COOLING SHEET FOR PILLOW

Abstract

A cooling sheet for pillow includes a plurality of thermoelectric coolers, a thermal pad, and a heat sink. The thermoelectric coolers are electrically connected one another in series, with a first junction and a second junction. The thermal pad is thermally connected to the first junction of the thermoelectric coolers. The heat sink is thermally connected to the second junction of the thermoelectric coolers. The thermal pad is adapted to be used with a pillow, and the temperature of the thermal pad is controlled by the thermoelectric coolers. The thermoelectric coolers include first and second metals that are dissimilar from the first metal. The first and second metals are connected to each other at two junctions forming Peltier junctions. The thermoelectric coolers further include an EMF source for providing electric current through the Peltier junctions. The thermoelectric coolers can be realized by two dissimilar semiconductors.

Description

BACKGROUND OF THE INVENTION

The present invention relates to a cooling sheet for pillow.

More particularly, this invention relates to a cooling sheet that controls the temperature of the pillow.

Still more specifically, the invention relates a cooling sheet using Peltier effects.

Sleeping is an important and complicated biological process people go through almost ritually every night.

Sound and good sleep does not come easily to some people. There are many special ways to lead to a good-night sleep, which are resulted from the psychological or elctrophysiological researches.

In contrast, there are also common-sense wisdoms. For example, a cozy and comfortable bedroom might be a good starting. Sometimes and for some people, a delicate sectional control of temperature of their body is one of the necessary conditions for a good sleep; cool head or warm feet.

Accordingly, a need for a cooling sheet for pillow has been present for a long time. This invention is directed to solve these problems and satisfy the long-felt need.

SUMMARY OF THE INVENTION

The present invention contrives to solve the disadvantages of the prior art.

An object of the invention is to provide a cooling sheet for pillow.

Another object of the invention is to provide a cooling sheet that cools the pillow.

Still another object of the invention is to provide a cooling sheet using a thermoelectric coolers operated by the Peltier effect.

A cooling sheet for pillow includes a plurality of thermoelectric coolers, a thermal pad, and a heat sink cooled by a cooling fan.

The thermoelectric coolers are electrically connected one another in series or in parallel, with a first junction and a second junction.

The thermal pad is thermally connected to the first junction of the thermoelectric coolers.

The heat sink is thermally connected to the second junction of the thermoelectric coolers.

The thermal pad is adapted to be used with a pillow, and the temperature of the thermal pad is controlled by the thermoelectric coolers.

The thermoelectric coolers include a first metal and a second metal that is dissimilar from the first metal.

The first metal and the second metal are connected to each other at two junctions forming Peltier junctions.

The thermoelectric coolers further include an EMF source for providing electric current through the Peltier junctions.

The second metal includes a primary second metal and a secondary second metal, and the EMF source is inserted in between the primary and secondary second metals.

The first junction, which is connected to the thermal pad, is a cooling junction.

Alternatively, the thermoelectric coolers may include a first semiconductor and a second semiconductor that is dissimilar from the first semiconductor. The first semiconductor and the second semiconductor are connected to each other at two junctions forming Peltier junctions.

Each of the semiconductors includes a p-type semiconductor and an n-type semiconductor.

The thermal pad is made of material of high thermal conductivity, preferably metal.

The material of high thermal conductivity includes a braided metal sheet structure for increasing the thermal conduction area.

The heat sink is made of metal of high thermal conductivity. The metal includes aluminum.

The cooling sheet may further include a power supply, a controller, a cooling fan, and a power switch.

The controller is for controlling the amount of electric current through the thermoelectric coolers, eventually controlling the temperature of the first junction.

The cooling fan includes a variable switch for controlling the speed of the cooling fan; controlling the level of noise of the cooling fan.

The advantages of the present invention are: (1) the cooling sheet is convenient to use; (2) the cooling sheet helps to control a sectional body temperature; and (3) the cooling sheet can be a cooler for pillow and others.

Although the present invention is briefly summarized, the fuller understanding of the invention can be obtained by the following drawings, detailed description and appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

These and other features, aspects and advantages of the present invention will become better understood with reference to the accompanying drawings, wherein:

FIG. 1 is a top plan view of a cooling sheet for a pillow according to the present invention;

FIG. 2 is a schematic diagram of a pair of Peltier junctions of FIG. 1;

FIG. 3 is a block diagram showing the cooling sheet according to the invention.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 shows a top plan view of a cooling sheet 100 for a pillow (not shown).

The cooling sheet 100 for pillow includes a plurality of thermoelectric coolers 10, a thermal pad 20, and a heat sink 30.

The thermoelectric coolers 10 are electrically connected one another in series or in parallel, with a first junction 11 and a second junction 12.

The thermal pad 20 is thermally connected to the first junction 11 of the thermoelectric coolers 10.

The heat sink 30 is thermally connected to the second junction 12 of the thermoelectric coolers 10.

The thermal pad 20 is adapted to be used with a pillow, and the temperature of the thermal pad 20 is controlled by the thermoelectric coolers 10. The pillow can be put on the thermal pad 20. Alternatively, the thermal pad 20 can be integrated into the pillow.

As shown in FIG. 2, the thermoelectric coolers 10 include a first metal 13 and a second metal 14 that is dissimilar from the first metal 13.

The first metal 13 and the second metal 14 are connected to each other at two junctions 11, 12 forming Peltier junctions.

The thermoelectric coolers 10 further include an EMF source 15 for providing electric current through the Peltier junctions 11, 12.

The second metal 14 includes a primary second metal 141 and a secondary second metal 142, and the EMF source 15 is inserted in between the primary and secondary second metals 141, 142.

The first junction 11, which is connected to the thermal pad 20, is a cooling junction for cooling down the pillow.

Alternatively, the thermoelectric coolers 10 include a first semiconductor and a second semiconductor that is dissimilar from the first semiconductor. The first semiconductor and the second semiconductor are connected to each other at two junctions forming Peltier junctions. Each of the semiconductors includes a p-type semiconductor and an n-type semiconductor.

The thermal pad 20 is made of material of high thermal conductivity, preferably metal. The material of high thermal conductivity includes a braided metal sheet structure 22 for increasing the thermal conduction area as shown in FIG. 1.

The heat sink 30 is made of metal of high thermal conductivity. The metal includes aluminum.

The cooling sheet 100 may further include a power supply 50, a controller 60, a cooling fan 70, and a power switch 80.

The controller 60 is for controlling the amount of electric current through the thermoelectric coolers 10, eventually controlling the temperature of the first junction 11 and the temperature of the thermal pad 20.

The cooling fan 70 includes a variable switch 72 for controlling the speed of the cooling fan 70; controlling the noise level of the cooling fan 70.

The thermoelectric coolers 10 can achieve temperature difference between the first and second junctions 11, 12 up to 70 degrees in Celsius, or can transfer heat at a rate of 138 W. To achieve greater temperature differences, up to 131 degrees in Celsius, multistage or cascade thermoelectric coolers can be used.

Unlike the cooling fan and the like, the cooling sheet 100 emits virtually no noise. Also, it has the reduced space, size, and weight compared to other type of cooling devices.

While the invention has been shown and described with reference to different embodiments thereof, it will be appreciated by those skilled in the art that variations in form, detail, compositions and operation may be made without departing from the spirit and scope of the invention as defined by the accompanying claims.

Claims

1. A cooling sheet for pillow comprising:

a) a plurality of thermoelectric coolers in series or in parallel with a first junction and a second junction;

b) a thermal pad thermally connected to the first junction of the thermoelectric coolers; and

c) a heat sink thermally connected to the second junction of the thermoelectric coolers,

wherein the thermal pad is adapted to be used with a pillow, wherein the temperature of the thermal pad is controlled by the thermoelectric coolers.

2. The cooling sheet of claim 1, wherein the thermoelectric coolers comprises:

a) a first metal; and

b) a second metal dissimilar from the first metal,

wherein the first metal and the second metal are connected to each other at two junctions forming Peltier junctions.

3. The cooling sheet of claim 2, wherein the thermoelectric coolers further comprises an EMF source for providing electric current through the Peltier junctions.

4. The cooling sheet of claim 3, wherein the second metal comprises a primary second metal and a secondary second metal, wherein the EMF source is inserted in between the primary and secondary second metals.

5. The cooling sheet of claim 1, wherein the first junction is a cooling junction.

6. The cooling sheet of claim 1, wherein the thermoelectric coolers comprises:

a) a first semiconductor; and

b) a second semiconductor dissimilar from the first semiconductor,

wherein the first semiconductor and the second semiconductor are connected to each other at two junctions forming Peltier junctions.

7. The cooling sheet of claim 6, wherein each of the semiconductors comprises a p-type semiconductor and an n-type semiconductor.

8. The cooling sheet of claim 1, wherein the thermal pad is made of material of high thermal conductivity.

9. The cooling sheet of claim 8, wherein the material of high thermal conductivity comprises metal.

10. The cooling sheet of claim 8, wherein the material of high thermal conductivity comprises a braided metal sheet structure.

11. The cooling sheet of claim 1, wherein the heat sink is made of metal of high thermal conductivity.

12. The cooling sheet of claim 11, wherein the metal comprises aluminum.

13. The cooling sheet of claim 1, further comprising:

a) a power supply;

b) a controller for controlling the amount of electric current through the thermoelectric coolers;

c) a cooling fan for cooling the heat sink; and

d) a power switch for the power supply.

14. The cooling sheet of claim 13, wherein the cooling fan comprises a variable switch, wherein the variable switch controls the speed of the cooling fan.