EJECTION NOZZLE ARRANGEMENT

Info

Publication number: 20100309252
Type: Application
Filed: Aug 18, 2010
Publication Date: Dec 9, 2010
Applicant:
Inventor: Kia Silverbrook (Balmain)
Application Number: 12/859,206

Abstract

An ejection nozzle arrangement having a substrate, a fluid port in the substrate, a chamber on the substrate so as to have the fluid port therein, a roof on the chamber having an ejection port, and an arm extending through an opening in the chamber into the chamber for causing ejection of fluid within the chamber from the ejection port. The arm is suspended within the opening so that the arm is spaced from both the substrate and the chamber within the opening.

Description

Description

CROSS REFERENCES TO RELATED APPLICATIONS

The present application is a Continuation of U.S. application Ser. No. 11/490,041 filed Jul. 21, 2006, which is a Continuation of U.S. application Ser. No. 10/728,970 (Now Abandoned) filed on Dec. 8, 2003, which is a Continuation In Part of U.S. application Ser. No. 10/160,273 filed on Jun. 4, 2002, now issued as U.S. Pat. No. 6,746,105, which is a Continuation of U.S. application Ser. No. 09/112,767 filed on Jul. 10, 1998, now issued as U.S. Pat. No. 6,416,167 all of which is herein incorporated by reference.

The following Australian provisional patent applications are hereby incorporated by cross-reference. For the purposes of location and identification, U.S. patent applications identified by their U.S. patent application Ser. Nos. (USSN) are listed alongside the Australian applications from which the U.S. patent applications claim the right of priority.

CROSS-REFERENCED US PATENT/PATENT AUSTRALIAN APPLICATION (CLAIMING PROVISIONAL RIGHT OF PRIORITY PATENT FROM AUSTRALIAN DOCKET APPLICATION NO. PROVISIONAL APPLICATION) NO. PO7991 6,750,901 ART01 PO8505 6,476,863 ART02 PO7988 6,788,336 ART03 PO9395 6,322,181 ART04 PO8017 6,597,817 ART06 PO8014 6,227,648 ART07 PO8025 6,727,948 ART08 PO8032 6,690,419 ART09 PO7999 6,727,951 ART10 PO8030 6,196,541 ART13 PO7997 6,195,150 ART15 PO7979 6,362,868 ART16 PO7978 6,831,681 ART18 PO7982 6,431,669 ART19 PO7989 6,362,869 ART20 PO8019 6,472,052 ART21 PO7980 6,356,715 ART22 PO8018 6,894,694 ART24 PO7938 6,636,216 ART25 PO8016 6,366,693 ART26 PO8024 6,329,990 ART27 PO7939 6,459,495 ART29 PO8501 6,137,500 ART30 PO8500 6,690,416 ART31 PO7987 7,050,143 ART32 PO8022 6,398,328 ART33 PO8497 7,110,024 ART34 PO8020 6,431,704 ART38 PO8504 6,879,341 ART42 PO8000 6,415,054 ART43 PO7934 6,665,454 ART45 PO7990 6,542,645 ART46 PO8499 6,486,886 ART47 PO8502 6,381,361 ART48 PO7981 6,317,192 ART50 PO7986 6,850,274 ART51 PO8026 6,646,757 ART53 PO8028 6,624,848 ART56 PO9394 6,357,135 ART57 PO9397 6,271,931 ART59 PO9398 6,353,772 ART60 PO9399 6,106,147 ART61 PO9400 6,665,008 ART62 PO9401 6,304,291 ART63 PO9403 6,305,770 ART65 PO9405 6,289,262 ART66 PP0959 6,315,200 ART68 PP1397 6,217,165 ART69 PP2370 6,786,420 DOT01 PO8003 6,350,023 Fluid01 PO8005 6,318,849 Fluid02 PO8066 6,227,652 IJ01 PO8072 6,213,588 IJ02 PO8040 6,213,589 IJ03 PO8071 6,231,163 IJ04 PO8047 6,247,795 IJ05 PO8035 6,394,581 IJ06 PO8044 6,244,691 IJ07 PO8063 6,257,704 IJ08 PO8057 6,416,168 IJ09 PO8056 6,220,694 IJ10 PO8069 6,257,705 IJ11 PO8049 6,247,794 IJ12 PO8036 6,234,610 IJ13 PO8048 6,247,793 IJ14 PO8070 6,264,306 IJ15 PO8067 6,241,342 IJ16 PO8001 6,247,792 IJ17 PO8038 6,264,307 IJ18 PO8033 6,254,220 IJ19 PO8002 6,234,611 IJ20 PO8068 6,302,528 IJ21 PO8062 6,283,582 IJ22 PO8034 6,239,821 IJ23 PO8039 6,338,547 IJ24 PO8041 6,247,796 IJ25 PO8004 6,557,977 IJ26 PO8037 6,390,603 IJ27 PO8043 6,362,843 IJ28 PO8042 6,293,653 IJ29 PO8064 6,312,107 IJ30 PO9389 6,227,653 IJ31 PO9391 6,234,609 IJ32 PP0888 6,238,040 IJ33 PP0891 6,188,415 IJ34 PP0890 6,227,654 IJ35 PP0873 6,209,989 IJ36 PP0993 6,247,791 IJ37 PP0890 6,336,710 IJ38 PP1398 6,217,153 IJ39 PP2592 6,416,167 IJ40 PP2593 6,243,113 IJ41 PP3991 6,283,581 IJ42 PP3987 6,247,790 IJ43 PP3985 6,260,953 IJ44 PP3983 6,267,469 IJ45 PO7935 6,224,780 IJM01 PO7936 6,235,212 IJM02 PO7937 6,280,643 IJM03 PO8061 6,284,147 IJM04 PO8054 6,214,244 IJM05 PO8065 6,071,750 IJM06 PO8055 6,267,905 IJM07 PO8053 6,251,298 IJM08 PO8078 6,258,285 IJM09 PO7933 6,225,138 IJM10 PO7950 6,241,904 IJM11 PO7949 6,299,786 IJM12 PO8060 6,866,789 IJM13 PO8059 6,231,773 IJM14 PO8073 6,190,931 IJM15 PO8076 6,248,249 IJM16 PO8075 6,290,862 IJM17 PO8079 6,241,906 IJM18 PO8050 6,565,762 IJM19 PO8052 6,241,905 IJM20 PO7948 6,451,216 IJM21 PO7951 6,231,772 IJM22 PO8074 6,274,056 IJM23 PO7941 6,290,861 IJM24 PO8077 6,248,248 IJM25 PO8058 6,306,671 IJM26 PO8051 6,331,258 IJM27 PO8045 6,110,754 IJM28 PO7952 6,294,101 IJM29 PO8046 6,416,679 IJM30 PO9390 6,264,849 IJM31 PO9392 6,254,793 IJM32 PP0889 6,235,211 IJM35 PP0887 6,491,833 IJM36 PP0882 6,264,850 IJM37 PP0874 6,258,284 IJM38 PP1396 6,312,615 IJM39 PP3989 6,228,668 IJM40 PP2591 6,180,427 IJM41 PP3990 6,171,875 IJM42 PP3986 6,267,904 IJM43 PP3984 6,245,247 IJM44 PP3982 6,315,914 IJM45 PP0895 6,231,148 IR01 PP0869 6,293,658 IR04 PP0887 6,614,560 IR05 PP0885 6,238,033 IR06 PP0884 6,312,070 IR10 PP0886 6,238,111 IR12 PP0877 6,378,970 IR16 PP0878 6,196,739 IR17 PP0883 6,270,182 IR19 PP0880 6,152,619 IR20 PO8006 6,087,638 MEMS02 PO8007 6,340,222 MEMS03 PO8010 6,041,600 MEMS05 PO8011 6,299,300 MEMS06 PO7947 6,067,797 MEMS07 PO7944 6,286,935 MEMS09 PO7946 6,044,646 MEMS10 PP0894 6,382,769 MEMS13

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

Not applicable.

FIELD OF THE INVENTION

The present invention relates to the field of inkjet printers and, discloses an inkjet printing system using printheads manufactured with microelectro-mechanical systems (MEMS) techniques.

BACKGROUND OF THE INVENTION

Many different types of printing have been invented, a large number of which are presently in use. The known forms of print have a variety of methods for marking the print media with a relevant marking media. Commonly used forms of printing include offset printing, laser printing and copying devices, dot matrix type impact printers, thermal paper printers, film recorders, thermal wax printers, dye sublimation printers and ink jet printers both of the drop on demand and continuous flow type. Each type of printer has its own advantages and problems when considering cost, speed, quality, reliability, simplicity of construction and operation etc.

In recent years, the field of ink jet printing, wherein each individual pixel of ink is derived from one or more ink nozzles has become increasingly popular primarily due to its inexpensive and versatile nature.

Many different techniques on ink jet printing have been invented. For a survey of the field, reference is made to an article by J Moore, “Non-Impact Printing: Introduction and Historical Perspective”, Output Hard Copy Devices, Editors R Dubeck and S Sherr, pages 207-220 (1988).

Ink Jet printers themselves come in many different types. The utilization of a continuous stream of ink in ink jet printing appears to date back to at least 1929 wherein U.S. Pat. No. 1,941,001 by Hansell discloses a simple form of continuous stream electro-static ink jet printing.

U.S. Pat. No. 3,596,275 by Sweet also discloses a process of a continuous ink jet printing including the step wherein the ink jet stream is modulated by a high frequency electro-static field so as to cause drop separation. This technique is still utilized by several manufacturers including Elmjet and Scitex (see also U.S. Pat. No. 3,373,437 by Sweet et al)

Piezoelectric ink jet printers are also one form of commonly utilized ink jet printing device. Piezoelectric systems are disclosed by Kyser et. al. in U.S. Pat. No. 3,946,398 (1970) which utilizes a diaphragm mode of operation, by Zolten in U.S. Pat. No. 3,683,212 (1970) which discloses a squeeze mode of operation of a piezoelectric crystal, Stemme in U.S. Pat. No. 3,747,120 (1972) discloses a bend mode of piezoelectric operation, Howkins in U.S. Pat. No. 4,459,601 discloses a piezoelectric push mode actuation of the ink jet stream and Fischbeck in U.S. Pat. No. 4,584,590 which discloses a shear mode type of piezoelectric transducer element.

Recently, thermal ink jet printing has become an extremely popular form of ink jet printing. The ink jet printing techniques include those disclosed by Endo et al in GB 2007162 (1979) and Vaught et al in U.S. Pat. No. 4,490,728. Both the aforementioned references disclosed ink jet printing techniques that rely upon the activation of an electrothermal actuator which results in the creation of a bubble in a constricted space, such as a nozzle, which thereby causes the ejection of ink from an aperture connected to the confined space onto a relevant print media. Printing devices utilizing the electro-thermal actuator are manufactured by manufacturers such as Canon and Hewlett Packard.

As can be seen from the foregoing, many different types of printing technologies are available. Ideally, a printing technology should have a number of desirable attributes. These include inexpensive construction and operation, high speed operation, safe and continuous long term operation etc. Each technology may have its own advantages and disadvantages in the areas of cost, speed, quality, reliability, power usage, simplicity of construction operation, durability and consumables.

In the construction of any inkjet printing system, there are a considerable number of important factors which must be traded off against one another especially as large scale printheads are constructed, especially those of a pagewidth type. A number of these factors are outlined in the following paragraphs.

Firstly, inkjet printheads are normally constructed utilizing micro-electromechanical systems (MEMS) techniques. As such, they tend to rely upon standard integrated circuit construction/fabrication techniques of depositing planar layers on a silicon wafer and etching certain portions of the planar layers. Within silicon circuit fabrication technology, certain techniques are better known than others. For example, the techniques associated with the creation of CMOS circuits are likely to be more readily used than those associated with the creation of exotic circuits including ferroelectrics, galium arsenide etc. Hence, it is desirable, in any MEMS constructions, to utilize well proven semi-conductor fabrication techniques which do not require any “exotic” processes or materials. Of course, a certain degree of trade off will be undertaken in that if the advantages of using the exotic material far out weighs its disadvantages then it may become desirable to utilize the material anyway. However, if it is possible to achieve the same, or similar, properties using more common materials, the problems of exotic materials can be avoided.

With a large array of ink ejection nozzles, it is desirable to provide for a highly automated form of manufacturing which results in an inexpensive production of multiple printhead devices.

Preferably, the device constructed utilizes a low amount of energy in the ejection of ink. The utilization of a low amount of energy is particularly important when a large pagewidth full color printhead is constructed having a large array of individual print ejection mechanism with each ejection mechanisms, in the worst case, being fired in a rapid sequence.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide an ink ejection nozzle arrangement suitable for incorporation into an inkjet printhead arrangement for the ejection of ink on demand from a nozzle chamber in an efficient and reliable manner.

According to a first aspect, the present invention provides an ink jet printhead comprising:

a plurality of nozzles;

a bubble forming chamber corresponding to each of the nozzles respectively, the bubble forming chambers adapted to contain a bubble forming liquid; and,

at least one heater element disposed in each of the bubble forming chambers respectively, the heater elements configured for thermal contact with the bubble forming liquid; such that,

heating the heater element to a temperature above the boiling point of the bubble forming liquid forms a gas bubble that causes the ejection of a drop of an ejectable liquid through the nozzle corresponding to that heater element; wherein,

the bubble forming chamber is at least partially formed by an amorphous ceramic material.

Amorphous ceramic material provides the bubble forming chamber with high strength. The non-crystalline structure avoids any points of weakness due to crystalline defects. These defects can act as stress concentration areas and are prone to failure.

According to a second aspect, the present invention provides a printer system which incorporates a printhead, the printhead comprising:

a plurality of nozzles;

a bubble forming chamber corresponding to each of the nozzles respectively, the bubble forming chambers adapted to contain a bubble forming liquid; and,

at least one heater element disposed in each of the bubble forming chambers respectively, the heater elements configured for thermal contact with the bubble forming liquid; such that,

heating the heater element to a temperature above the boiling point of the bubble forming liquid forms a gas bubble that causes the ejection of a drop of an ejectable liquid through the nozzle corresponding to that heater element; wherein,

the bubble forming chamber is at least partially formed by an amorphous ceramic material.

According to a third aspect, the present invention provides a method of ejecting drops of an ejectable liquid from a printhead, the printhead comprising a plurality of nozzles;

a chamber corresponding to each of the nozzles respectively, the chambers adapted to contain an ejectable liquid; and,
at least one droplet ejection actuator associated with each of the chambers respectively; wherein,
the chamber is at least partially formed by an amorphous ceramic material;
the method comprising the steps of:

placing the ejectable liquid into contact with the drop ejection actuator; and actuating the droplet ejection actuator such that a droplet of an ejectable liquid is ejected through the corresponding nozzle.

Preferably, the amorphous ceramic material is silicon nitride. In another form, the amorphous ceramic material is silicon dioxide. In yet another embodiment, the amorphous ceramic material is silicon oxynitride.

Preferably, the thermal actuator units are interconnected at a first end to a substrate and at a second end to a rigid strut member. The rigid strut member can, in turn, be interconnected to the arm having one end attached to the paddle vane. The thermal actuator units can operate upon conductive heating along a conductive trace and the conductive heating can include the generation of a substantial portion of the heat in the area adjacent the first end. The conductive heating trace can include a thinned cross-section adjacent the first end. The heating layers of the thermal actuator units can comprise substantially either a copper nickel alloy or titanium nitride. The paddle can be constructed from a similar conductive material to portions of the thermal actuator units however it is conductively insulated therefrom.

Preferably, the thermal actuator units are constructed from multiple layers utilizing a single mask to etch the multiple layers.

The nozzle chamber can include an actuator access port in a second surface of the chamber. The access port can comprise a slot in a corner of the chamber and the actuator is able to move in an arc through the slot. The actuator can include an end portion that mates substantially with a wall of the chamber at substantially right angles to the paddle vane. The paddle vane can include a depressed portion substantially opposite the fluid ejection port.

In accordance with a further aspect of the present invention, there is provided a thermal actuator including a series of lever arms attached at one end to a substrate, the thermal actuator being operational as a result of conductive heating of a conductive trace, the conductive trace including a thinned cross-section substantially adjacent the attachment to the substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

Notwithstanding any other forms that may fall within the scope of the present invention, preferred forms of the invention will now be described, by way of example only, with reference to the accompanying drawings in which:

FIGS. 1-3 illustrate the basic operational principles of a preferred embodiment using a thermal bend actuator;

FIG. 4 illustrates a three dimensional view of a single ink jet nozzle arrangement constructed in accordance with the preferred embodiment of FIG. 1;

FIG. 5 illustrates an array of the nozzle arrangements of FIG. 4;

FIG. 6 shows a table to be used with reference to FIGS. 7 to 16;

FIGS. 7 to 16 show various stages in the manufacture of the ink jet nozzle arrangement of FIG. 4;

FIG. 17 is a schematic cross-sectional view through an ink chamber of a unit cell of a printhead according to an embodiment using a bubble forming heater element;

FIG. 18 is a schematic cross-sectional view through the ink chamber FIG. 17, at another stage of operation;

FIG. 19 is a schematic cross-sectional view through the ink chamber FIG. 17, at yet another stage of operation;

FIG. 20 is a schematic cross-sectional view through the ink chamber FIG. 17, at yet a further stage of operation; and

FIG. 21 is a diagrammatic cross-sectional view through a unit cell of a printhead in accordance with an embodiment of the invention showing the collapse of a vapor bubble.

FIG. 22 is a schematic, partially cut away, perspective view of a further embodiment of a unit cell of a printhead.

FIG. 23 is a schematic, partially cut away, exploded perspective view of the unit cell of FIG. 22.

FIG. 24 is a schematic, partially cut away, perspective view of a further embodiment of a unit cell of a printhead.

FIG. 25 is a schematic, partially cut away, exploded perspective view of the unit cell of FIG. 24.

FIG. 26 is a schematic, partially cut away, perspective view of a further embodiment of a unit cell of a printhead.

FIG. 27 is a schematic, partially cut away, exploded perspective view of the unit cell of FIG. 26.

FIG. 28 is a schematic, partially cut away, perspective view of a further embodiment of a unit cell of a printhead.

FIG. 29 is a schematic, partially cut away, perspective view of a further embodiment of a unit cell of a printhead.

FIG. 30 is a schematic, partially cut away, exploded perspective view of the unit cell of FIG. 29.

FIGS. 31 to 41 are schematic perspective views of the unit cell shown in FIGS. 29 and 30, at various successive stages in the production process of the printhead.

FIGS. 42 and 43 show schematic, partially cut away, schematic perspective views of two variations of the unit cell of FIGS. 29 to 41.

FIG. 44 is a schematic, partially cut away, perspective view of a further embodiment of a unit cell of a printhead.

FIG. 45 is a schematic, partially cut away, perspective view of a further embodiment of a unit cell of a printhead.

DESCRIPTION OF PREFERRED AND OTHER EMBODIMENTS Thermal Bend Actuator

In one preferred embodiment, there is provided a nozzle arrangement having a nozzle chamber containing ink and a thermal bend actuator connected to a paddle positioned within the chamber. The thermal actuator device is actuated so as to eject ink from the nozzle chamber. The preferred embodiment includes a particular thermal bend actuator which includes a series of tapered portions for providing conductive heating of a conductive trace. The actuator is connected to the paddle via an arm received through a slotted wall of the nozzle chamber. The actuator arm has a mating shape so as to mate substantially with the surfaces of the slot in the nozzle chamber wall.

Turning initially to FIGS. 1-3, there is provided schematic illustrations of the basic operation of a nozzle arrangement of the invention. A nozzle chamber 1 is provided filled with ink 2 by means of an ink inlet channel 3 which can be etched through a wafer substrate on which the nozzle chamber 1 rests. The nozzle chamber 1 further includes an ink ejection port 4 around which an ink meniscus forms.

Inside the nozzle chamber 1 is a paddle type device 7 which is interconnected to an actuator 8 through a slot in the wall of the nozzle chamber 1. The actuator 8 includes a heater means eg. 9 located adjacent to an end portion of a post 10. The post 10 is fixed to a substrate.

When it is desired to eject a drop from the nozzle chamber 1, as illustrated in FIG. 2, the heater means 9 is heated so as to undergo thermal expansion. Preferably, the heater means 9 itself or the other portions of the actuator 8 are built from materials having a high bend efficiency where the bend efficiency is defined as

$bend efficiency = \frac{{Young}^{'} s Modulus \times (Coefficient of thermal Expansion)}{Density \times Specific Heat Capacity}$

A suitable material for the heater elements is a copper nickel alloy which can be formed so as to bend a glass material.

The heater means 9 is ideally located adjacent the end portion of the post 10 such that the effects of activation are magnified at the paddle end 7 such that small thermal expansions near the post 10 result in large movements of the paddle end.

The heater means 9 and consequential paddle movement causes a general increase in pressure around the ink meniscus 5 which expands, as illustrated in FIG. 2, in a rapid manner. The heater current is pulsed and ink is ejected out of the port 4 in addition to flowing in from the ink channel 3.

Subsequently, the paddle 7 is deactivated to again return to its quiescent position. The deactivation causes a general reflow of the ink into the nozzle chamber. The forward momentum of the ink outside the nozzle rim and the corresponding backflow results in a general necking and breaking off of the drop 12 which proceeds to the print media. The collapsed meniscus 5 results in a general sucking of ink into the nozzle chamber 2 via the ink flow channel 3. In time, the nozzle chamber 1 is refilled such that the position in FIG. 1 is again reached and the nozzle chamber is subsequently ready for the ejection of another drop of ink.

FIG. 4 illustrates a side perspective view of the nozzle arrangement FIG. 5 illustrates sectional view through an array of nozzle arrangement of FIG. 4. In these figures, the numbering of elements previously introduced has been retained.

Firstly, the actuator 8 includes a series of tapered actuator units e.g. 15 which comprise an upper glass portion (amorphous silicon dioxide) 16 formed on top of a titanium nitride layer 17. Alternatively a copper nickel alloy layer (hereinafter called cupronickel) can be utilized which will have a higher bend efficiency where bend efficiency is defined as:

$bend efficiency = \frac{{Young}^{'} s Modulus \times (Coefficient of thermal Expansion)}{Density \times Specific Heat Capacity}$

The titanium nitride layer 17 is in a tapered form and, as such, resistive heating takes place near an end portion of the post 10. Adjacent titanium nitride/glass portions 15 are interconnected at a block portion 19 which also provides a mechanical structural support for the actuator 8.

The heater means 9 ideally includes a plurality of the tapered actuator unit 15 which are elongate and spaced apart such that, upon heating, the bending force exhibited along the axis of the actuator 8 is maximized. Slots are defined between adjacent tapered units 15 and allow for slight differential operation of each actuator 8 with respect to adjacent actuators 8.

The block portion 19 is interconnected to an arm 20. The arm 20 is in turn connected to the paddle 7 inside the nozzle chamber 1 by means of a slot e.g. 22 formed in the side of the nozzle chamber 1. The slot 22 is designed generally to mate with the surfaces of the arm 20 so as to minimize opportunities for the outflow of ink around the arm 20. The ink is held generally within the nozzle chamber 1 via surface tension effects around the slot 22.

When it is desired to actuate the arm 20, a conductive current is passed through the titanium nitride layer 17 via vias within the block portion 19 connecting to a lower CMOS layer 6 which provides the necessary power and control circuitry for the nozzle arrangement. The conductive current results in heating of the nitride layer 17 adjacent to the post 10 which results in a general upward bending of the arm 20 and consequential ejection of ink out of the nozzle 4. The ejected drop is printed on a page in the usual manner for an inkjet printer as previously described.

An array of nozzle arrangements can be formed so as to create a single printhead. For example, in FIG. 5 there is illustrated a partly sectioned various array view which comprises multiple ink ejection nozzle arrangements of FIG. 4 laid out in interleaved lines so as to form a printhead array. Of course, different types of arrays can be formulated including full color arrays etc.

The construction of the printhead system described can proceed utilizing standard MEMS techniques through suitable modification of the steps as set out in U.S. Pat. No. 6,243,113 entitled “Image Creation Method and Apparatus (IJ 41)” to the present applicant, the contents of which are fully incorporated by cross reference.

Fabrication of the ink jet nozzle arrangement is indicated in FIGS. 7 to 16. The preferred embodiment achieves a particular balance between utilization of the standard semi-conductor processing material such as titanium nitride and glass in a MEMS process. The use of glass, or indeed any amorphous ceramic, to form the chamber is particularly beneficial. The pressure transients within the chamber can exert significant stresses on the chamber wall. Amorphous ceramics are relatively inexpensive and high strength, but also have a non-crystalline structure. Defects in a crystal structure can act as stress concentration points that are prone to failure in the cyclical loading environment of the nozzle chambers.

Obviously the skilled person may make other choices of materials and design features where the economics are justified. For example, a copper nickel alloy of 50% copper and 50% nickel may be more advantageously deployed as the conductive heating compound as it is likely to have higher levels of bend efficiency. Also, other design structures may be employed where it is not necessary to provide for such a simple form of manufacture.

Bubble Forming Heater Element Actuator

The present invention is also applicable to printheads using bubble forming heater elements. FIGS. 17 to 20 show a nozzle of this type. While the fabrication of nozzles of this type is described below, the nozzles, ejection actuators, associated drive circuitry and ink supply passages is formed on and through a wafer using lithographically masked etching techniques described in great detail in U.S. Ser. No. 10/302,274. In the interests of brevity, the disclosure of the '274 application is incorporated herein in it entirety.

With reference to FIGS. 17 to 20, the unit cell 1 of a printhead according to an embodiment of the invention comprises a nozzle plate 2 with nozzles 3 therein, the nozzles having nozzle rims 4, and apertures 5 extending through the nozzle plate. The nozzle plate 2 is plasma etched from a silicon nitride structure which is deposited, by way of chemical vapor deposition (CVD), over a sacrificial material which is subsequently etched.

The printhead also includes, with respect to each nozzle 3, side walls 6 on which the nozzle plate is supported, a chamber 7 defined by the walls and the nozzle plate 2, a multi-layer substrate 8 and an inlet passage 9 extending through the multi-layer substrate to the far side (not shown) of the substrate. A looped, elongate heater element 10 is suspended within the chamber 7, so that the element is in the form of a suspended beam. The printhead as shown is a microelectromechanical system (MEMS) structure, which is formed by a lithographic process which is described in more detail below.

When the printhead is in use, ink 11 from a reservoir (not shown) enters the chamber 7 via the inlet passage 9, so that the chamber fills to the level as shown in FIG. 17. Thereafter, the heater element 10 is heated for somewhat less than 1 microsecond, so that the heating is in the form of a thermal pulse. It will be appreciated that the heater element 10 is in thermal contact with the ink 11 in the chamber 7 so that when the element is heated, this causes the generation of vapor bubbles 12 in the ink. Accordingly, the ink 11 constitutes a bubble forming liquid. FIG. 17 shows the formation of a bubble 12 approximately 1 microsecond after generation of the thermal pulse, that is, when the bubble has just nucleated on the heater elements 10. It will be appreciated that, as the heat is applied in the form of a pulse, all the energy necessary to generate the bubble 12 is to be supplied within that short time.

When the element 10 is heated as described above, the bubble 12 forms along the length of the element, this bubble appearing, in the cross-sectional view of FIG. 17, as four bubble portions, one for each of the element portions shown in cross section.

The bubble 12, once generated, causes an increase in pressure within the chamber 7, which in turn causes the ejection of a drop 16 of the ink 11 through the nozzle 3. The rim 4 assists in directing the drop 16 as it is ejected, so as to minimize the chance of drop misdirection.

The reason that there is only one nozzle 3 and chamber 7 per inlet passage 9 is so that the pressure wave generated within the chamber, on heating of the element 10 and forming of a bubble 12, does not affect adjacent chambers and their corresponding nozzles. As discussed above in relation to the previous embodiment, the pressure wave generated within the chamber creates significant stresses in the chamber wall. Forming the chamber from an amorphous ceramic such as silicon nitride, silicon dioxide (glass) or silicon oxynitride, gives the chamber walls high strength while avoiding the use of material with a crystal structure. Crystalline defects can act as stress concentration points and therefore potential areas of weakness and ultimately failure.

FIGS. 18 and 19 show the unit cell 1 at two successive later stages of operation of the printhead. It can be seen that the bubble 12 generates further, and hence grows, with the resultant advancement of ink 11 through the nozzle 3. The shape of the bubble 12 as it grows, as shown in FIG. 3, is determined by a combination of the inertial dynamics and the surface tension of the ink 11. The surface tension tends to minimize the surface area of the bubble 12 so that, by the time a certain amount of liquid has evaporated, the bubble is essentially disk-shaped.

The increase in pressure within the chamber 7 not only pushes ink 11 out through the nozzle 3, but also pushes some ink back through the inlet passage 9. However, the inlet passage 9 is approximately 200 to 300 microns in length, and is only approximately 16 microns in diameter.

Hence there is a substantial viscous drag. As a result, the predominant effect of the pressure rise in the chamber 7 is to force ink out through the nozzle 3 as an ejected drop 16, rather than back through the inlet passage 9.

Turning now to FIG. 20, the printhead is shown at a still further successive stage of operation, in which the ink drop 16 that is being ejected is shown during its “necking phase” before the drop breaks off. At this stage, the bubble 12 has already reached its maximum size and has then begun to collapse towards the point of collapse 17, as reflected in more detail in FIG. 21.

The collapsing of the bubble 12 towards the point of collapse 17 causes some ink 11 to be drawn from within the nozzle 3 (from the sides 18 of the drop), and some to be drawn from the inlet passage 9, towards the point of collapse. Most of the ink 11 drawn in this manner is drawn from the nozzle 3, forming an annular neck 19 at the base of the drop 16 prior to its breaking off.

The drop 16 requires a certain amount of momentum to overcome surface tension forces, in order to break off. As ink 11 is drawn from the nozzle 3 by the collapse of the bubble 12, the diameter of the neck 19 reduces thereby reducing the amount of total surface tension holding the drop, so that the momentum of the drop as it is ejected out of the nozzle is sufficient to allow the drop to break off.

When the drop 16 breaks off, cavitation forces are caused as reflected by the arrows 20, as the bubble 12 collapses to the point of collapse 17. It will be noted that there are no solid surfaces in the vicinity of the point of collapse 17 on which the cavitation can have an effect.

Features and Advantages of Further Embodiments

FIGS. 22 to 45 show further embodiments of unit cells 1 for thermal inkjet printheads, each embodiment having its own particular functional advantages. These advantages will be discussed in detail below, with reference to each individual embodiment. However, the basic construction of each embodiment is best shown in FIGS. 23, 25, 27 and 30. The manufacturing process is substantially the same as that described above in relation to FIGS. 6 to 31 of the above referenced U.S. Ser. No. 10/302,274 (incorporated herein by cross reference). For consistency, the same reference numerals are used in FIGS. 22 to 45 to indicate corresponding components. In the interests of brevity, the fabrication stages have been shown for the unit cell of FIG. 29 only (see FIGS. 31 to 41). It will be appreciated that the other unit cells will use the same fabrication stages with different masking. Again, the deposition of successive layers shown in FIGS. 31 to 41 need not be described in detail below given that the lithographic process largely corresponds to that shown in FIGS. 6 to 31 in U.S. Ser. No. 10/302,274.

Referring to FIGS. 22 and 23, the unit cell 1 shown has the chamber 7, ink supply passage 32 and the nozzle rim 4 positioned mid way along the length of the unit cell 1. As best seen in FIG. 23, the drive circuitry is partially on one side of the chamber 7 with the remainder on the opposing side of the chamber. The drive circuitry 22 controls the operation of the heater 14 through vias in the integrated circuit metallisation layers of the interconnect 23. The interconnect 23 has a raised metal layer on its top surface. Passivation layer 24 is formed in top of the interconnect 23 but leaves areas of the raised metal layer exposed. Electrodes 15 of the heater 14 contact the exposed metal areas to supply power to the element 10.

Alternatively, the drive circuitry 22 for one unit cell is not on opposing sides of the heater element that it controls. All the drive circuitry 22 for the heater 14 of one unit cell is in a single, undivided area that is offset from the heater. That is, the drive circuitry 22 is partially overlaid by one of the electrodes 15 of the heater 14 that it is controlling, and partially overlaid by one or more of the heater electrodes 15 from adjacent unit cells. In this situation, the center of the drive circuitry 22 is less than 200 microns from the center of the associate nozzle aperture 5. In most Memjet printheads of this type, the offset is less than 100 microns and in many cases less than 50 microns, preferably less than 30 microns.

Configuring the nozzle components so that there is significant overlap between the electrodes and the drive circuitry provides a compact design with high nozzle density (nozzles per unit area of the nozzle plate 2). This also improves the efficiency of the printhead by shortening the length of the conductors from the circuitry to the electrodes. The shorter conductors have less resistance and therefore dissipate less energy.

The high degree of overlap between the electrodes 15 and the drive circuitry 22 also allows more vias between the heater material and the CMOS metalization layers of the interconnect 23. As best shown in FIGS. 30 and 31, the passivation layer 24 has an array of vias to establish an electrical connection with the heater 14. More vias lowers the resistance between the heater electrodes 15 and the interconnect layer 23 which reduces power losses.

In FIGS. 24 and 25, the unit cell 1 is the same as that of FIGS. 22 and 23 apart from the heater element 10. The heater element 10 has a bubble nucleation section 158 with a smaller cross section than the remainder of the element. The bubble nucleation section 158 has a greater resistance and heats to a temperature above the boiling point of the ink before the remainder of the element 10. The gas bubble nucleates at this region and subsequently grows to surround the rest of the element 10. By controlling the bubble nucleation and growth, the trajectory of the ejected drop is more predictable.

The heater element 10 is configured to accommodate thermal expansion in a specific manner. As heater elements expand, they will deform to relieve the strain. Elements such as that shown in FIGS. 22 and 23 will bow out of the plane of lamination because its thickness is the thinnest cross sectional dimension and therefore has the least bending resistance. Repeated bending of the element can lead to the formation of cracks, especially at sharp corners, which can ultimately lead to failure. The heater element 10 shown in FIGS. 24 and 25 is configured so that the thermal expansion is relieved by rotation of the bubble nucleation section 158, and slightly splaying the sections leading to the electrodes 15, in preference to bowing out of the plane of lamination. The geometry of the element is such that miniscule bending within the plane of lamination is sufficient to relieve the strain of thermal expansion, and such bending occurs in preference to bowing. This gives the heater element greater longevity and reliability by minimizing bend regions, which are prone to oxidation and cracking.

Referring to FIGS. 26 and 27, the heater element 10 used in this unit cell 1 has a serpentine or ‘double omega’ shape. This configuration keeps the gas bubble centered on the axis of the nozzle. A single omega is a simple geometric shape which is beneficial from a fabrication perspective. However the gap 159 between the ends of the heater element means that the heating of the ink in the chamber is slightly asymmetrical. As a result, the gas bubble is slightly skewed to the side opposite the gap 159. This can in turn affect the trajectory of the ejected drop. The double omega shape provides the heater element with the gap 160 to compensate for the gap 159 so that the symmetry and position of the bubble within the chamber is better controlled and the ejected drop trajectory is more reliable.

FIG. 28 shows a heater element 10 with a single omega shape. As discussed above, the simplicity of this shape has significant advantages during lithographic fabrication. It can be a single current path that is relatively wide and therefore less affected by any inherent inaccuracies in the deposition of the heater material. The inherent inaccuracies of the equipment used to deposit the heater material result in variations in the dimensions of the element. However, these tolerances are fixed values so the resulting variations in the dimensions of a relatively wide component are proportionally less than the variations for a thinner component. It will be appreciated that proportionally large changes of components dimensions will have a greater effect on their intended function. Therefore the performance characteristics of a relatively wide heater element are more reliable than a thinner one.

The omega shape directs current flow around the axis of the nozzle aperture 5. This gives good bubble alignment with the aperture for better ejection of drops while ensuring that the bubble collapse point is not on the heater element 10. As discussed above, this avoids problems caused by cavitation.

Referring to FIGS. 29 to 42, another embodiment of the unit cell 1 is shown together with several stages of the etching and deposition fabrication process. In this embodiment, the heater element 10 is suspended from opposing sides of the chamber. This allows it to be symmetrical about two planes that intersect along the axis of the nozzle aperture 5. This configuration provides a drop trajectory along the axis of the nozzle aperture 5 while avoiding the cavitation problems discussed above. FIGS. 43 and 44 show other variations of this type of heater element 10.

FIG. 44 shows a unit cell 1 that has the nozzle aperture 5 and the heater element 10 offset from the center of the nozzle chamber 7. Consequently, the nozzle chamber 7 is larger than the previous embodiments. The heater 14 has two different electrodes 15 with the right hand electrode 15 extending well into the nozzle chamber 7 to support one side of the heater element 10. This reduces the area of the vias contacting the electrodes which can increase the electrode resistance and therefore the power losses. However, laterally offsetting the heater element from the ink inlet 31 increases the fluidic drag retarding flow back through the inlet 31 and ink supply passage 32. The fluidic drag through the nozzle aperture 5 comparatively much smaller so little energy is lost to a reverse flow of ink through the inlet when a gas bubble form on the element 10.

The unit cell 1 shown in FIG. 45 also has a relatively large chamber 7 which again reduces the surface area of the electrodes in contact with the vias leading to the interconnect layer 23. However, the larger chamber 7 allows several heater elements 10 offset from the nozzle aperture 5. The arrangement shown uses two heater elements 10; one on either side of the chamber 7. Other designs use three or more elements in the chamber. Gas bubbles nucleate from opposing sides of the nozzle aperture and converge to form a single bubble. The bubble formed is symmetrical about at least one plane extending along the nozzle axis. This enhances the control of the symmetry and position of the bubble within the chamber 7 and therefore the ejected drop trajectory is more reliable.

Other Embodiments

The invention has been described above with reference to printheads using thermal bend actuators and bubble forming heater elements. However, it is potentially suited to a wide range of printing system including: color and monochrome office printers, short run digital printers, high speed digital printers, offset press supplemental printers, low cost scanning printers high speed pagewidth printers, notebook computers with inbuilt pagewidth printers, portable color and monochrome printers, color and monochrome copiers, color and monochrome facsimile machines, combined printer, facsimile and copying machines, label printers, large format plotters, photograph copiers, printers for digital photographic “minilabs”, video printers, PHOTO CD (PHOTO CD is a registered trade mark of the Eastman Kodak Company) printers, portable printers for PDAs, wallpaper printers, indoor sign printers, billboard printers, fabric printers, camera printers and fault tolerant commercial printer arrays.

It will be appreciated by ordinary workers in this field that numerous variations and/or modifications may be made to the present invention as shown in the specific embodiments without departing from the spirit or scope of the invention as broadly described. The present embodiments are, therefore, to be considered in all respects to be illustrative and not restrictive.

Ink Jet Technologies

The embodiments of the invention use an ink jet printer type device. Of course many different devices could be used. However presently popular ink jet printing technologies are unlikely to be suitable.

The most significant problem with thermal ink jet is power consumption. This is approximately 100 times that required for high speed, and stems from the energy-inefficient means of drop ejection. This involves the rapid boiling of water to produce a vapor bubble which expels the ink. Water has a very high heat capacity, and must be superheated in thermal ink jet applications. In conventional thermal inkjet printheads, this leads to an efficiency of around 0.02%, from electricity input to drop momentum (and increased surface area) out.

The most significant problem with piezoelectric ink jet is size and cost. Piezoelectric crystals have a very small deflection at reasonable drive voltages, and therefore require a large area for each nozzle. Also, each piezoelectric actuator must be connected to its drive circuit on a separate substrate. This is not a significant problem at the current limit of around 300 nozzles per printhead, but is a major impediment to the fabrication of pagewidth printheads with 19,200 nozzles.

Ideally, the ink jet technologies used meet the stringent requirements of in-camera digital color printing and other high quality, high speed, low cost printing applications. To meet the requirements of digital photography, new ink jet technologies have been created. The target features include:

low power (less than 10 Watts)

high resolution capability (1,600 dpi or more)

photographic quality output

low manufacturing cost

small size (pagewidth times minimum cross section)

high speed (<2 seconds per page).

All of these features can be met or exceeded by the ink jet systems described below with differing levels of difficulty. Forty-five different ink jet technologies have been developed by the Assignee to give a wide range of choices for high volume manufacture. These technologies form part of separate applications assigned to the present Assignee as set out in the table under the heading Cross References to Related Applications.

The ink jet designs shown here are suitable for a wide range of digital printing systems, from battery powered one-time use digital cameras, through to desktop and network printers, and through to commercial printing systems.

For ease of manufacture using standard process equipment, the printhead is designed to be a monolithic 0.5 micron CMOS chip with MEMS post processing. For color photographic applications, the printhead is 100 mm long, with a width which depends upon the ink jet type. The smallest printhead designed is IJ38, which is 0.35 mm wide, giving a chip area of 35 square mm. The printheads each contain 19,200 nozzles plus data and control circuitry.

Ink is supplied to the back of the printhead by injection molded plastic ink channels. The molding requires 50 micron features, which can be created using a lithographically micromachined insert in a standard injection molding tool. Ink flows through holes etched through the wafer to the nozzle chambers fabricated on the front surface of the wafer. The printhead is connected to the camera circuitry by tape automated bonding.

Tables of Drop-On-Demand Ink Jets

Eleven important characteristics of the fundamental operation of individual ink jet nozzles have been identified. These characteristics are largely orthogonal, and so can be elucidated as an eleven dimensional matrix. Most of the eleven axes of this matrix include entries developed by the present assignee.

The following tables form the axes of an eleven dimensional table of ink jet types.

Actuator mechanism (18 types)

Basic operation mode (7 types)

Auxiliary mechanism (8 types)

Actuator amplification or modification method (17 types)

Actuator motion (19 types)

Nozzle refill method (4 types)

Method of restricting back-flow through inlet (10 types)

Nozzle clearing method (9 types)

Nozzle plate construction (9 types)

Drop ejection direction (5 types)

Ink type (7 types)

The complete eleven dimensional table represented by these axes contains 36.9 billion possible configurations of ink jet nozzle. While not all of the possible combinations result in a viable ink jet technology, many million configurations are viable. It is clearly impractical to elucidate all of the possible configurations. Instead, certain ink jet types have been investigated in detail. These are designated IJ01 to IJ45 above which matches the docket numbers in the table under the heading Cross References to Related Applications

Other ink jet configurations can readily be derived from these forty-five examples by substituting alternative configurations along one or more of the 11 axes. Most of the IJ01 to IJ45 examples can be made into ink jet printheads with characteristics superior to any currently available ink jet technology.

Where there are prior art examples known to the inventor, one or more of these examples are listed in the examples column of the tables below. The IJ01 to IJ45 series are also listed in the examples column. In some cases, print technology may be listed more than once in a table, where it shares characteristics with more than one entry.

Suitable applications for the ink jet technologies include: Home printers, Office network printers, Short run digital printers, Commercial print systems, Fabric printers, Pocket printers, Internet WWW printers, Video printers, Medical imaging, Wide format printers, Notebook PC in printers, Fax machines, Industrial printing systems, Photocopiers, Photographic minilabs etc.

The information associated with the aforementioned 11 dimensional matrix are set out in the following tables.

ACTUATOR MECHANISM (APPLIED ONLY TO SELECTED INK DROPS) Description Advantages Disadvantages Examples Thermal An electrothermal Large force High power Canon bubble heater heats the generated Ink carrier Bubblejet 1979 ink to above Simple limited to water Endo et al GB boiling point, construction Low patent 2,007,162 transferring No moving efficiency Xerox heater- significant heat to parts High in-pit 1990 the aqueous ink. A Fast operation temperatures Hawkins et al bubble nucleates Small chip required U.S. Pat. No. 4,899,181 and quickly forms, area required for High Hewlett- expelling the ink. actuator mechanical Packard TIJ The efficiency of stress 1982 Vaught et the process is low, Unusual al U.S. Pat. No. with typically less materials 4,490,728 than 0.05% of the required electrical energy Large drive being transformed transistors into kinetic energy Cavitation of the drop. causes actuator failure Kogation reduces bubble formation Large print heads are difficult to fabricate Piezo- A piezoelectric Low power Very large Kyser et al electric crystal such as consumption area required for U.S. Pat. No. 3,946,398 lead lanthanum Many ink actuator Zoltan U.S. Pat. No. zirconate (PZT) is types can be Difficult to 3,683,212 electrically used integrate with 1973 Stemme activated, and Fast operation electronics U.S. Pat. No. 3,747,120 either expands, High High voltage Epson Stylus shears, or bends to efficiency drive transistors Tektronix apply pressure to required IJ04 the ink, ejecting Full drops. pagewidth print heads impractical due to actuator size Requires electrical poling in high field strengths during manufacture Electro- An electric field is Low power Low Seiko Epson, strictive used to activate consumption maximum strain Usui et all JP electrostriction in Many ink (approx. 0.01%) 253401/96 relaxor materials types can be Large area IJ04 such as lead used required for lanthanum Low thermal actuator due to zirconate titanate expansion low strain (PLZT) or lead Electric field Response magnesium strength required speed is niobate (PMN). (approx. 3.5 V/μm) marginal (~ 10 μs) can be High voltage generated drive transistors without required difficulty Full Does not pagewidth print require electrical heads poling impractical due to actuator size Ferro- An electric field is Low power Difficult to IJ04 electric used to induce a consumption integrate with phase transition Many ink electronics between the types can be Unusual antiferroelectric used materials such as (AFE) and Fast operation PLZSnT are ferroelectric (FE) (<1 μs) required phase. Perovskite Relatively Actuators materials such as high longitudinal require a large tin modified lead strain area lanthanum High zirconate titanate efficiency (PLZSnT) exhibit Electric field large strains of up strength of to 1% associated around 3 V/μm with the AFE to can be readily FE phase provided transition. Electro- Conductive plates Low power Difficult to IJ02, IJ04 static are separated by a consumption operate plates compressible or Many ink electrostatic fluid dielectric types can be devices in an (usually air). Upon used aqueous application of a Fast operation environment voltage, the plates The attract each other electrostatic and displace ink, actuator will causing drop normally need to ejection. The be separated conductive plates from the ink may be in a comb Very large or honeycomb area required to structure, or achieve high stacked to increase forces the surface area High voltage and therefore the drive transistors force. may be required Full pagewidth print heads are not competitive due to actuator size Electro- A strong electric Low current High voltage 1989 Saito et static pull field is applied to consumption required al, U.S. Pat. No. on ink the ink, whereupon Low May be 4,799,068 electrostatic temperature damaged by 1989 Miura et attraction sparks due to air al, U.S. Pat. No. accelerates the ink breakdown 4,810,954 towards the print Required field Tone-jet medium. strength increases as the drop size decreases High voltage drive transistors required Electrostatic field attracts dust Permanent An electromagnet Low power Complex IJ07, IJ10 magnet directly attracts a consumption fabrication electro- permanent magnet, Many ink Permanent magnetic displacing ink and types can be magnetic causing drop used material such as ejection. Rare Fast operation Neodymium Iron earth magnets with High Boron (NdFeB) a field strength efficiency required. around 1 Tesla can Easy High local be used. Examples extension from currents required are: Samarium single nozzles to Copper Cobalt (SaCo) and pagewidth print metalization magnetic materials heads should be used in the neodymium for long iron boron family electromigration (NdFeB, lifetime and low NdDyFeBNb, resistivity NdDyFeB, etc) Pigmented inks are usually infeasible Operating temperature limited to the Curie temperature (around 540 K) Soft A solenoid Low power Complex IJ01, IJ05, magnetic induced a consumption fabrication IJ08, IJ10, IJ12, core magnetic field in a Many ink Materials not IJ14, IJ15, IJ17 electro- soft magnetic core types can be usually present magnetic or yoke fabricated used in a CMOS fab from a ferrous Fast operation such as NiFe, material such as High CoNiFe, or CoFe electroplated iron efficiency are required alloys such as Easy High local CoNiFe [1], CoFe, extension from currents required or NiFe alloys. single nozzles to Copper Typically, the soft pagewidth print metalization magnetic material heads should be used is in two parts, for long which are electromigration normally held lifetime and low apart by a spring. resistivity When the solenoid Electroplating is actuated, the two is required parts attract, High displacing the ink. saturation flux density is required (2.0-2.1 T is achievable with CoNiFe [1]) Lorenz The Lorenz force Low power Force acts as a IJ06, IJ11, force acting on a current consumption twisting motion IJ13, IJ16 carrying wire in a Many ink Typically, magnetic field is types can be only a quarter of utilized. used the solenoid This allows the Fast operation length provides magnetic field to High force in a useful be supplied efficiency direction externally to the Easy High local print head, for extension from currents required example with rare single nozzles to Copper earth permanent pagewidth print metalization magnets. heads should be used Only the current for long carrying wire need electromigration be fabricated on lifetime and low the print-head, resistivity simplifying Pigmented materials inks are usually requirements. infeasible Magneto- The actuator uses Many ink Force acts as a Fischenbeck, striction the giant types can be twisting motion U.S. Pat. No. 4,032,929 magnetostrictive used Unusual IJ25 effect of materials Fast operation materials such as such as Terfenol-D Easy Terfenol-D are (an alloy of extension from required terbium, single nozzles to High local dysprosium and pagewidth print currents required iron developed at heads Copper the Naval High force is metalization Ordnance available should be used Laboratory, hence for long Ter-Fe-NOL). For electromigration best efficiency, the lifetime and low actuator should be resistivity pre-stressed to Pre-stressing approx. 8 MPa. may be required Surface Ink under positive Low power Requires Silverbrook, tension pressure is held in consumption supplementary EP 0771 658 A2 reduction a nozzle by surface Simple force to effect and related tension. The construction drop separation patent surface tension of No unusual Requires applications the ink is reduced materials special ink below the bubble required in surfactants threshold, causing fabrication Speed may be the ink to egress High limited by from the nozzle. efficiency surfactant Easy properties extension from single nozzles to pagewidth print heads Viscosity The ink viscosity Simple Requires Silverbrook, reduction is locally reduced construction supplementary EP 0771 658 A2 to select which No unusual force to effect and related drops are to be materials drop separation patent ejected. A required in Requires applications viscosity reduction fabrication special ink can be achieved Easy viscosity electrothermally extension from properties with most inks, but single nozzles to High speed is special inks can be pagewidth print difficult to engineered for a heads achieve 100:1 viscosity Requires reduction. oscillating ink pressure A high temperature difference (typically 80 degrees) is required Acoustic An acoustic wave Can operate Complex 1993 is generated and without a nozzle drive circuitry Hadimioglu et focussed upon the plate Complex al, EUP 550,192 drop ejection fabrication 1993 Elrod et region. Low al, EUP 572,220 efficiency Poor control of drop position Poor control of drop volume Thermo- An actuator which Low power Efficient IJ03, IJ09, elastic relies upon consumption aqueous IJ17, IJ18, IJ19, bend differential Many ink operation IJ20, IJ21, IJ22, actuator thermal expansion types can be requires a IJ23, IJ24, IJ27, upon Joule heating used thermal insulator IJ28, IJ29, IJ30, is used. Simple planar on the hot side IJ31, IJ32, IJ33, fabrication Corrosion IJ34, IJ35, IJ36, Small chip prevention can IJ37, IJ38, IJ39, area required for be difficult IJ40, IJ41 each actuator Pigmented Fast operation inks may be High infeasible, as efficiency pigment particles CMOS may jam the compatible bend actuator voltages and currents Standard MEMS processes can be used Easy extension from single nozzles to pagewidth print heads High CTE A material with a High force Requires IJ09, IJ17, thermo- very high can be generated special material IJ18, IJ20, IJ21, elastic coefficient of Three (e.g. PTFE) IJ22, IJ23, IJ24, actuator thermal expansion methods of Requires a IJ27, IJ28, IJ29, (CTE) such as PTFE deposition PTFE deposition IJ30, IJ31, IJ42, polytetrafluoroethylene are under process, which is IJ43, IJ44 (PTFE) is development: not yet standard used. As high CTE chemical vapor in ULSI fabs materials are deposition PTFE usually non- (CVD), spin deposition conductive, a coating, and cannot be heater fabricated evaporation followed with from a conductive PTFE is a high temperature material is candidate for (above 350° C.) incorporated. A 50 μm low dielectric processing long PTFE constant Pigmented bend actuator with insulation in inks may be polysilicon heater ULSI infeasible, as and 15 mW power Very low pigment particles input can provide power may jam the 180 μN force and consumption bend actuator 10 μm deflection. Many ink Actuator motions types can be include: used Bend Simple planar Push fabrication Buckle Small chip Rotate area required for each actuator Fast operation High efficiency CMOS compatible voltages and currents Easy extension from single nozzles to pagewidth print heads Conductive A polymer with a High force Requires IJ24 polymer high coefficient of can be generated special materials thermo- thermal expansion Very low development elastic (such as PTFE) is power (High CTE actuator doped with consumption conductive conducting Many ink polymer) substances to types can be Requires a increase its used PTFE deposition conductivity to Simple planar process, which is about 3 orders of fabrication not yet standard magnitude below Small chip in ULSI fabs that of copper. The area required for PTFE conducting each actuator deposition polymer expands Fast operation cannot be when resistively High followed with heated. efficiency high temperature Examples of CMOS (above 350° C.) conducting compatible processing dopants include: voltages and Evaporation Carbon nanotubes currents and CVD Metal fibers Easy deposition Conductive extension from techniques polymers such as single nozzles to cannot be used doped pagewidth print Pigmented polythiophene heads inks may be Carbon granules infeasible, as pigment particles may jam the bend actuator Shape A shape memory High force is Fatigue limits IJ26 memory alloy such as TiNi available maximum alloy (also known as (stresses of number of cycles Nitinol - Nickel hundreds of Low strain Titanium alloy MPa) (1%) is required developed at the Large strain is to extend fatigue Naval Ordnance available (more resistance Laboratory) is than 3%) Cycle rate thermally switched High limited by heat between its weak corrosion removal martensitic state resistance Requires and its high Simple unusual stiffness austenic construction materials (TiNi) state. The shape of Easy The latent the actuator in its extension from heat of martensitic state is single nozzles to transformation deformed relative pagewidth print must be to the austenic heads provided shape. The shape Low voltage High current change causes operation operation ejection of a drop. Requires pre- stressing to distort the martensitic state Linear Linear magnetic Linear Requires IJ12 Magnetic actuators include Magnetic unusual Actuator the Linear actuators can be semiconductor Induction Actuator constructed with materials such as (LIA), Linear high thrust, long soft magnetic Permanent Magnet travel, and high alloys (e.g. Synchronous efficiency using CoNiFe) Actuator planar Some varieties (LPMSA), Linear semiconductor also require Reluctance fabrication permanent Synchronous techniques magnetic Actuator (LRSA), Long actuator materials such as Linear Switched travel is Neodymium iron Reluctance available boron (NdFeB) Actuator (LSRA), Medium force Requires and the Linear is available complex multi- Stepper Actuator Low voltage phase drive (LSA). operation circuitry High current operation

BASIC OPERATION MODE Description Advantages Disadvantages Examples Actuator This is the Simple Drop Thermal ink directly simplest mode of operation repetition rate is jet pushes operation: the No external usually limited Piezoelectric ink actuator directly fields required to around 10 kHz. ink jet supplies sufficient Satellite drops However, IJ01, IJ02, kinetic energy to can be avoided if this is not IJ03, IJ04, IJ05, expel the drop. drop velocity is fundamental to IJ06, IJ07, IJ09, The drop must less than 4 m/s the method, but IJ11, IJ12, IJ14, have a sufficient Can be is related to the IJ16, IJ20, IJ22, velocity to efficient, refill method IJ23, IJ24, IJ25, overcome the depending upon normally used IJ26, IJ27, IJ28, surface tension. the actuator used All of the drop IJ29, IJ30, IJ31, kinetic energy IJ32, IJ33, IJ34, must be IJ35, IJ36, IJ37, provided by the IJ38, IJ39, IJ40, actuator IJ41, IJ42, IJ43, Satellite drops IJ44 usually form if drop velocity is greater than 4.5 m/s Proximity The drops to be Very simple Requires close Silverbrook, printed are print head proximity EP 0771 658 A2 selected by some fabrication can between the and related manner (e.g. be used print head and patent thermally induced The drop the print media applications surface tension selection means or transfer roller reduction of does not need to May require pressurized ink). provide the two print heads Selected drops are energy required printing alternate separated from the to separate the rows of the ink in the nozzle drop from the image by contact with the nozzle Monolithic print medium or a color print heads transfer roller. are difficult Electro- The drops to be Very simple Requires very Silverbrook, static pull printed are print head high electrostatic EP 0771 658 A2 on ink selected by some fabrication can field and related manner (e.g. be used Electrostatic patent thermally induced The drop field for small applications surface tension selection means nozzle sizes is Tone-Jet reduction of does not need to above air pressurized ink). provide the breakdown Selected drops are energy required Electrostatic separated from the to separate the field may attract ink in the nozzle drop from the dust by a strong electric nozzle field. Magnetic The drops to be Very simple Requires Silverbrook, pull on printed are print head magnetic ink EP 0771 658 A2 ink selected by some fabrication can Ink colors and related manner (e.g. be used other than black patent thermally induced The drop are difficult applications surface tension selection means Requires very reduction of does not need to high magnetic pressurized ink). provide the fields Selected drops are energy required separated from the to separate the ink in the nozzle drop from the by a strong nozzle magnetic field acting on the magnetic ink. Shutter The actuator High speed Moving parts IJ13, IJ17, moves a shutter to (>50 kHz) are required IJ21 block ink flow to operation can be Requires ink the nozzle. The ink achieved due to pressure pressure is pulsed reduced refill modulator at a multiple of the time Friction and drop ejection Drop timing wear must be frequency. can be very considered accurate Stiction is The actuator possible energy can be very low Shuttered The actuator Actuators with Moving parts IJ08, IJ15, grill moves a shutter to small travel can are required IJ18, IJ19 block ink flow be used Requires ink through a grill to Actuators with pressure the nozzle. The small force can modulator shutter movement be used Friction and need only be equal High speed wear must be to the width of the (>50 kHz) considered grill holes. operation can be Stiction is achieved possible Pulsed A pulsed magnetic Extremely low Requires an IJ10 magnetic field attracts an energy operation external pulsed pull on ‘ink pusher’ at the is possible magnetic field ink drop ejection No heat Requires pusher frequency. An dissipation special materials actuator controls a problems for both the catch, which actuator and the prevents the ink ink pusher pusher from Complex moving when a construction drop is not to be ejected.

AUXILIARY MECHANISM (APPLIED TO ALL NOZZLES) Description Advantages Disadvantages Examples None The actuator Simplicity of Drop ejection Most ink jets, directly fires the construction energy must be including ink drop, and there Simplicity of supplied by piezoelectric and is no external field operation individual nozzle thermal bubble. or other Small physical actuator IJ01, IJ02, mechanism size IJ03, IJ04, IJ05, required. IJ07, IJ09, IJ11, IJ12, IJ14, IJ20, IJ22, IJ23, IJ24, IJ25, IJ26, IJ27, IJ28, IJ29, IJ30, IJ31, IJ32, IJ33, IJ34, IJ35, IJ36, IJ37, IJ38, IJ39, IJ40, IJ41, IJ42, IJ43, IJ44 Oscillating The ink pressure Oscillating ink Requires Silverbrook, ink oscillates, pressure can external ink EP 0771 658 A2 pressure providing much of provide a refill pressure and related (including the drop ejection pulse, allowing oscillator patent acoustic energy. The higher operating Ink pressure applications stimulation) actuator selects speed phase and IJ08, IJ13, which drops are to The actuators amplitude must IJ15, IJ17, IJ18, be fired by may operate be carefully IJ19, IJ21 selectively with much lower controlled blocking or energy Acoustic enabling nozzles. Acoustic reflections in the The ink pressure lenses can be ink chamber oscillation may be used to focus the must be achieved by sound on the designed for vibrating the print nozzles head, or preferably by an actuator in the ink supply. Media The print head is Low power Precision Silverbrook, proximity placed in close High accuracy assembly EP 0771 658 A2 proximity to the Simple print required and related print medium. head Paper fibers patent Selected drops construction may cause applications protrude from the problems print head further Cannot print than unselected on rough drops, and contact substrates the print medium. The drop soaks into the medium fast enough to cause drop separation. Transfer Drops are printed High accuracy Bulky Silverbrook, roller to a transfer roller Wide range of Expensive EP 0771 658 A2 instead of straight print substrates Complex and related to the print can be used construction patent medium. A Ink can be applications transfer roller can dried on the Tektronix hot also be used for transfer roller melt proximity drop piezoelectric ink separation. jet Any of the IJ series Electro- An electric field is Low power Field strength Silverbrook, static used to accelerate Simple print required for EP 0771 658 A2 selected drops head separation of and related towards the print construction small drops is patent medium. near or above air applications breakdown Tone-Jet Direct A magnetic field is Low power Requires Silverbrook, magnetic used to accelerate Simple print magnetic ink EP 0771 658 A2 field selected drops of head Requires and related magnetic ink construction strong magnetic patent towards the print field applications medium. Cross The print head is Does not Requires IJ06, IJ16 magnetic placed in a require magnetic external magnet field constant magnetic materials to be Current field. The Lorenz integrated in the densities may be force in a current print head high, resulting in carrying wire is manufacturing electromigration used to move the process problems actuator. Pulsed A pulsed magnetic Very low Complex print IJ10 magnetic field is used to power operation head field cyclically attract a is possible construction paddle, which Small print Magnetic pushes on the ink. head size materials A small actuator required in print moves a catch, head which selectively prevents the paddle from moving.

ACTUATOR AMPLIFICATION OR MODIFICATION METHOD Description Advantages Disadvantages Examples None No actuator Operational Many actuator Thermal mechanical simplicity mechanisms Bubble Ink jet amplification is have insufficient IJ01, IJ02, used. The actuator travel, or IJ06, IJ07, IJ16, directly drives the insufficient IJ25, IJ26 drop ejection force, to process. efficiently drive the drop ejection process Differential An actuator Provides High stresses Piezoelectric expansion material expands greater travel in are involved IJ03, IJ09, bend more on one side a reduced print Care must be IJ17, IJ18, IJ19, actuator than on the other. head area taken that the IJ20, IJ21, IJ22, The expansion materials do not IJ23, IJ24, IJ27, may be thermal, delaminate IJ29, IJ30, IJ31, piezoelectric, Residual bend IJ32, IJ33, IJ34, magnetostrictive, resulting from IJ35, IJ36, IJ37, or other high temperature IJ38, IJ39, IJ42, mechanism. The or high stress IJ43, IJ44 bend actuator during formation converts a high force low travel actuator mechanism to high travel, lower force mechanism. Transient A trilayer bend Very good High stresses IJ40, IJ41 bend actuator where the temperature are involved actuator two outside layers stability Care must be are identical. This High speed, as taken that the cancels bend due a new drop can materials do not to ambient be fired before delaminate temperature and heat dissipates residual stress. The Cancels actuator only residual stress of responds to formation transient heating of one side or the other. Reverse The actuator loads Better Fabrication IJ05, IJ11 spring a spring. When the coupling to the complexity actuator is turned ink High stress in off, the spring the spring releases. This can reverse the force/distance curve of the actuator to make it compatible with the force/time requirements of the drop ejection. Actuator A series of thin Increased Increased Some stack actuators are travel fabrication piezoelectric ink stacked. This can Reduced drive complexity jets be appropriate voltage Increased IJ04 where actuators possibility of require high short circuits due electric field to pinholes strength, such as electrostatic and piezoelectric actuators. Multiple Multiple smaller Increases the Actuator IJ12, IJ13, actuators actuators are used force available forces may not IJ18, IJ20, IJ22, simultaneously to from an actuator add linearly, IJ28, IJ42, IJ43 move the ink. Each Multiple reducing actuator need actuators can be efficiency provide only a positioned to portion of the control ink flow force required. accurately Linear A linear spring is Matches low Requires print IJ15 Spring used to transform a travel actuator head area for the motion with small with higher spring travel and high travel force into a longer requirements travel, lower force Non-contact motion. method of motion transformation Coiled A bend actuator is Increases Generally IJ17, IJ21, actuator coiled to provide travel restricted to IJ34, IJ35 greater travel in a Reduces chip planar reduced chip area. area implementations Planar due to extreme implementations fabrication are relatively difficulty in easy to fabricate. other orientations. Flexure A bend actuator Simple means Care must be IJ10, IJ19, bend has a small region of increasing taken not to IJ33 actuator near the fixture travel of a bend exceed the point, which flexes actuator elastic limit in much more readily the flexure area than the remainder Stress of the actuator. distribution is The actuator very uneven flexing is Difficult to effectively accurately model converted from an with finite even coiling to an element analysis angular bend, resulting in greater travel of the actuator tip. Catch The actuator Very low Complex IJ10 controls a small actuator energy construction catch. The catch Very small Requires either enables or actuator size external force disables movement Unsuitable for of an ink pusher pigmented inks that is controlled in a bulk manner. Gears Gears can be used Low force, Moving parts IJ13 to increase travel low travel are required at the expense of actuators can be Several duration. Circular used actuator cycles gears, rack and Can be are required pinion, ratchets, fabricated using More complex and other gearing standard surface drive electronics methods can be MEMS Complex used. processes construction Friction, friction, and wear are possible Buckle A buckle plate can Very fast Must stay S. Hirata et al, plate be used to change movement within elastic “An Ink-jet a slow actuator achievable limits of the Head Using into a fast motion. materials for Diaphragm It can also convert long device life Microactuator”, a high force, low High stresses Proc. IEEE travel actuator into involved MEMS, February a high travel, Generally 1996, pp 418-423. medium force high power IJ18, IJ27 motion. requirement Tapered A tapered Linearizes the Complex IJ14 magnetic magnetic pole can magnetic construction pole increase travel at force/distance the expense of curve force. Lever A lever and Matches low High stress IJ32, IJ36, fulcrum is used to travel actuator around the IJ37 transform a motion with higher fulcrum with small travel travel and high force into requirements a motion with Fulcrum area longer travel and has no linear lower force. The movement, and lever can also can be used for a reverse the fluid seal direction of travel. Rotary The actuator is High Complex IJ28 impeller connected to a mechanical construction rotary impeller. A advantage Unsuitable for small angular The ratio of pigmented inks deflection of the force to travel of actuator results in the actuator can a rotation of the be matched to impeller vanes, the nozzle which push the ink requirements by against stationary varying the vanes and out of number of the nozzle. impeller vanes Acoustic A refractive or No moving Large area 1993 lens diffractive (e.g. parts required Hadimioglu et zone plate) Only relevant al, EUP 550,192 acoustic lens is for acoustic ink 1993 Elrod et used to concentrate jets al, EUP 572,220 sound waves. Sharp A sharp point is Simple Difficult to Tone-jet conductive used to concentrate construction fabricate using point an electrostatic standard VLSI field. processes for a surface ejecting ink-jet Only relevant for electrostatic ink jets

ACTUATOR MOTION Description Advantages Disadvantages Examples Volume The volume of the Simple High energy is Hewlett- expansion actuator changes, construction in typically Packard Thermal pushing the ink in the case of required to Ink jet all directions. thermal ink jet achieve volume Canon expansion. This Bubblejet leads to thermal stress, cavitation, and kogation in thermal ink jet implementations Linear, The actuator Efficient High IJ01, IJ02, normal to moves in a coupling to ink fabrication IJ04, IJ07, IJ11, chip direction normal to drops ejected complexity may IJ14 surface the print head normal to the be required to surface. The surface achieve nozzle is typically perpendicular in the line of motion movement. Parallel to The actuator Suitable for Fabrication IJ12, IJ13, chip moves parallel to planar complexity IJ15, IJ33,, IJ34, surface the print head fabrication Friction IJ35, IJ36 surface. Drop Stiction ejection may still be normal to the surface. Membrane An actuator with a The effective Fabrication 1982 Howkins push high force but area of the complexity U.S. Pat. No. 4,459,601 small area is used actuator Actuator size to push a stiff becomes the Difficulty of membrane that is membrane area integration in a in contact with the VLSI process ink. Rotary The actuator Rotary levers Device IJ05, IJ08, causes the rotation may be used to complexity IJ13, IJ28 of some element, increase travel May have such a grill or Small chip friction at a pivot impeller area point requirements Bend The actuator bends A very small Requires the 1970 Kyser et when energized. change in actuator to be al U.S. Pat. No. This may be due to dimensions can made from at 3,946,398 differential be converted to a least two distinct 1973 Stemme thermal expansion, large motion. layers, or to have U.S. Pat. No. 3,747,120 piezoelectric a thermal IJ03, IJ09, expansion, difference across IJ10, IJ19, IJ23, magnetostriction, the actuator IJ24, IJ25, IJ29, or other form of IJ30, IJ31, IJ33, relative IJ34, IJ35 dimensional change. Swivel The actuator Allows Inefficient IJ06 swivels around a operation where coupling to the central pivot. This the net linear ink motion motion is suitable force on the where there are paddle is zero opposite forces Small chip applied to opposite area sides of the paddle, requirements e.g. Lorenz force. Straighten The actuator is Can be used Requires IJ26, IJ32 normally bent, and with shape careful balance straightens when memory alloys of stresses to energized. where the ensure that the austenic phase is quiescent bend is planar accurate Double The actuator bends One actuator Difficult to IJ36, IJ37, bend in one direction can be used to make the drops IJ38 when one element power two ejected by both is energized, and nozzles. bend directions bends the other Reduced chip identical. way when another size. A small element is Not sensitive efficiency loss energized. to ambient compared to temperature equivalent single bend actuators. Shear Energizing the Can increase Not readily 1985 Fishbeck actuator causes a the effective applicable to U.S. Pat. No. 4,584,590 shear motion in the travel of other actuator actuator material. piezoelectric mechanisms actuators Radial The actuator Relatively High force 1970 Zoltan constriction squeezes an ink easy to fabricate required U.S. Pat. No. 3,683,212 reservoir, forcing single nozzles Inefficient ink from a from glass Difficult to constricted nozzle. tubing as integrate with macroscopic VLSI processes structures Coil/ A coiled actuator Easy to Difficult to IJ17, IJ21, uncoil uncoils or coils fabricate as a fabricate for IJ34, IJ35 more tightly. The planar VLSI non-planar motion of the free process devices end of the actuator Small area Poor out-of- ejects the ink. required, plane stiffness therefore low cost Bow The actuator bows Can increase Maximum IJ16, IJ18, (or buckles) in the the speed of travel is IJ27 middle when travel constrained energized. Mechanically High force rigid required Push-Pull Two actuators The structure Not readily IJ18 control a shutter. is pinned at both suitable for ink One actuator pulls ends, so has a jets which the shutter, and the high out-of- directly push the other pushes it. plane rigidity ink Curl A set of actuators Good fluid Design IJ20, IJ42 inwards curl inwards to flow to the complexity reduce the volume region behind of ink that they the actuator enclose. increases efficiency Curl A set of actuators Relatively Relatively IJ43 outwards curl outwards, simple large chip area pressurizing ink in construction a chamber surrounding the actuators, and expelling ink from a nozzle in the chamber. Iris Multiple vanes High High IJ22 enclose a volume efficiency fabrication of ink. These Small chip complexity simultaneously area Not suitable rotate, reducing for pigmented the volume inks between the vanes. Acoustic The actuator The actuator Large area 1993 vibration vibrates at a high can be required for Hadimioglu et frequency. physically efficient al, EUP 550,192 distant from the operation at 1993 Elrod et ink useful al, EUP 572,220 frequencies Acoustic coupling and crosstalk Complex drive circuitry Poor control of drop volume and position None In various ink jet No moving Various other Silverbrook, designs the parts tradeoffs are EP 0771 658 A2 actuator does not required to and related move. eliminate patent moving parts applications Tone-jet

NOZZLE REFILL METHOD Description Advantages Disadvantages Examples Surface This is the normal Fabrication Low speed Thermal ink tension way that ink jets simplicity Surface jet are refilled. After Operational tension force Piezoelectric the actuator is simplicity relatively small ink jet energized, it compared to IJ01-IJ07, typically returns actuator force IJ10-IJ14, IJ16, rapidly to its Long refill IJ20, IJ22-IJ45 normal position. time usually This rapid return dominates the sucks in air total repetition through the nozzle rate opening. The ink surface tension at the nozzle then exerts a small force restoring the meniscus to a minimum area. This force refills the nozzle. Shuttered Ink to the nozzle High speed Requires IJ08, IJ13, oscillating chamber is Low actuator common ink IJ15, IJ17, IJ18, ink provided at a energy, as the pressure IJ19, IJ21 pressure pressure that actuator need oscillator oscillates at twice only open or May not be the drop ejection close the shutter, suitable for frequency. When a instead of pigmented inks drop is to be ejecting the ink ejected, the shutter drop is opened for 3 half cycles: drop ejection, actuator return, and refill. The shutter is then closed to prevent the nozzle chamber emptying during the next negative pressure cycle. Refill After the main High speed, as Requires two IJ09 actuator actuator has the nozzle is independent ejected a drop a actively refilled actuators per second (refill) nozzle actuator is energized. The refill actuator pushes ink into the nozzle chamber. The refill actuator returns slowly, to prevent its return from emptying the chamber again. Positive The ink is held a High refill Surface spill Silverbrook, ink slight positive rate, therefore a must be EP 0771 658 A2 pressure pressure. After the high drop prevented and related ink drop is ejected, repetition rate is Highly patent the nozzle possible hydrophobic applications chamber fills print head Alternative quickly as surface surfaces are for:, IJ01-IJ07, tension and ink required IJ10-IJ14, IJ16, pressure both IJ20, IJ22-IJ45 operate to refill the nozzle.

METHOD OF RESTRICTING BACK-FLOW THROUGH INLET Description Advantages Disadvantages Examples Long inlet The ink inlet Design Restricts refill Thermal ink channel channel to the simplicity rate jet nozzle chamber is Operational May result in Piezoelectric made long and simplicity a relatively large ink jet relatively narrow, Reduces chip area IJ42, IJ43 relying on viscous crosstalk Only partially drag to reduce effective inlet back-flow. Positive The ink is under a Drop selection Requires a Silverbrook, ink positive pressure, and separation method (such as EP 0771 658 A2 pressure so that in the forces can be a nozzle rim or and related quiescent state reduced effective patent some of the ink Fast refill time hydrophobizing, applications drop already or both) to Possible protrudes from the prevent flooding operation of the nozzle. of the ejection following: IJ01-IJ07, This reduces the surface of the IJ09-IJ12, pressure in the print head. IJ14, IJ16, IJ20, nozzle chamber IJ22,, IJ23-IJ34, which is required IJ36-IJ41, IJ44 to eject a certain volume of ink. The reduction in chamber pressure results in a reduction in ink pushed out through the inlet. Baffle One or more The refill rate Design HP Thermal baffles are placed is not as complexity Ink Jet in the inlet ink restricted as the May increase Tektronix flow. When the long inlet fabrication piezoelectric ink actuator is method. complexity (e.g. jet energized, the Reduces Tektronix hot rapid ink crosstalk melt movement creates Piezoelectric eddies which print heads). restrict the flow through the inlet. The slower refill process is unrestricted, and does not result in eddies. Flexible In this method Significantly Not applicable Canon flap recently disclosed reduces back- to most ink jet restricts by Canon, the flow for edge- configurations inlet expanding actuator shooter thermal Increased (bubble) pushes on ink jet devices fabrication a flexible flap that complexity restricts the inlet. Inelastic deformation of polymer flap results in creep over extended use Inlet filter A filter is located Additional Restricts refill IJ04, IJ12, between the ink advantage of ink rate IJ24, IJ27, IJ29, inlet and the filtration May result in IJ30 nozzle chamber. Ink filter may complex The filter has a be fabricated construction multitude of small with no holes or slots, additional restricting ink process steps flow. The filter also removes particles which may block the nozzle. Small The ink inlet Design Restricts refill IJ02, IJ37, inlet channel to the simplicity rate IJ44 compared nozzle chamber May result in to nozzle has a substantially a relatively large smaller cross chip area section than that of Only partially the nozzle, effective resulting in easier ink egress out of the nozzle than out of the inlet. Inlet A secondary Increases Requires IJ09 shutter actuator controls speed of the ink- separate refill the position of a jet print head actuator and shutter, closing off operation drive circuit the ink inlet when the main actuator is energized. The inlet The method avoids Back-flow Requires IJ01, IJ03, is located the problem of problem is careful design to IJ05, IJ06, IJ07, behind inlet back-flow by eliminated minimize the IJ10, IJ11, IJ14, the ink- arranging the ink- negative IJ16, IJ22, IJ23, pushing pushing surface of pressure behind IJ25, IJ28, IJ31, surface the actuator the paddle IJ32, IJ33, IJ34, between the inlet IJ35, IJ36, IJ39, and the nozzle. IJ40, IJ41 Part of The actuator and a Significant Small increase IJ07, IJ20, the wall of the ink reductions in in fabrication IJ26, IJ38 actuator chamber are back-flow can be complexity moves to arranged so that achieved shut off the motion of the Compact the inlet actuator closes off designs possible the inlet. Nozzle In some Ink back-flow None related Silverbrook, actuator configurations of problem is to ink back-flow EP 0771 658 A2 does not ink jet, there is no eliminated on actuation and related result in expansion or patent ink back- movement of an applications flow actuator which Valve-jet may cause ink Tone-jet back-flow through the inlet.

NOZZLE CLEARING METHOD Description Advantages Disadvantages Examples Normal All of the nozzles No added May not be Most ink jet nozzle are fired complexity on sufficient to systems firing periodically, the print head displace dried IJ01, IJ02, before the ink has ink IJ03, IJ04, IJ05, a chance to dry. IJ06, IJ07, IJ09, When not in use IJ10, IJ11, IJ12, the nozzles are IJ14, IJ16, IJ20, sealed (capped) IJ22, IJ23, IJ24, against air. IJ25, IJ26, IJ27, The nozzle firing IJ28, IJ29, IJ30, is usually IJ31, IJ32, IJ33, performed during a IJ34, IJ36, IJ37, special clearing IJ38, IJ39, IJ40,, cycle, after first IJ41, IJ42, IJ43, moving the print IJ44,, IJ45 head to a cleaning station. Extra In systems which Can be highly Requires Silverbrook, power to heat the ink, but do effective if the higher drive EP 0771 658 A2 ink heater not boil it under heater is voltage for and related normal situations, adjacent to the clearing patent nozzle clearing can nozzle May require applications be achieved by larger drive over-powering the transistors heater and boiling ink at the nozzle. Rapid The actuator is Does not Effectiveness May be used succession fired in rapid require extra depends with: IJ01, IJ02, of succession. In drive circuits on substantially IJ03, IJ04, IJ05, actuator some the print head upon the IJ06, IJ07, IJ09, pulses configurations, this Can be readily configuration of IJ10, IJ11, IJ14, may cause heat controlled and the ink jet nozzle IJ16, IJ20, IJ22, build-up at the initiated by IJ23, IJ24, IJ25, nozzle which boils digital logic IJ27, IJ28, IJ29, the ink, clearing IJ30, IJ31, IJ32, the nozzle. In other IJ33, IJ34, IJ36, situations, it may IJ37, IJ38, IJ39, cause sufficient IJ40, IJ41, IJ42, vibrations to IJ43, IJ44, IJ45 dislodge clogged nozzles. Extra Where an actuator A simple Not suitable May be used power to is not normally solution where where there is a with: IJ03, IJ09, ink driven to the limit applicable hard limit to IJ16, IJ20, IJ23, pushing of its motion, actuator IJ24, IJ25, IJ27, actuator nozzle clearing movement IJ29, IJ30, IJ31, may be assisted by IJ32, IJ39, IJ40, providing an IJ41, IJ42, IJ43, enhanced drive IJ44, IJ45 signal to the actuator. Acoustic An ultrasonic A high nozzle High IJ08, IJ13, resonance wave is applied to clearing implementation IJ15, IJ17, IJ18, the ink chamber. capability can be cost if system IJ19, IJ21 This wave is of an achieved does not already appropriate May be include an amplitude and implemented at acoustic actuator frequency to cause very low cost in sufficient force at systems which the nozzle to clear already include blockages. This is acoustic easiest to achieve actuators if the ultrasonic wave is at a resonant frequency of the ink cavity. Nozzle A microfabricated Can clear Accurate Silverbrook, clearing plate is pushed severely clogged mechanical EP 0771 658 A2 plate against the nozzles alignment is and related nozzles. The plate required patent has a post for Moving parts applications every nozzle. A are required post moves There is risk through each of damage to the nozzle, displacing nozzles dried ink. Accurate fabrication is required Ink The pressure of the May be Requires May be used pressure ink is temporarily effective where pressure pump with all IJ series pulse increased so that other methods or other pressure ink jets ink streams from cannot be used actuator all of the nozzles. Expensive This may be used Wasteful of in conjunction ink with actuator energizing. Print A flexible ‘blade’ Effective for Difficult to Many ink jet head is wiped across the planar print head use if print head systems wiper print head surface. surfaces surface is non- The blade is Low cost planar or very usually fabricated fragile from a flexible Requires polymer, e.g. mechanical parts rubber or synthetic Blade can elastomer. wear out in high volume print systems Separate A separate heater Can be Fabrication Can be used ink is provided at the effective where complexity with many IJ boiling nozzle although other nozzle series ink jets heater the normal drop e- clearing methods ection mechanism cannot be used does not require it. Can be The heaters do not implemented at require individual no additional drive circuits, as cost in some ink many nozzles can jet be cleared configurations simultaneously, and no imaging is required.

NOZZLE PLATE CONSTRUCTION Description Advantages Disadvantages Examples Electro- A nozzle plate is Fabrication High Hewlett formed separately simplicity temperatures and Packard Thermal nickel fabricated from pressures are Ink jet electroformed required to bond nickel, and bonded nozzle plate to the print head Minimum chip. thickness constraints Differential thermal expansion Laser Individual nozzle No masks Each hole Canon ablated or holes are ablated required must be Bubblejet drilled by an intense UV Can be quite individually 1988 Sercel et polymer laser in a nozzle fast formed al., SPIE, Vol. plate, which is Some control Special 998 Excimer typically a over nozzle equipment Beam polymer such as profile is required Applications, pp. polyimide or possible Slow where 76-83 polysulphone Equipment there are many 1993 required is thousands of Watanabe et al., relatively low nozzles per print U.S. Pat. No. 5,208,604 cost head May produce thin burrs at exit holes Silicon A separate nozzle High accuracy Two part K. Bean, micro- plate is is attainable construction IEEE machined micromachined High cost Transactions on from single crystal Requires Electron silicon, and precision Devices, Vol. bonded to the print alignment ED-25, No. 10, head wafer. Nozzles may 1978, pp 1185-1195 be clogged by Xerox 1990 adhesive Hawkins et al., U.S. Pat. No. 4,899,181 Glass Fine glass No expensive Very small 1970 Zoltan capillaries capillaries are equipment nozzle sizes are U.S. Pat. No. 3,683,212 drawn from glass required difficult to form tubing. This Simple to Not suited for method has been make single mass production used for making nozzles individual nozzles, but is difficult to use for bulk manufacturing of print heads with thousands of nozzles. Monolithic, The nozzle plate is High accuracy Requires Silverbrook, surface deposited as a (<1 μm) sacrificial layer EP 0771 658 A2 micro- layer using Monolithic under the nozzle and related machined standard VLSI Low cost plate to form the patent using deposition Existing nozzle chamber applications VLSI techniques. processes can be Surface may IJ01, IJ02, litho- Nozzles are etched used be fragile to the IJ04, IJ11, IJ12, graphic in the nozzle plate touch IJ17, IJ18, IJ20, processes using VLSI IJ22, IJ24, IJ27, lithography and IJ28, IJ29, IJ30, etching. IJ31, IJ32, IJ33, IJ34, IJ36, IJ37, IJ38, IJ39, IJ40, IJ41, IJ42, IJ43, IJ44 Monolithic, The nozzle plate is High accuracy Requires long IJ03, IJ05, etched a buried etch stop (<1 μm) etch times IJ06, IJ07, IJ08, through in the wafer. Monolithic Requires a IJ09, IJ10, IJ13, substrate Nozzle chambers Low cost support wafer IJ14, IJ15, IJ16, are etched in the No differential IJ19, IJ21, IJ23, front of the wafer, expansion IJ25, IJ26 and the wafer is thinned from the back side. Nozzles are then etched in the etch stop layer. No nozzle Various methods No nozzles to Difficult to Ricoh 1995 plate have been tried to become clogged control drop Sekiya et al U.S. Pat. No. eliminate the position 5,412,413 nozzles entirely, to accurately 1993 prevent nozzle Crosstalk Hadimioglu et al clogging. These problems EUP 550,192 include thermal 1993 Elrod et bubble al EUP 572,220 mechanisms and acoustic lens mechanisms Trough Each drop ejector Reduced Drop firing IJ35 has a trough manufacturing direction is through which a complexity sensitive to paddle moves. Monolithic wicking. There is no nozzle plate. Nozzle slit The elimination of No nozzles to Difficult to 1989 Saito et instead of nozzle holes and become clogged control drop al U.S. Pat. No. individual replacement by a position 4,799,068 nozzles slit encompassing accurately many actuator Crosstalk positions reduces problems nozzle clogging, but increases crosstalk due to ink surface waves

DROP EJECTION DIRECTION Description Advantages Disadvantages Examples Edge Ink flow is along Simple Nozzles Canon (‘edge the surface of the construction limited to edge Bubblejet 1979 shooter’) chip, and ink drops No silicon High Endo et al GB are ejected from etching required resolution is patent 2,007,162 the chip edge. Good heat difficult Xerox heater- sinking via Fast color in-pit 1990 substrate printing requires Hawkins et al Mechanically one print head U.S. Pat. No. 4,899,181 strong per color Tone-jet Ease of chip handing Surface Ink flow is along No bulk Maximum ink Hewlett- (‘roof the surface of the silicon etching flow is severely Packard TIJ shooter’) chip, and ink drops required restricted 1982 Vaught et are ejected from Silicon can al U.S. Pat. No. the chip surface, make an 4,490,728 normal to the effective heat IJ02, IJ11, plane of the chip. sink IJ12, IJ20, IJ22 Mechanical strength Through Ink flow is through High ink flow Requires bulk Silverbrook, chip, the chip, and ink Suitable for silicon etching EP 0771 658 A2 forward drops are ejected pagewidth print and related (‘up from the front heads patent shooter’) surface of the chip. High nozzle applications packing density IJ04, IJ17, therefore low IJ18, IJ24, IJ27-IJ45 manufacturing cost Through Ink flow is through High ink flow Requires IJ01, IJ03, chip, the chip, and ink Suitable for wafer thinning IJ05, IJ06, IJ07, reverse drops are ejected pagewidth print Requires IJ08, IJ09, IJ10, (‘down from the rear heads special handling IJ13, IJ14, IJ15, shooter’) surface of the chip. High nozzle during IJ16, IJ19, IJ21, packing density manufacture IJ23, IJ25, IJ26 therefore low manufacturing cost Through Ink flow is through Suitable for Pagewidth Epson Stylus actuator the actuator, which piezoelectric print heads Tektronix hot is not fabricated as print heads require several melt part of the same thousand piezoelectric ink substrate as the connections to jets drive transistors. drive circuits Cannot be manufactured in standard CMOS fabs Complex assembly required

INK TYPE Description Advantages Disadvantages Examples Aqueous, Water based ink Environmentally Slow drying Most existing dye which typically friendly Corrosive ink jets contains: water, No odor Bleeds on All IJ series dye, surfactant, paper ink jets humectant, and May Silverbrook, biocide. strikethrough EP 0771 658 A2 Modern ink dyes Cockles paper and related have high water- patent fastness, light applications fastness Aqueous, Water based ink Environmentally Slow drying IJ02, IJ04, pigment which typically friendly Corrosive IJ21, IJ26, IJ27, contains: water, No odor Pigment may IJ30 pigment, Reduced bleed clog nozzles Silverbrook, surfactant, Reduced Pigment may EP 0771 658 A2 humectant, and wicking clog actuator and related biocide. Reduced mechanisms patent Pigments have an strikethrough Cockles paper applications advantage in Piezoelectric reduced bleed, ink-jets wicking and Thermal ink strikethrough. jets (with significant restrictions) Methyl MEK is a highly Very fast Odorous All IJ series Ethyl volatile solvent drying Flammable ink jets Ketone used for industrial Prints on (MEK) printing on various difficult surfaces substrates such such as aluminum as metals and cans. plastics Alcohol Alcohol based inks Fast drying Slight odor All IJ series (ethanol, can be used where Operates at Flammable ink jets 2-butanol, the printer must sub-freezing and operate at temperatures others) temperatures Reduced below the freezing paper cockle point of water. An Low cost example of this is in-camera consumer photographic printing. Phase The ink is solid at No drying High viscosity Tektronix hot change room temperature, time-ink Printed ink melt (hot melt) and is melted in instantly freezes typically has a piezoelectric ink the print head on the print ‘waxy’ feel jets before jetting. Hot medium Printed pages 1989 Nowak melt inks are Almost any may ‘block’ U.S. Pat. No. 4,820,346 usually wax based, print medium Ink All IJ series with a melting can be used temperature may ink jets point around 80° C. No paper be above the After jetting cockle occurs curie point of the ink freezes No wicking permanent almost instantly occurs magnets upon contacting No bleed Ink heaters the print medium occurs consume power or a transfer roller. No Long warm- strikethrough up time occurs Oil Oil based inks are High High All IJ series extensively used in solubility viscosity: this is ink jets offset printing. medium for a significant They have some dyes limitation for use advantages in Does not in ink jets, which improved cockle paper usually require a characteristics on Does not wick low viscosity. paper (especially through paper Some short no wicking or chain and multi- cockle). Oil branched oils soluble dies and have a pigments are sufficiently low required. viscosity. Slow drying Micro- A microemulsion Stops ink Viscosity All IJ series emulsion is a stable, self bleed higher than ink jets forming emulsion High dye water of oil, water, and solubility Cost is surfactant. The Water, oil, slightly higher characteristic drop and amphiphilic than water based size is less than soluble dies can ink 100 nm, and is be used High determined by the Can stabilize surfactant preferred curvature pigment concentration of the surfactant. suspensions required (around 5%)

Claims

1. An ejection nozzle arrangement comprising:

a substrate;

a chamber on the substrate;

a roof on the chamber having an ejection port; and

an arm extending through an opening in the chamber into the chamber for causing ejection of fluid within the chamber from the ejection port, the arm being suspended within the opening so that the arm is spaced from both the substrate and the chamber within the opening.

2. A nozzle arrangement according to claim 1, further comprising a layer of passivation material on the substrate, the chamber being arranged on the passivation layer.

3. A nozzle arrangement according to claim 2, wherein the passivation material is silicone.

4. A nozzle arrangement according to claim 1, wherein the fluid is ink.

5. A nozzle arrangement according to claim 4, wherein the nozzle arrangement forms part of an inkjet printhead integrated circuit.

6. A nozzle arrangement according to claim 1, wherein the arm includes a heating circuit.