces such as those marketed under the trade name X-Static for example.

The textile properties and the processability on industrial textile machines of these electrically conductive filaments approximately correspond to those of uncoated filaments or multifilaments.

The electrically conductive filaments can also be carbon yarns such as those marketed under the trade name Beltron, for example.

Carbon yarns are distinguished by a high elasticity and tearing resistance and are resistant to chemical influences, e.g. during chemical cleaning.

The electrically conductive filaments can also be cut aluminium or aluminium-plastic composite films such as those marketed under the trade name Lurex for example.

These electrically conductive filaments are particularly inexpensive and flexible.

The electrically cut filaments can also be metal cut fibres disposed in the spun yarn.

In this embodiment of the electrically conductive filaments, short metal cut fibres are disposed integrally in the spun yarn whereby these filaments are elastically stretchable without permanent elongation of the metal cut fibres. This property facilitates processing on industrial textile machines at high production rates.

The antenna can be constructed as a half-wave dipole.

This ensures good matching to the output impedance of the electronic detection wafer and a good antenna efficiency.

The antenna can be constructed as a shortened dipole with extension coils.

The embodiment makes it possible to arrange the antenna on a textile detection wafer whose dimensions are smaller than the half-wavelength of the working frequency of the electronic detection wafer.

The antenna can be constructed as a quarter-wave ground plane comprising an emitter and a counterpoise.

In this embodiment matching to the output impedance of the electronic detection wafer and a good antenna efficiency are likewise ensured. In addition, this embodiment only requires a space requirement on the textile detection wafer which lies somewhat above a quarter wavelength of the working frequency of the electronic detection wafer.

The antenna can be constructed as a shortened ground plane comprising a shortened emitter with an extension coil and a counterpoise.

This embodiment is suitable for a textile detection wafer whose dimensions are smaller than the quarter wavelength of the working frequency of the electronic detection wafer. Compared to a shortened dipole, the space requirement is further reduced by about a half.

The antenna can be constructed as a magnetic loop.

In the case of a magnetic loop whose dimensions are still smaller compared to a half-wave dipole or a quarter-wave ground plane, the magnetic component of the electromagnetic field predominates in the near field. Damping influences from electrically conductive materials in the vicinity of the antenna thus have a weaker influence on the field propagation.

The connections of the antenna can be connected to connections of the chip module by an adhesive bond comprising an electrically conductive, furnace- or UV-curable adhesive paste.

This embodiment makes it possible to achieve a reliable connection between the connections whilst at the same time protecting the textile structure. The embodiment is suitable for manual fabrication of small numbers of items and also for mechanical fabrication with large numbers of items.

The connections of the antenna can also be joined to connections of the chip module by an adhesive bond comprising an electrically conductive hot melt adhesive which can be applied warm and in liquid form and which hardens at ambient temperature.

Alternatively, the connections of the antenna can be joined to connections of the chip module by an adhesive bond comprising an electrically conductive hot melt adhesive provided on the textile carrier or connections of the chip module which can be activated by temporary heating and then hardened at ambient temperature.

This embodiment makes it possible to achieve a reliable connection between the connections whilst at the same time protecting the textile structure. The embodiment is especially suitable for manual fabrication of small numbers of items but is also suitable for mechanical fabrication with large numbers of items.

The connections of the antenna can be joined to connections of the chip module by an adhesive bond comprising an electrically conductive adhesive film or an electrically conductive adhesive foil where the adhesive film or the adhesive foil is disposed on the connections of the chip module and is activated by pressure and heat during the adhesive process.

This embodiment is also suitable for rapid manual and industrial fabrication since the connections only need to be brought in contact briefly by pressure and heat to make the connection and further work steps are eliminated.

The connections of the antenna can be joined to the connections of the chip module by a welded joint.

In this embodiment optimal contact between the connections is achieved in one operation. However, the expenditure on apparatus is higher compared to an adhesive joint.

The connections of the antenna are joined to connections of the chip module by a crimped connection.

This purely mechanical connection is suitable both for manual fabrication with a small number of items and also for mechanical fabrication with large numbers of items. As a result of a liability to corrosion however, the reliability is somewhat lower compared to the other said connections.

The chip module can be fixed on the textile carrier by embroidery yarn.

By this means during embroidery of the textile carrier to produce the textile antenna, the textile antenna can be additionally fitted with the chip module and said module can be fixed. If, in this case, the embroidery yarn is used with an electrically conductive filament of the textile antenna, electrical contact is already produced between the connections of the textile antenna and the connections of the chip module.

The embroidery yarn can wrap around soldering tags of the chip module.

As a result, commercially available chip modules can be fixed and contacted by the embroidery yarn without any modification.

Alternatively, the embroidery yarn can penetrate into holes in the soldering tags of the chip module.

This embodiment allows the chip module to be fixed and contacted positively.

The chip module and the connections of the chip module can be potted using a protective compound as a globtop.

By this means the chip module and the connections of the chip module with the antenna are fixed on the textile carrier and protected against mechanical and chemical influences such as those which occur during usage of the textile goods and cleaning. Silicone, for example, is suitable as the protective compound.

The textile detection wafers preferably have constant dimensions when the textile label or the textile goods are different sizes, which are dimensioned at least according to the smallest technically still-feasible size of the textile detection wafer.

As a result of the constant dimensions of the textile carrier, this can be manufactured with the antenna and the electronic chip module in standardised form and joined to textile labels or textile goods or the same or arbitrarily larger dimensions to form a textile information carrier. A considerably cost advantage is thus obtained during manufacture. The smallest technically still-feasible size of the textile detection wafer is predetermined by the working frequency of the electronic chip module and the geometrical dimensions of the textile antenna for which an adequate reading range is still ensured.

The textile detection wafer can have standard electrical and electronic properties for different sizes of textile label or textile goods.

In addition, the textile detection wafer can have the same reading range for different sizes of textile label or textile goods.

This type of standardisation ensures that devices with readers fir identification of textile labels and textile goods during the manufacture, processing, during transportation, during storage, during distribution and during care and cleaning can be set up according to standard guidelines and parameters using reference detection wafers. Reliable identification of real textile information carriers used is then ensured during subsequent operation.

It is furthermore the object of the invention to provide a method for manufacturing a textile information carrier which links the information of an electronic data carrier to information of a textile label such as Jacquard labels or satin labels or a textile product such as inside pocket or inner lining of a garment and safeguards the textile properties of the textile label or the textile goods.

The object is solved by the features of claim 37.

Further developments and advantageous embodiments are obtained from the dependent claims.

The textile detection wafer comprising the textile carrier with the textile antenna and the chip module can be manufactured in a standardised fashion independently of the textile label or the textile goods and is suitable for connection to different textile labels or textile goods. Apart from the electronic chip module itself and electrically conductive components of the textile antenna which nevertheless still exhibit textile properties, all the other components of the textile information carrier are made of textile material so that the textile property, especially the flexibility, is safeguarded.

The textile detection wafer is preferably made of a textile carrier, an antenna is embroidered onto the textile carrier, a chip module is then positioned with its connections above connections of the antenna and then the connections of the chip module are connected in an electrically conducting fashion to the connections of the antenna.

In the embroidery embodiment there is a greater freedom in the geometrically constructive configuration of the antenna. Whereas in weaving the antenna can only be woven-in in the direction of manufacture or transverse thereto, embroidery allows the antenna to be arranged in any directions and changes of direction. In this case, the antenna can be manufactured on conventional industrial embroidery machines and thus can be manufactured very economically.

According to a further development, the textile detection wafer can be produced on a textile carrier, an antenna can be embroidered on the textile carrier and a chip module can be positioned over connections of the antenna and fixed by embroidery yarn. At the same time as the fixing or subsequently, the connections of the chip module can be connected to the connections of the antenna in an electrically conducting fashion.

As a result, complete detection wafers can be completely manufactured on an easily modified industrial embroidery machine.

In addition, textile labels or textile goods of different size can be joined to textile detection wafers of constant dimensions, the dimensions being determined according to the smallest still feasible size of the textile detection wafer.

As a result of the constant dimensions of the textile carrier, this can be manufactured with the antenna and the electronic chip module in standardised form and joined to textile labels or textile goods or the same or arbitrarily larger dimensions to form a textile information carrier. A considerable cost advantage is thus obtained during manufacture.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention is explained hereinafter with reference to an exemplary embodiment shown in the drawings.

In the figures:

FIG. 1 is an embroidery base provided with embroidered antenna structures,

FIG. 2 is a schematic diagram of an equipping process using strip-shaped textile carriers,

FIG. 3 is a schematic diagram of an equipping process using isolated textile carriers,

FIG. 4 is a schematic diagram of a final manufacturing process,

FIG. 5 is a section through a textile information carrier.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

FIG. 1 shows an embroidery base 10, also designated as embroidery web, with embroidered structures of textile antennae 12. Fabrication takes place on an embroidery machine conventionally used in the textile industry. For this purpose a section of embroidery base 10 from a roll 14 is fixed as raw material in an embroidery frame of the embroidery machine over the height and width of the embroidery frame and the structures of textile antennae 12 are embroidered in the selected pattern repeat over the entire width of the embroidery frame of the knitting machine. The embroidery base 10 located on the roll 14 can be provided with an adhesive film.

The embroidery process is then repeated line by line over the height of the embroidery base. The embroidered section of the embroidery base 10 is then cut from the roll 14 and a new section from the roll 14 is clamped in the embroidery frame and embroidered in similar fashion. The individual textile detection wafers with the antenna structures 12 can be cut or stamped before or after equipping with the electronic chip module.

By modifying a conventional embroidery machine, chip modules can also be supplied and fixed with the embroidery yarn. In the same operation connections of the chip module can be connected electrically preliminarily and permanently to connections of the textile antenna.

FIG. 2 shows a schematic diagram of an equipping process with strip-shaped cohesive textile carriers 20 for the case where the chip modules 16 have not already been equipped and contacted during the embroidery but this takes place in a separate equipping process. Chip modules 16 are positioned using an equipping device 18 at the contact point provided over the connections of the textile antenna and then placed on the textile carrier 20. The electronic chip module 16 is then connected to the textile carrier 20 and the connections of the electronic chip module 16 are connected to the connections of the antenna by pressure p and heat T. It is also possible to exclusively connect the connections of the electronic chip module 16 to the connections of the antenna and fix mechanically over the antenna. A protective compound 24 is then applied over the chip module 16 and the connections between the chip module 16 and the antenna by means of a spray device 22.

If the embroidery base has not yet been provided with an adhesive film, an adhesive film can be supplied at the same time as the equipping process and connected to the textile carrier 20. The cohesive textile detection wafers 40 on the final blank are then cut or stamped into individual textile detection wafers 40. Finally, a functional test of the finished textile detection wafers 40 with the electronic chip modules 16 is then carried out using a reader 26.

FIG. 3 shows a schematic diagram of an equipping process using isolated textile carriers 20 each of which have already been cut to the final dimensions. The textile carriers 20 are located in a storage device 28. In addition, chip modules 16 are located in a storage device 30. A textile carrier 20 and a chip module 16 are each supplied successively individually to an equipping device 18 by means of a feed device 32, the textile carrier 20 is equipped with a chip module 16 and a connection is made between the connections of the chip module 16 and the connections of the textile antenna by pressure p and heat T. Then, a protective compound 24 over the chip module 16 and the connections between the chip module 16 and the antenna by means of a spray device 22. The finished textile detection wafers 40 finally enter into a storage device 34.

FIG. 4 shows a schematic diagram of a final production process. Finely perforated adhesive film from a roll 38 and then textile detection wafers 40 with chip modules and antennae from a storage device 34 are supplied to a web of textile labels 44, such as Jacquard labels or satin labels on a roll 36, for example. The textile detection wafers 40 are joined to the backs of the textile labels 44 over the finely perforated adhesive film under pressure 9 and heat T to form textile information carriers. The still cohesive textile information carriers are then separated by separating cuts of the web.

FIG. 5 shows a section through a textile information carrier. This consists of a textile label 44, comprising a front side 52 which carries optically visible information and a back side 54 which subsequently faces the textile goods when sewn in. A textile detection wafer 40 is connected to the back side 54 of the textile label 44. The textile detection wafer 40 comprises a textile carrier 20, an electronic chip module 16 with a protective compound 24 and an embroidered antenna comprising a hybrid yarn 46 and a yarn 48. The embroidered antenna is positioned on the front side of the textile detection wafer 40 such that the hybrid yarn 46 comprising, for example, polyester texture multifilaments and copper monofilaments comes to rest against the back side 54 of the textile label 44. The textile antenna and the chip module 16 thereby have maximum protection inside the structure.

The part of the embroidered textile antenna on the back side of the textile detection wafer 40 consists of only one yarn 48 comprising polyester texture filaments or a normal embroidery yarn. The connection between the textile label 44 and the textile detection wafer 40 is made by adhesive points 50 or a finely perforated adhesive film.

Claims

1. A textile information carrier, consisting of a textile label or textile goods and a textile detection wafer joined to the textile label or the textile goods, comprising a textile carrier in or on which are disposed a textile antenna and an electronic chip module connected to the textile antenna.

2. The textile information carrier according to claim 1, wherein the textile detection wafer is joined with its inner side bearing the electronic chip module reversibly detachably or irreversibly undetachably to the textile label or the textile goods.

3. The textile information carrier according to claim 1, wherein the textile detection wafer is joined to the textile label or the textile goods by welding or bonding or coating or laminating or adhesion or by means of an adhesive film or by means of a patch joint produced under heat and pressure.

4. The textile information carrier according to claim 3, wherein the connection consists of discrete connection points or very fine perforated adhesive film.

5. The textile information carrier according to claim 3, wherein the connection consists of self-adhesive embroidery yarn which is embroidered onto the textile carrier of the textile detection wafer.

6. The textile information carrier according to claim 1, wherein the textile detection wafer is joined to the textile label or the textile goods by a sewing or embroidery connection.

7. The textile information carrier according to claim 1, wherein the antenna is woven-in in a common textile manufacturing process of the textile carrier.

8. The textile information carrier according to claim 1, wherein the antenna is embroidered in a separate textile manufacturing process on the textile carrier.

9. The textile information carrier according to claim 3, wherein the textile carrier is joined to the adhesive film before the embroidery process.

10. The textile information carrier according to claim 7, wherein the woven antenna consists of a hybrid yarn comprising at least one synthetic and/or natural fibre or of synthetic and/or natural multifibres or of at least one synthetic and/or natural filament or of synthetic and/or natural multifilaments and of at least one electrically conductive filament.

11. The textile information carrier according to claim 8, wherein the embroidered antenna comprises an upper thread and a lower thread of which one of the threads consists of a hybrid yarn comprising at least one synthetic and/or natural fibre or of synthetic and/or natural multifibres or of at least one synthetic and/or natural filament or of synthetic and/or natural multifilaments and of at least one electrically conductive filament, and the other thread consists of a yarn comprising at least one synthetic and/or natural fibre or of synthetic and/or natural multifibres or of at least one synthetic and/or natural filament or of synthetic and/or natural multifilaments.

12. The textile information carrier according to claim 10, wherein the at least one synthetic and/or natural fibre or of synthetic and/or natural multifibres or the at least one synthetic and/or natural filament or the synthetic and/or natural multifilaments is twisted or intermingled/textured and then twisted with the at least one electrically conductive filament.

13. The textile information carrier according to claim 10, wherein the synthetic fibres or synthetic multifibres or synthetic filaments or synthetic multifilaments form a polyamide or polyester texture yarn.

14. The textile information carrier according to claim 10, wherein the electrically conductive filaments are copper or brass or aluminium monofilaments or multifilaments.

15. The textile information carrier according to claim 10, wherein the electrically conductive filaments are polyamide or polyester monofilaments or multifilaments with vapour-coated or electrolytically coated metal surfaces.

16. The textile information carrier according to claim 10, wherein the electrically conductive filaments are carbon yarns.

17. The textile information carrier according to claim 10, wherein the electrically conductive filaments are cut aluminium or aluminium-plastic composite films.

18. The textile information carrier according to claim 10, wherein the electrically conductive filaments are metal cut fibres disposed in the spun yarn.

19. The textile information carrier according claim 1, wherein the antenna is constructed as a half-wave dipole.

20. The textile information carrier according claim 1, wherein the antenna is constructed as a shortened dipole with extension coils.

21. The textile information carrier according to claim 1, wherein the antenna is constructed as a quarter-wave ground plane comprising an emitter and a counterpoise.

22. The textile information carrier according to claim 1, wherein the antenna is constructed as an electrically shortened ground plane comprising a shortened emitter with an extension coil and a counterpoise.

23. The textile information carrier according to claim 1, wherein the antenna is constructed as a magnetic loop.

24. The textile information carrier according to claim 1, wherein connections of the antenna are joined to connections of the chip module by an adhesive join comprising an electrically conductive, oven- or UV-curable adhesive paste.

25. The textile information carrier according to claim 1, wherein connections of the antenna are joined to connections of the chip module by an adhesive join comprising an electrically conductive hot-melt adhesive which is applied warm and in liquid form, which melts under heating and is cured at ambient temperature.

26. The textile information carrier according to claim 1, wherein connections of the antenna are joined to connections of the chip module by an adhesive join comprising an electrically conductive hot-melt adhesive provided on the textile carrier or connections of the chip module, which is activated by temporary heating and then cured at ambient temperature.

27. The textile information carrier according to claim 1, wherein connections of the antenna are joined to connections of the chip module by an adhesive join comprising an electrically conductive adhesive foil or an electrically conductive adhesive foil, wherein the adhesive film or adhesive foil are disposed in the connections of the chip module and is activated by pressure and heat during the adhesion process.

28. The textile information carrier according to claim 1, wherein connections of the antenna are joined to connections of the chip module by a welded join.

29. The textile information carrier according to claim 1, wherein connections of the antenna are joined to connections of the chip module by a crimp joint.

30. The textile information carrier according to claim 1, wherein the chip module is fixed on the textile carrier by embroidery yarn.

31. The textile information carrier according to claim 30, wherein the embroidery yarn wraps around soldering tags of the chip module.

32. The textile information carrier according to claim 30, wherein the embroidery yarn penetrates into holes in soldering tags of the chip module.

33. The textile information carrier according to claim 1, wherein the chip module and the connections of the chip module with the antenna are potted as a globtop using a protective compound.

34. The textile information carrier according to claim 1, wherein the textile detection wafer has constant dimensions for different sizes of textile label or textile goods, which are determined according to the smallest technically still-feasible size of the textile detection wafer.

35. The textile information carrier according to claim 1, wherein the textile detection wafer has uniform electrical and electronic properties for different sizes of textile label or textile goods.

36. The textile information carrier according to claim 1, wherein the textile detection wafer has the same reading range for different sizes of textile label or textile goods.

37. A method for manufacturing a textile information carrier having the features according to claim 1, wherein a textile label or textile goods on the one hand and a textile detection wafer comprising a textile carrier in or on which are disposed a textile antenna and an electronic chip module connected to the textile antenna on the other hand, are first manufactured separately and then joined together.

38. The method according to claim 37, wherein the textile detection wafer is made from a textile carrier, an antenna is embroidered on the textile carrier, a chip module with its connections is then positioned over connections of the antenna and the connections of the chip module are then connected in an electrically conducting fashion to the connections of the antenna.

39. The method according to claim 37, wherein the textile detection wafer is made from a textile carrier, an antenna is embroidered on the textile carrier, and a chip module is positioned over connections of the antenna and fixed by means of embroidery yarn and at the same time as the fixing or subsequently, the connections of the chip module are connected in an electrically conducting fashion to the connections of the antenna.

40. The method according to claim 37, wherein textile labels or textile goods of different size are connected to textile detection wafers of constant dimensions, wherein the dimensions are determined according to the smallest technically still feasible size of the textile detection wafer.