HEAT DISSIPATION ASSEMBLY

Abstract

A heat dissipation assembly includes a heat pipe and a cooling fin set. The heat pipe provides an upright curved section and the cooling fin set provides a plurality of cooling fins to be attached to the curved section. Wherein, the cooling fin set has a curved shape corresponding to the curved section and provides a lateral curved recess for the curved section being capable of fitting with the curved recess precisely due to the sizes of the curved section and the curved cooling fin are controlled effectively and the required tortuosity is obtained during being worked.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention is related to a heat dissipation assembly and particularly to a heat dissipation assembly in which a heat pipe with a curved section and a curved shaped cooling fin set with a curved recess for being attached to the curved section.

2. Brief Description of the Related Art

The conventional heat dissipation assembly, which provides a heat pipe and a cooling fin set, can be classified into three categories.

The first category of the conventional heat dissipation assembly is Taiwan Utility Model Application No. 094221564, entitled “ASSEMBLABLE HEAT DISSIPATION DEVICE”, which discloses a heat pipe with a horizontally extended curved section being attached to a first cooling fin set and a second cooling fin set, which provide a recess respectively.

The second category of the conventional heat dissipation assembly is Taiwan Utility Model Application No. 094222753, entitled “HEAT DISSIPATION DEVICE”, which discloses a heat pipe with an upright extended curved section passing through at least a cooling fin set.

The third category of the conventional heat dissipation assembly is Taiwan Utility Model Application No. 094210338, entitled “COOLING FINS ASSEMBLY”, which discloses a heat pipe passing through a plurality of cooling fins and then having a curved shape.

However, the first and second categories of the conventional heat dissipation assemblies have a common feature that the curved sections of the heat pipes are attached to the cooling fin sets and the horizontally extending curved section of the heat pipe provided in the first category of the conventional heat dissipation assembly occupies more space and is too close to the motherboard. The curved shaped section of the heat pipe provided in the third category of the conventional heat dissipation assembly is fabricated after the heat pipe being attached to the cooling fin set such that it is incapable of controlling the size of curved shaped section in the process of fabricating effectively.

SUMMARY OF THE INVENTION

In order to overcome the deficiencies of the preceding prior art, a primary object of the present invention is to provide a heat dissipation assembly in which a heat pipe with an upright curved section and the cooling fin set with a lateral curved recess are attached to each other precisely.

Another object of the present invention is to provide a heat dissipation assembly in which the curved section of a heat pipe is made with a preset tortuotsity before the lateral recess of a cooling fin set is attached to the curved section.

A further object of the present invention is to provide a heat dissipation assembly with which the sizes of the upright curved section of the heat pipe and the lateral curved recess of the cooling fin set can be controlled effectively during the heat pipe and the cooling fin set being fabricated.

Accordingly, a heat dissipation assembly according to the present invention includes a heat pipe and a cooling fin set. The heat pipe provides an upright curved section and the cooling fin set provides a plurality of cooling fins to be attached to the curved section. Wherein, the cooling fin set has a curved shape corresponding to the curved section and provides a lateral curved recess for the curved section being capable of fitting with the curved recess precisely due to the sizes of the curved section and the curved cooling fin are controlled effectively and the required tortuosity is obtained during being worked.

BRIEF DESCRIPTION OF THE DRAWINGS

The detail structure, the applied principle, the function and the effectiveness of the present invention can be more fully understood with reference to the following description and accompanying drawings, in which:

FIG. 1 is an exploded perspective view of a heat dissipation assembly according to the present invention;

FIG. 2 is an assembled perspective view of a heat dissipation assembly according the present invention; and

FIG. 3 is a sectional view of a heat dissipation assembly according the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Referring to FIGS. 1 to 3, the preferred embodiment of a heat dissipation assembly according to the present invention includes a heat pipe 1, a heat dissipating fin set 2 and a heat sink 3. The heat pipe 1 provides an upright curved section 11. The cooling fin set 2 further includes a plurality of heat dissipating fins 21 and provides a curved shape with a curved lateral recess 211 corresponding to the curved section 11 of the heat pipe 1 such the cooling fin set 2 is capable of being attached to the heat pipe 1 by means of the curved lateral recess 211 fitting with the upright curved section 11 of the heat pipe 1. The outer surface of the upright curved section 11 and the wall surface of the curved lateral recess 211 are coated with heat conducting medium 5 such that the cooling fin set 2 can be joined to the heat pipe 1 firmly. The heat conducting medium 5 can be solder paste.

Any shapes of the cooling fins 21 can be provided even if different shapes of the cooling fins 21 are arranged in the same cooling fin set 2 as long as the cooling fins 21 have greater areas to contact airflow and good heat exchange efficiency is capable of being obtained. Alternatively, the upright curved section 11 of the heat pipe 1 can be arranged to be attached to two cooling fin sets 2 or the heat pipe 1 with a plurality of upright curved sections can be made to fit with a cooling fin set 2 respectively.

The heat pipe 1 can be made of either copper or aluminum. Further, a plurality of heat pipe 1 can be arranged in the heat dissipation assembly of the present invention. The outer diameter of the respective heat pipe 1 is equal to or greater than the size of the lateral curved recess 211 for obtaining better a contact surface and being favorable for soldering joint. The respective heat pipe 1 is fabricated with a bending machine associated with molds to perform tube bending or with a press machine associated with press molds to perform plastic working till a preset tortuosity is reached before being assembled to the heat sink 3.

The heat sink 3 is employed to contact with a heating device 4 and the heat sink 3 is integrally made with extruded aluminum and provides a plurality of fins spaced apart from each other attached to the surface of a substrate or is fabricated with a plurality of aluminum fins being soldered to the surface of a copper substrate.

The heat source 4 can be an integrated circuit, a central processing unit (CPU), a storage device, a light emitting device, a transformer or the like.

A fan can be disposed beside the cooling fin set 2 to speed up heat removal from the cooling fin set 2. Because the cooling fin set 2 has a curved shape, the airflow induced by the fan is capable of contacting more cooling fins 21 than those on the conventional line shaped cooling fin set such that the heat dissipation assembly of the present invention enhances effect of heat dissipation.

It is noted that the heat pipe 1, the cooling fins 21 or the heat sink 3 is made of copper, aluminum, alloy, ceramics or the like, which provides high heat conductive efficiency.

It is appreciated that the heat dissipation assembly according to the present invention has the following advantages and effectiveness:

1. The heat dissipation assembly of the present invention extends upright from the heat sink to occupy less space than the prior art and provides a larger gap from the motherboard of a computer such that heat removed from the heat dissipation assembly is incapable of moving toward the mother board or other components on the motherboard.

2. The heat pipe is worked to have a preset tortuosity such that the size of the heat dissipation assembly is controlled effectively while the cooling fin set fitting with the heat pipe.

3. The cooling fin set can be fabricated to meet the curved section of the heat pipe easily.

While the invention has been described with referencing to the preferred embodiment thereof, it is to be understood that modifications or variations may be easily made without departing from the spirit of this invention, which is defined by the appended claims.

Claims

1. A heat dissipation assembly comprising:

a heat pipe providing an upright curved section;

at least a cooling fin set providing a plurality of cooling fins and being attached to said curved section;

wherein, said cooling fin set has a curved shape corresponding to the curved section and provides a lateral curved recess for said curved section capable of fitting with said curved recess.

2. The heat dissipation assembly as defined in claim 1, wherein said cooling fin set is soldered to said heat pipe with a heat conductive medium.

3. The heat dissipation assembly as defined in claim 1, wherein said heat pipe is coated with a heat conductive medium for said cooling fin set being joined to said heat pipe.

4. The heat dissipation assembly as defined in claim 1, wherein two or more cooling fin sets are provided.