ILLUMINATION OPTICAL SYSTEM AND EXPOSURE APPARATUS USING THE SAME
An illumination optical system for illuminating an illuminated surface using light from a light source includes a first diffraction optical element upon which the light from the light source is incident, and a second diffraction optical element upon which the light from the light source is incident, wherein the light from the first diffraction optical element forms a first part of an illumination distribution on a predetermined surface that substantially has a Fourier transform relationship with the illuminated surface, and the light from the second diffraction optical element forms a second part of the illumination distribution.
This application is a continuation application of U.S. patent application Ser. No. 10/538,230, which was filed Jun. 9, 2005, to which priority under 35 U.S.C. § 120 is claimed and the entirety of which is hereby incorporated by reference.
This application also claims foreign priority benefits of International Patent Application No. PCT/JP2004/013592, filed Sep. 10, 2004 and Japanese Patent Application No. 2003-321419, filed on Sep. 12, 2003, which also are hereby incorporated by reference herein in its entirety as if fully set forth herein.
TECHNICAL FIELDThe present invention relates to illumination optical systems and exposure apparatuses using the same, and particularly to an illumination optical system that handles polarization and an exposure apparatus that exposes an object, such as a single crystal substrate for a semiconductor, a glass plate for a liquid crystal display.
BACKGROUND ARTAs a semiconductor device becomes finer, an exposure wavelength used in a semiconductor exposure apparatus becomes shorter down to a KrF laser (with a wavelength of 248 nm), an ArF laser (with a wavelength of 193 nm), and a F2 laser with a wavelength of 157 nm. At the same time, the NA of a projection optical system becomes higher up to 0.90 in an ordinary atmosphere, and beyond 1.2 for a projection optical system of an immersion type exposure apparatus.
The fine patterning of a semiconductor device is a major factor that supports the dynamics of the semiconductor industry, and the generation is swiftly changing from the age that required a resolution of 0.25 μm at 256 MDRAM to 180 nm, 130 nm and further to 100 nm and beyond. In the age of the lithography using the i-line (365 nm), they didn't realize the resolution less than the wavelength. However, the KrF, having a wavelength of 248 nm, has been applied to the critical dimension of 180 nm down to 130 nm. The age that practically uses the resolution less than the wavelength has really arrived through the progress of resist and the use of results out of resolution enhancement technologies (RET), etc. Various RET would reduce the critical dimension to one-third of the wavelength in line and space patterns.
However, RET often has pattern-induced limits, and therefore, the royal road to the improvement of resolution is, after all, to make the wavelength short while improving the NA of a projection optical system. Recently, a minute imaging analysis emphasizes considerations of parameters that have been ignorable in the past, such as flare, and the polarization due to the property of the light as electromagnetic waves.
Among them, the issue of polarization has gradually had a great impact as a projection optical system's NA becomes larger. The issue that polarization presents is such that when two rays intersect each other, they don't interfere with each other if the two rays' polarized directions are orthogonal to each other. If two rays are symmetrically arranged to the optical axis, the angle of the optical axis with one ray becomes 45°. The NA close to 0.71 causes a pair of rays to satisfy this orthogonal condition. Therefore, a current projection optical system having more than 0.80 already met the condition in which the imaging rays do not interfere with each other in the aerial image.
The effect of this orthogonal condition becomes more prominent in an immersion type exposure apparatus, because even if the orthogonal condition is present in the aerial image obtained in the air, nitrogen, or helium circumstances (hereinafter called dry), an angle θPR that the light entering a resist having a refractive index of nPR at an angle θo has in the resist is expressed as follows:
sin θo=nPR sin θPR (1)
The angle θPR thus becomes smaller than θo, and does not satisfy the orthogonal condition in the resist. Usually, since the refractive index of the resist at a wavelength of 193 nm is about 1.7. If θPR becomes 45°, the right-hand side of the equation (1) becomes 1.7×sin 45°=1.20, which is more than 1. Therefore, θPR 45° condition never exists in the dry case.
However, in the immersion exposure that fills with liquid the space between a resist and a projection optical system, the refraction effect is greatly reduced, and θPR can be 45°.
Some solutions for this issue have been proposed which control the polarization of an illumination optical system and maintain the contrast of an image formed by a projection optical system. (See, for example, Japanese Patent Applications, Publication Nos. 8-008177, 4-366841, 5-088356, 5-090128, 6-124872, 6-181167, and 6-188169.)
In order to expose a pattern with a high resolution, RET takes a measure to control an angular distribution for illuminating reticles and to construct an optimal illumination optical system. Various proposed light source shapes, such as quadruple, dipole, sextuple as well as the conventional simple annulus contribute to enlarge the exposure latitude and the depth of focus. A CGH (Computer Generated Hologram) inserted as a diffraction optical element into an illumination optical system provides flexibility to form various light source shape requirements, thus making an important contribution to the progress of optical lithography. See, for example, Japanese Patent Applications, Publication Nos. 2001-284212 and 11-176721.
However, the control of polarization that has become especially conspicuous for an immersion type exposure apparatus, and the flexibility of the illumination optical system are newly required issues.
An illumination optical system should be suitable for a high NA optical system, such as a projection optical system used in an immersion type exposure apparatus, while reconciling polarization to the optical system having a diffraction optical element.
DISCLOSURE OF INVENTIONAn illumination optical system according to one aspect of the present invention for illuminating an illuminated surface using light from a light source includes a splitting optical system for splitting the light from the light source into light incident upon a first diffraction optical element, and light incident upon a second diffraction optical element, a first polarization unit for adjusting a polarization state of the light from the first diffraction optical element, a second polarization unit for adjusting a polarization state of the light from the second diffraction optical element, and an integrating optical system for integrating the light from the first diffraction optical element with the light from the second diffraction optical element, and for introducing integrated light into the illuminated surface.
Other features and advantages of the present invention will be apparent from the following description given in conjunction with the accompanying drawings, in which like reference characters designate the same or similar parts throughout the figures thereof.
BRIEF DESCRIPTION OF DRAWINGSThe accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention.
Preferred embodiments of the present invention will now be described in detail in accordance with the accompanying drawings.
First Embodiment
An excimer laser 1 is used for the exposure apparatus as a light source. It provides linearly polarized light. In order to control the polarization state of the whole illumination optical system, this embodiment utilizes the polarization characteristics that the laser originally possesses.
The excimer laser is shaped by a beam-shaping optical system 2 having a beam expander, etc. such that it may be adjusted for the optical systems that follow, and then, enters a beam splitter 3 as a splitting optical system, being split into two. Actually, the laser is located distant from the exposure apparatus for installation convenience, and light is often guided a long way up to the beam splitter via a beam delivery system. Because of the guidance from the laser to the beam splitter, if the laser beam enters the beam splitter 3 as an s-polarized light, the coating of the beam splitter may be set such that s-polarized light is split with an intensity ratio of 1:1.
If the laser is of non-polarization, a polarization beam splitter is used for the beam splitter 3. Even in this case, the split rays become two linearly polarized lights that are orthogonal to each other with the almost equal intensity. In other words, the splitting operation almost equalizes the intensity of the optical path of the split light as a linear polarization state.
The light having transmitted the beam splitter 3 is reflected on a mirror 4. The split beams enters, through separate optical paths, polarization units 5a and 5b, and CGH 6a and 6b, respectively. A description of their operations will be given later, but in summary each optical path is independently provided with the polarization unit for adjusting the polarization state and the CGH for forming an effective light source shape. That is, it is important in the instant embodiment that a first optical system that includes the polarization unit 5a and the CGH 6a, and a second optical system that includes the polarization unit 5b and the CGH 6b are set on different optical paths, respectively.
Then, the beams go through collimators 7a and 7b, and enter a beam integrating optical system 8, thus arriving at an integrator 10. The integrator 10 is a fly's-eye lens, and forms a plurality of secondary light sources at its exit surface.
The illumination optical system after the integrator 10 includes condensers 11a and 11b, a slit 12, a condenser 13, a mirror 14, and a collimator 15, and illuminates a reticle (or a mask). In order to control an exposure light intensity, a beam splitter 17 is arranged between the condensers 11a and 11b in the instant embodiment, and takes out light so as to detect a light intensity given by the illumination optical system. A photodetector 18 is movably arranged on the reticle surface, and detects the light intensity on the reticle surface.
The light having passed through the reticle 16 is projected and imaged onto a wafer 22 via a projection optical system 21. The wafer 22 is set on a wafer chuck 23, and the wafer chuck 23 is installed on a wafer stage 24. A detecting system 25 has a detector for detecting a light intensity, and is mounted on the wafer stage. The detecting system 25 detects the light intensity that has passed through the whole illumination and projection optical systems.
While this embodiment arranges the photodetector on the reticle surface or a position corresponding to the wafer surface, the detector can be placed at a location corresponding to the pupil position to perform a similar function.
The effective light source having passed the same CGHs, i.e., the 61a1 and 61a2, and 61b1 and 61b2 can be set by the CGHs to have the same light intensity, but light on the 61a system and that on the 61b system need to be made equal in terms of the light intensity. An ND filter for light intensity adjustment if provided in each optical path would provide proper control over the exposure ray width. Since an actual adjustment quantity is minute, a stop that has a variable diameter may be put in the optical path before entering the CGH for mutual adjustments. A detailed description of the light intensity adjustment function will be given later.
The CGH works effectively for a dipole illumination.
The CGH can easily form a more complicated effective light distribution.
The polarization direction is controllable in not only longitudinal and lateral directions, but any arbitrary direction, if, for example, a polarization unit 5 includes a rotational λ/2 plate, by controlling a set angle of the λ/2 plate.
An effective light source distribution can also be formed as shown in
It is also possible to easily realize a combination of a more complicated effective light source distribution and polarization directions.
A different effective light source is variable by exchanging the CGH in accordance with a light source shape. For example, the CGH need be exchanged between ⅔and ¾annular illuminations. An outer diameter of the effective light source, which is an important parameter, needs to be determined in the annular illumination. This corresponds to control over an annulus's size (or diameter) formed on the integrator 10, and a beam integrating optical system 8 plays this role. The element 8 has a zooming function to change a size of the annulus as well as a size of another effective light source on the integrator 10.
Of course, the illumination optical system needs to form a normal circular illumination shape. This needs an adjustment of so-called σ(=NA of an illumination optical system's reticle side/NA of a projection optical system's reticle side). Thus, a variable beam diameter on the integrator's incident surface is needed to change a shape of the light intensity distribution on the illumination optical system's pupil surface (which has a Fourier transform relationship with the reticle surface or is conjugate with the integrator 10's exit surface). The zooming function of the element 8 meets this requirement of variability. A CGH 6 that forms a circular pattern is used for the integrator in creating a circular shape of the effective light source. Alternatively, an optical system using an ordinary lens may be inserted in an optical system as a turret, utilizing the circular shape. In some cases, the same light intensity of linearly polarized rays that are orthogonal to each other is required in order to attain the two dimensional CD control.
As discussed, the embodiment remarkably improves the flexibility of the illumination optical system by an exchange of the CGH as a diffraction optical element and the zooming function, and can control the polarization direction.
A provision of many kinds of CGHs would take time for exchange and increase the cost. The number of necessary CGHs can be reduced if each CGH has a rotational function. For example, suppose the illustrative dipole illuminations shown in
The dipole in
CGHs of multiple types may be necessary to form other types of effective light source shapes so that each CGH is inserted into and removed from the optical path. For example, the CGHs may be placed on a turret and switchably inserted into the optical path.
While the above embodiment varies the polarization state by arranging a polarization unit at each of the multiple optical paths, all or part of them may be omitted if there is no need to change the polarization.
Second Embodiment
While this embodiment uses a structure of two CGHs of two kinds to conform to a fly's eye shape, two similar CGHs of the same type may be arranged in each optical path while rotated by 45° relative to each other, when each CGH is expected to form a shape of completely cutting a donut in the effective light source.
Of course, when the four-directional polarization directions are not needed, it is possible to use adjustment by the polarization unit 5 to arrange beams from all the CGHs into the same polarization direction, two directions or three directions. Which polarization state to choose depends upon the characteristics of a pattern to be exposed, but this embodiment can set up the CGHs for the optimum condition with ease.
Third EmbodimentThe third embodiment describes a method for detecting or adjusting the light intensity in the exposure apparatus of the embodiments 1 and 2.
One issue in the illumination optical system that handles the polarization state is the way of detecting the light intensity. The optical system shown in
In some cases, it is necessary to balance the light intensities among optical paths. For example, a difference between the intensity of the effective light source on the X-axis of the system in
On the other hand, the dipole system like
Therefore, such an effective light source as
Instead of the detector 18 disposed at a position conjugate to the reticle surface, a photoelectric detector 25 that is disposed on a wafer stage, and can detect a light intensity at a position conjugate to the wafer position, may serve as similar functions, i.e., a detection of light intensities between split optical paths, and necessary adjustments and light integrator L1's calibration. Whether the detector 18 is used or the photoelectric detector 25 is used, the results are similar, but when the projection optical system 21 has polarization characteristics, use of the photoelectric detector 25 that detects at the wafer side will provide more accurate controlling of the exposure dose. One exemplary projection optical system 21 having polarization characteristics is a catadioptric optical system.
A description will now be given of light intensity adjustment for each optical path and a procedure for determining a light integrator's controlling conditions. At first, the illumination optical system's polarization state controlling means 5, the CGH 6 and the optical path integrating element 8's zoom are set to the exposure conditions.
Each optical path that is split by the beam splitter 3 is provided with a shutter that can independently shield the light of the optical path and a light intensity adjusting function. In detecting the light intensity of each optical path, only the light on a first optical path is allowed to pass, and the remaining light is shielded. A memory (not shown) stores a light intensity detected by the detector 18 or photoelectric detector 25 in this state and a value LI at this time. For convenience of explanation, it is assumed that the photoelectric detector 25 detects the light intensity.
Then, a second optical path, and depending on structure, other optical paths are measured in a similar manner. First, a ratio between the output values LI and the element 25 are calculated, and a ratio between a LI controlled value and an actual light intensity is determined. Since the polarization state changes according to the illumination method, the value of this ratio needs to be calibrated again each time the illumination method (illumination mode) changes.
After that, a light intensity balance is adjusted for each optical path. As described, this step may be omitted if there is no light intensity balance required as in the dipole illumination shown in
In the light intensity adjustment, the optical path having a minimum value is treated as a reference value among all the light intensities detected by the photoelectric detector 25, and the light intensity of each of other optical paths is adjusted to conform to this light intensity. A light intensity adjusting means provided on each optical path adjusts the light intensity. The light intensity adjusting means may use a method using an ND filter, a method that controls the diameter of a beam incident upon the CGH, etc. The method for controlling the diameter of a beam incident upon the CGH takes advantage of the fact that even if the diameter of an incident beam changes, the image formed on the integrator does not change. An actual adjustment of the light intensity ratio does not require so wide a range if the film of an initial beam splitter is correctly made. Accordingly, use of a means for varying a diameter such as an iris stop provides continuous adjustments. An ND filter requires several kinds of filters to be prepared for switching, and the space for switching, whereas the iris stop is advantageously space-saving. The iris stop can serve as a shutter.
When the above light intensity adjusting means provides necessary adjustments to the light intensity ratio among optical paths and correlates the light intensity detected at the light integrator with the exposure light intensity, the exposure is ready to start.
This embodiment is applicable to exposure apparatuses of all the other embodiments.
As discussed, the invention of the above embodiment splits the optical path, and independently provides a CGH and a polarization element to each split optical path, thus controlling a polarization direction, and forming an efficient and respondent illumination optical system. The exposure optimized in the polarization state and the effective light source shape suitable for an exposed pattern greatly improves the resolution. The illumination optical system of the above embodiment, converts the light incident upon the CGH into a pattern on the integrator and polarized light by an element like the λ/2 plate, and thus achieves high efficiency with great flexibility. Use of the dipole illumination that controls the polarization with the illumination optical system of the above embodiment will enable an exposure apparatus to realize the high resolution performance without degrading the efficiency of the intended effective light source distribution.
Fourth Embodiment
In the embodiment, the exposure light from an illumination apparatus IS illuminates a reticle 16, and a pattern on the reticle 16 is reduced, projected and transferred by a projection optical system 21′ onto a wafer 22 as a photosensitive substrate to which a resist is applied. Here, the illumination apparatus IS has a structure similar to the first embodiment, and includes the laser 1 as a light source, and elements from the beam shaping optical system 2 to a collimator 15 in
The immersion type exposure apparatus according to the instant embodiment is a so-called step-and-scan type exposure apparatus, in which the reticle 16 and the wafer 22 are synchronously scanned for exposure.
A projection optical system barrel 77 constitutes a part of the projection optical system PL, and is a member arranged closest to the wafer 22.
79a is a liquid supplying apparatus, which supplies liquid to a space between a projection optical system barrel 77 and the wafer W, thus forming a liquid film.
79b is a liquid collection apparatus, which collects liquid via a nozzle 71b and a pipe 73b.
The liquid used for an immersion type exposure apparatus is required to meet the condition that it should absorb as little exposure light as possible and let it transmit. An immersion type exposure apparatus that uses the ArF or KrF excimer laser as a light source can use pure water as the immersion liquid.
In the embodiment, the illumination optical system splits the optical path into two, puts a CGH and a polarization unit at least on one optical path, and integrates the two on the integrator's incident surface. Therefore, an intended shape of the effective light source and the polarization control are easily feasible, and the resolution performance is not affected very much even if imaging lights are orthogonal within a resist.
Fifth Embodiment
The first embodiment split the beam exiting the beam shaping optical system 2 by the beam splitter 3 into two beams. On the other hand, the instant embodiment uses deflection mirrors 30 and 40, introducing the beams exiting the beam shaping optical systems 2a and 2b into the polarization units 5a and 5b. Elements in
When respective beams from the lasers 1a and 1b enter the deflection mirrors 30 and 40, their polarization directions are preferably parallel to each other.
While this embodiment makes the light source of two lasers, the present invention is not limited to this embodiment, and the light source may include three or more lasers. For example, the light source in the second embodiment may include four lasers.
Further, the instant embodiment's illumination apparatus (with elements from the lasers 1a and 1b to the collimator 15) may be used for the immersion type exposure apparatus of the fourth embodiment.
While the above first to fifth embodiments use a so-called step-and-scan type exposure apparatus as an exposure apparatus, a step-and-repeat type exposure apparatus may be used instead.
Sixth EmbodimentA description will now be given of an embodiment of a fabrication method for devices (semiconductor devices, liquid crystal display devices, etc.) using the above exposure apparatus.
Use of the fabrication method according to the instant embodiment makes it possible to fabricate highly integrated devices that were difficult to realize.
As many apparently widely different embodiments of the present invention can be made without departing from the spirit and scope thereof, it is to be understood that the invention is not limited to the specific embodiments thereof except as defined in the claims.
Claims
1. An illumination optical system for illuminating an illuminated surface using light from a light source, said illumination optical system comprising:
- a first diffraction optical element upon which the light from the light source is incident; and
- a second diffraction optical element upon which the light from the light source is incident,
- wherein the light from said first diffraction optical element forms a first part of an illumination distribution on a predetermined surface that substantially has a Fourier transform relationship with the illuminated surface, and the light from the second diffraction optical element forms a second part of the illumination distribution, and wherein the light that illuminates the first part and the light that illuminates the second part are linearly polarized lights that are orthogonal to each other.
2. An illumination optical system according to claim 1, further comprising third and fourth diffraction optical elements upon which the light from the light source is incident,
- wherein the light from the third diffraction optical element forms a third part of the illumination distribution, and the light from the fourth diffraction optical element forms a fourth part of the illumination distribution.
3. An exposure apparatus comprising:
- an illumination optical system according to claim 1 for illuminating a reticle; and
- a projection optical system for projecting a pattern on the reticle onto a plate.
Type: Application
Filed: Feb 20, 2007
Publication Date: Jun 28, 2007
Inventor: AKIYOSHI SUZUKI (Tokyo)
Application Number: 11/676,891
International Classification: G03B 27/72 (20060101);