Heat-dissipating wireless communication system
A heat-dissipating wireless communication system for a computer device comprises an antenna configured for wireless communications, the antenna configured to dissipate heat generated by the computer device.
Many computers comprise wireless communication devices that generate considerable thermal energy during operation. For example, power amplifiers used in connection with wireless communication systems are employed to transform electrical energy into radio frequency energy for transmission by an antenna. However, power amplifiers generate a substantial amount of thermal energy. As a result, many wireless communication devices are forced to operate at a reduced power level (e.g., by reducing the transmit power) in order to reduce the amount of thermal energy generated. Although the computer device's cooling platform (e.g., the computer's existing cooling system that dissipates heat from other computer components, such as a processor and/or graphics chip) can be used to dissipate the thermal energy from the power amplifier, positioning the power amplifier in the computer device to facilitate use of such cooling platform generally results in reduced performance of the wireless communication device at least based on the separation distance between the power amplifier and the antenna.
BRIEF DESCRIPTION OF THE DRAWINGSFor a more complete understanding of the present invention, and the objects and advantages thereof, reference is now made to the following descriptions taken in connection with the accompanying drawings in which:
The preferred embodiments of the present invention and the advantages thereof are best understood by referring to
In the embodiment illustrated in
In operation, antenna 36 is used to dissipate thermal energy generated by components of system 10 (e.g., by power amplifier 38 and/or any other component(s) of system 10) to reduce and/or eliminate the likelihood of damage to PCB 34, antenna 36, power amplifier 38 and/or any other component(s) that may be disposed within housing 18. It should be understood that computer device 8 may comprise additional component(s) 54 used in combination with or independent of wireless communication system 10, such as, for example, a graphics chip and/or a processor. It should be understood that in addition to or in lieu of thermally coupling power amplifier 38 and/or other components of wireless communication system 10 to antenna 36, component(s) 54 may also be thermally coupled to antenna 36 to dissipate the thermal energy that may be generated thereby. Thus, in operation, antenna 36 is used as a heat exchanger for dissipating thermal energy generated by components of system 10 and/or other components 54 of computer device 8.
In the embodiment illustrated in
In operation, antenna 36 functions as a heat exchanger such that vents 42 and 44 (
Thus embodiments of the present invention provide dissipation of thermal energy using antenna 36. Thus, for example, embodiments of the present invention facilitate dissipation of thermal energy generated by power amplifier 38 using antenna 36, thereby enabling power amplifier 38 to operate at higher power levels. Additionally, embodiments of the present invention enable power amplifier 38 and/or other components of wireless communication system 10 to be positioned adjacent to and/or in close proximity to antenna 36, thereby facilitating increased performance of the wireless communication system 10.
Claims
1. A heat-dissipating wireless communication system for a computer device, comprising:
- an antenna configured for wireless communications, the antenna configured to dissipate heat generated by the computer device.
2. The system of claim 1, wherein the antenna is configured to dissipate heat generated by a power amplifier coupled to the antenna.
3. The system of claim 2, wherein the amplifier is disposed in a display member of a notebook computer device.
4. The system of claim 1, wherein the antenna is configured to dissipate heat generated from at least one component disposed on a printed circuit board (PCB) coupled to the antenna.
5. The system of claim 1, wherein at least a portion of the antenna is disposed in a spaced-apart relationship relative to a PCB coupled thereto.
6. The system of claim 1, wherein the antenna is disposed adjacent at least one vent.
7. The system of claim 1, further comprising a plurality of vents configured to facilitate an airflow past the antenna.
8. The system of claim 1, further comprising a ground portion of a printed circuit board configured to transfer heat to the antenna.
9. A heat-dissipating wireless communication system for a computer device, comprising:
- means for transmitting radio frequency signals from the computer device, the transmitting means configured to dissipate heat generated by the computer device.
10. The system of claim 9, wherein the transmitting means is configured to dissipate heat generated by a power amplifier means coupled to the transmitting means.
11. The system of claim 9, wherein the transmitting means is configured to dissipate heat generated from at least one component disposed on a printed circuit board (PCB) coupled to the transmitting means.
12. The system of claim 9, wherein at least a portion of the transmitting means is disposed in a spaced-apart relationship relative to a printed circuit board coupled thereto.
13. The system of claim 9, further comprising at least one means for facilitating an airflow past the transmitting means.
14. A method of manufacturing a heat-dissipating wireless communication system for a portable computer device, comprising:
- providing an antenna within the computer device, the antenna configured to dissipate heat generated by the computer device.
15. The method of claim 14, further comprising configuring the antenna to dissipate heat generated by a power amplifier coupled thereto.
16. The method of claim 15, further comprising disposing the power amplifier in a display member of a notebook computer device.
17. The method of claim 14, further comprising configuring at least a portion of the antenna to be in a spaced-part relationship relative to a printed circuit board coupled thereto.
18. The method of claim 14, further comprising providing at least one vent in close proximity to the antenna.
19. The method of claim 14, further comprising configuring a ground portion of a printed circuit board to transfer heat to the antenna.
20. The method of claim 14, further comprising providing a plurality of vents configured to facilitate an airflow past the antenna.
Type: Application
Filed: Jan 31, 2006
Publication Date: Aug 2, 2007
Patent Grant number: 8228239
Inventors: Isaac Lagnado (Houston, TX), Timothy Neill (Houston, TX), Mark Tracy (Houston, TX), Jeffrey Lev (Houston, TX), Walter Fry (Houston, TX)
Application Number: 11/344,296
International Classification: H01Q 1/24 (20060101);