Led Based Illumination Module Color Matched To An Arbitrary Light Source
LED based illumination modules are realized that are visually color matched to light sources not based on LEDs based on visually matched color spaces. A visually matched color space is employed to both instrumentally and visually match an LED based light source with a light source not based on LEDs. In one aspect, an LED based illumination module is realized to achieve a target color point in a visually matched color space within a predetermined tolerance. In another aspect, an LED based illumination module is realized to visually match a light source not based on LEDs. A target color point in the CIE 1931 XYZ color space is derived based at least in part on the spectrum of the visually matched LED based illumination module. LED based illumination modules visually matched to light sources not based on LEDs are realized based on the derived target color point.
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The described embodiments relate to illumination modules that include Light Emitting Diodes (LEDs).
BACKGROUND INFORMATIONThe CIE 1931 XYZ color space is widely used to characterize the color of light emitted from various light sources. Light sources may be compared based upon their respective color points derived from the CIE 1931 color space. Improvements to illumination devices that use LEDs as the light source are desired to achieve a visual color match to light sources that do not use LEDs.
SUMMARYColor targeting based on visually matched color spaces is presented to reliably manufacture LED based illumination modules that are visually color matched to light sources not based on LEDs. A visually matched color space is employed to both instrumentally and visually match an LED based light source with a light source not based on LEDs. In one aspect, an LED based illumination module is constructed to achieve a target color point in a visually matched color space within a predetermined tolerance. In another aspect, an LED based illumination module is constructed to visually match a light source not based on LEDs and a target color point in the CIE 1931 XYZ color space is derived based on the spectrum of the visually matched LED based illumination module. Further details and embodiments and techniques are described in the detailed description below. This summary does not claim to define the invention. The invention is defined by the claims.
The accompanying drawings, where like numerals indicate like components, illustrate embodiments of the invention.
Reference will now be made in detail to background examples and some embodiments of the invention, examples of which are illustrated in the accompanying drawings.
Illumination module 100 is mounted to light fixture 130. As depicted in
For purposes of this patent document, a wavelength converting material is any single chemical compound or mixture of different chemical compounds that performs a color conversion function, e.g. partially absorbs light of one peak wavelength and emits light at another peak wavelength.
Cavity 109 may be filled with a non-solid material, such as air or an inert gas, so that the LEDs 102 emit light into the non-solid material. By way of example, the cavity may be hermetically sealed and Argon gas used to fill the cavity. Alternatively, Nitrogen may be used. In other embodiments, cavity 109 may be filled with a solid encapsulant material. By way of example, silicone may be used to fill the cavity.
The LEDs 102 can emit different or the same colors, either by direct emission or by phosphor conversion, e.g., where phosphor layers are applied to the LEDs as part of the LED package. Thus, the illumination module 100 may use any combination of colored LEDs 102, such as red, green, blue, amber, or cyan, or the LEDs 102 may all produce the same color light or may all produce white light. For example, the LEDs 102 may all emit either blue or UV light. When used in combination with phosphors (or other wavelength conversion means), which may be, e.g., in or on the output window 108, applied to the sidewalls of cavity body 105, or applied to other components placed inside the cavity (not shown), such that the output light of the illumination module 100 has the color as desired.
The mounting board 104 provides electrical connections to the attached LEDs 102 to a power supply (not shown). In one embodiment, the LEDs 102 are packaged LEDs, such as the Luxeon Rebel manufactured by Philips Lumileds Lighting. Other types of packaged LEDs may also be used, such as those manufactured by OSRAM (Ostar package), Luminus Devices (USA), Cree (USA), Nichia (Japan), or Tridonic (Austria). As defined herein, a packaged LED is an assembly of one or more LED die that contains electrical connections, such as wire bond connections or stud bumps, and possibly includes an optical element and thermal, mechanical, and electrical interfaces. The LEDs 102 may include a lens over the LED chips. Alternatively, LEDs without a lens may be used. LEDs without lenses may include protective layers, which may include phosphors. The phosphors can be applied as a dispersion in a binder, or applied as a separate layer. Each LED 102 includes at least one LED chip or die, which may be mounted on a submount. The LED chip typically has a size about 1 mm by 1 mm by 0.5 mm, but these dimensions may vary. In some embodiments, the LEDs 102 may include multiple chips. The multiple chips can emit light similar or different colors, e.g., red, green, and blue. In addition, different phosphor layers may be applied on different chips on the same submount. The submount may be ceramic or other appropriate material. The submount typically includes electrical contact pads on a bottom surface that are coupled to contacts on the mounting board 104. Alternatively, electrical bond wires may be used to electrically connect the chips to a mounting board. Along with electrical contact pads, the LEDs 102 may include thermal contact areas on the bottom surface of the submount through which heat generated by the LED chips can be extracted. The thermal contact areas are coupled to heat spreading layers on the mounting board 104. Heat spreading layers may be disposed on any of the top, bottom, or intermediate layers of mounting board 104. Heat spreading layers may be connected by vias that connect any of the top, bottom, and intermediate heat spreading layers.
In some embodiments, the mounting board 104 conducts heat generated by the LEDs 102 to the sides of the board 104 and the bottom of the board 104. In one example, the bottom of mounting board 104 may be thermally coupled to a heat sink 130 (shown in
Mounting board 104 includes electrical pads to which the electrical pads on the LEDs 102 are connected. The electrical pads are electrically connected by a metal, e.g., copper, trace to a contact, to which a wire, bridge or other external electrical source is connected. In some embodiments, the electrical pads may be vias through the board 104 and the electrical connection is made on the opposite side, i.e., the bottom, of the board. Mounting board 104, as illustrated, is rectangular in dimension. LEDs 102 mounted to mounting board 104 may be arranged in different configurations on rectangular mounting board 104. In one example LEDs 102 are aligned in rows extending in the length dimension and in columns extending in the width dimension of mounting board 104. In another example, LEDs 102 are arranged in a hexagonally closely packed structure. In such an arrangement each LED is equidistant from each of its immediate neighbors. Such an arrangement is desirable to increase the uniformity and efficiency of light emitted from the light source sub-assembly 115.
Illumination module 100 includes an electrical interface module (EIM) 120. As illustrated, EIM 120 may be removably attached to illumination module 100 by retaining clips 137. In other embodiments, EIM 120 may be removably attached to illumination module 100 by an electrical connector coupling EIM 120 to mounting board 104. EIM 120 may also be coupled to illumination module 100 by other fastening means, e.g. screw fasteners, rivets, or snap-fit connectors. As depicted EIM 120 is positioned within a cavity of illumination module 100. In this manner, EIM 120 is contained within illumination module 100 and is accessible from the bottom side of illumination module 100. In other embodiments, EIM 120 may be at least partially positioned within light fixture 130. The EIM 120 communicates electrical signals from light fixture 130 to illumination module 100. Electrical conductors 132 are coupled to light fixture 130 at electrical connector 133. By way of example, electrical connector 133 may be a registered jack (RJ) connector commonly used in network communications applications. In other examples, electrical conductors 132 may be coupled to light fixture 130 by screws or clamps. In other examples, electrical conductors 132 may be coupled to light fixture 130 by a removable slip-fit electrical connector. Connector 133 is coupled to conductors 134. Conductors 134 are removably coupled to electrical connector 121 that is mounted to EIM 120. Similarly, electrical connector 121 may be a RJ connector or any suitable removable electrical connector. Connector 121 is fixedly coupled to EIM 120. Electrical signals 135 are communicated over conductors 132 through electrical connector 133, over conductors 134, through electrical connector 121 to EIM 120. Electrical signals 135 may include power signals and data signals. EIM 120 routes electrical signals 135 from electrical connector 121 to appropriate electrical contact pads on EIM 120. For example, conductor 139 within EIM 120 may couple connector 121 to electrical contact pad 131 on the top surface of EIM 120. As illustrated, spring pin 122 removably couples electrical contact pad 131 to mounting board 104. Spring pins couple contact pads disposed on the top surface of EIM 120 to contact pads of mounting board 104. In this manner, electrical signals are communicated from EIM 120 to mounting board 104. Mounting board 104 includes conductors to appropriately couple LEDs 102 to the contact pads of mounting board 104. In this manner, electrical signals are communicated from mounting board 104 to appropriate LEDs 102 to generate light. EIM 120 may be constructed from a printed circuit board (PCB), a metal core PCB, a ceramic substrate, or a semiconductor substrate. Other types of boards may be used, such as those made of alumina (aluminum oxide in ceramic form), or aluminum nitride (also in ceramic form). EIM 120 may be a constructed as a plastic part including a plurality of insert molded metal conductors.
Mounting base 101 is replaceably coupled to light fixture 130. In the illustrated example, light fixture 130 acts as a heat sink. Mounting base 101 and light fixture 130 are coupled together at a thermal interface 136. At the thermal interface, a portion of mounting base 101 and a portion of light fixture 130 are brought into contact as illumination module 100 is coupled to light fixture 130. In this manner, heat generated by LEDs 102 may be conducted via mounting board 104, through mounting base 101, through interface 136, and into light fixture 130.
To remove and replace illumination module 100, illumination module 100 is decoupled from light fixture 130 and electrical connector 121 is disconnected. In one example, conductors 134 includes sufficient length to allow sufficient separation between illumination module 100 and light fixture 130 to allow an operator to reach between fixture 130 and illumination module 100 to disconnect connector 121. In another example, connector 121 may be arranged such that a displacement between illumination module 100 from light fixture 130 operates to disconnect connector 121. In another example, conductors 134 are wound around a spring-loaded reel. In this manner, conductors 134 may be extended by unwinding from the reel to allow for connection or disconnection of connector 121, and then conductors 134 may be retracted by winding conductors 134 onto the reel by action of the spring-loaded reel.
With the two or more of wavelength converting components of the light mixing cavity 109 each with different wavelength converting properties, the LED based illumination module 100 may produce a predetermined or target color point with a high degree of accuracy.
X1931=∫CMFXS(λ)dλ
Y1931=∫CMFYS(λ)dλ
Z1931=∫CMFZS(λ)dλ (1)
The xy chromaticity diagram of
There are other color spaces that are simple projective transformations of the CIE 1931 XYZ color space. For example, both the CIE 1960 uniform color scale (CIE 1960 UCS) and the CIE 1976 uniform color scale (CIE 1976 UCS) are simple transformations of the CIE 1931 XYZ color space. The CIE 1960 UCS expresses two dimensional chromaticity (uv) as a function of the three tristimulus values as described in equation (3).
The CIE 1976 UCS expresses two dimensional chromaticity (u′v′) as a function of the three tristimulus values as described in equation (4).
The CIE 1960 UCS color space has generally been superseded by the CIE 1976 UCS color space as an expression of uniform chromaticity. However, the CIE 1960 UCS color space is still useful as an expression of chromaticity because the isothermal lines of correlated color temperature (CCT) are aligned perpendicular to the Planckian locus in CIE 1960 UCS. In the context of the CIE 1960 UCS, the degree of departure is the distance between the color point of the light produced by the light source and the Planckian locus along a line of constant CCT. The degree of departure is referred to in units of Δuv in CIE 1960 UCS. Thus, the color point of a white light source may be described as a CCT value and a Δuv value, i.e., the degree of departure from the black-body curve as measured in the CIE 1960 color space. It follows that the specification for color of light output by LED based illumination module 100 can be expressed as a CCT value within a predetermined tolerance and a Δuv value within a predetermined tolerance.
Producing light sources that generate light near a target color point is desirable. For example, when used for purposes of general illumination, it is desirable that the LED based illumination module 100 produce white light with a particular correlated color temperature (CCT). CCT relates to the temperature of a black-body radiator and temperatures between 2700K and 6000K are typically useful for general illumination purposes. Higher color temperatures are considered “cool” as they are bluish in color, while lower temperatures are considered “warm” as they contain more yellow-red colors. By way of example, CCTs of 2700K, 3000K, 3500K, 4000K, 4200K, 5000K, 6500K are often desirable. In another example, light emitted from an LED based illumination module targeting any of CIE illuminant series A, B, C, D, E, and F are desirable.
As illustrated in
An LED is typically binned after a production run based on a variety of characteristics derived from their spectral power distribution. The cost of the LEDs is determined by the size (distribution) of the bin. For example, a particular LED may be binned based on the value of its peak wavelength. The peak wavelength of an LED is the wavelength where the magnitude of its spectral power distribution is maximal. Peak wavelength is a common metric to characterize the color aspect of the spectral power distribution of blue LEDs. Many other metrics are commonly used to bin LEDs based on their spectral power distribution (e.g. dominant wavelength, xy color point, uv color point, etc.). It is common for blue LEDs to be separated for sale into bins with a range of peak wavelength of five nanometers.
As discussed above, LED based illumination module 100 includes a board 104 with a plurality of LEDs 102. The plurality of LEDs 102 populating board 104 are operable to produce light with a particular spectral power distribution. The color aspect of this spectral power distribution may be characterized by its centroid wavelength. A centroid wavelength is the wavelength at which half of the area of the spectral power distribution is based on contributions from wavelengths less than the centroid wavelength and the other half of the area of the spectral power distribution is based on contributions from wavelengths greater than the centroid wavelength. For a plurality of boards, a standard deviation of the centroid wavelength can be calculated. In some production examples a standard deviation of the centroid wavelength of a plurality of boards may be less than 0.1 nm, e.g., where the boards are populated with LEDs carefully selected for their closely matching spectral power distribution or LEDs from a small bin. Of course, costs increase significantly when producing boards with a standard deviation of the centroid wavelength of approximately 0.1 nm or less. In other examples, a standard deviation of the centroid wavelength of a plurality of boards may be less than 0.5 nm. In yet other examples, a standard deviation of the centroid wavelength of a plurality of boards may be less than 2.0 nm.
The LED based illumination module 100 can accommodate LEDs with a wide spectral power distribution while still achieving a target color point within a predetermined tolerance. Moreover, multiple LED modules 100 may be produced, each with one or more LEDs having different spectral power distributions, e.g., a large standard deviation of the centroid wavelength, while still achieving closely matched color points from one LED based illumination module 100 to the next, and where the matching color points of the LED modules 100 are within a predetermined tolerance from a target color point. Thus, less expensive LEDs may be used. By using the two or more wavelength converting components of the light mixing cavity 109, the color point of the light emitted by the LED based illumination module 100 may be accurately controlled. For example, during assembly of the LED based illumination module 100, the two or more wavelength converting components may be selected based on their wavelength converting characteristics and the spectral power distribution of the light produced by the LEDs 102 so that the resulting light that is transmitted through the window 108 has a color point that is within a predetermined tolerance of a predetermined target color point. The wavelength converting components of the LED based illumination module 100 may be selected to produce a desired degree of departure of Δu′v′ between 0.009 and 0.0035 and smaller if desired, such as 0.002.
The wavelength converting characteristics of the plurality of the wavelength converting components are measured (506 and 508). The wavelength converting components are placed on a test fixture, which includes a light source, e.g., a board 104 with LEDs 102, that produces light with a known spectral power distribution and color point. The wavelength converting components are separately placed on the test fixture and the color point shift is measured using, e.g., a spectrometer and an integrating sphere. If desired, an intensity measurement using a dichroic filter can be done as well as or instead of the integrating sphere measurement, or a colorimeter such as produced by Konica-Minolta (CL-200 colorimeter) can be used. The measured wavelength converting characteristics for each component is stored. A self referencing measurement may be used for the wavelength converting characteristics of the components. For example, color point produced by the full spectral power distribution of the LEDs 102 and the measured component may be compared to the color point produced by the spectral power distribution that excludes the wavelength converted light to produce a self referencing Δuv value.
The color point shift of the wavelength converting components is illustrated in the CIE 1931 chromaticity diagram of
The color point produced by, e.g., the wavelength converting material on or within the window 108, is illustrated as point 230 which corresponds with a dominant wavelength of, e.g., 570 nm. The color point shift produced by a window 108 with the test light source is along the dotted line 232 depending on the thickness and/or concentration of the wavelength converting material on the window 108. By way of example, the measured color point produced by one of the windows 108 with the test light source is illustrated by point 234 and the shift Δxy from the color point produced by the test light source without the window 108 (e.g., point 210) is illustrated by line 236. If desired, different formulations of the wavelength converting materials on a wavelength converting component may also be used, which would alter the color point produced by the wavelength converting materials (as illustrated by arrow 240), and thus, the slope of the color point shift.
Typically, there is a difference in spectral power distribution from one LED to the next. For example, LEDs that are supposed to produce blue light at 452 nm will typically produce light that may range between 450 nm and 455 nm or more. In another example, LEDs that are supposed to produce blue light may produce light that ranges between 440 nm and 475 nm. In this example, the spectral power distribution from one LED to another may be as much as eight percent. Accordingly, during the assembly process, the spectral power distribution and/or color point of the LEDs 102 may be measured for each LED based illumination module 100 (510 in
The diagram illustrates two color lines centered on the 3000K CCT for reference purposes. One color line 402 corresponds to the color point shift produced by a first wavelength converting material. In the present example, color line 402 is a yellow phosphor coating on the window 108. Color line 404 corresponds to the color point shift produced by a second wavelength converting material. In the present example, color line 404 is a red phosphor coating on the sidewall insert 107. Color line 402 indicates the direction of a shift in color point of light produced by the yellow phosphor. Color line 404 indicates the direction of shift in color point produced by the red phosphor. The first wavelength converting material and the second wavelength converting material are selected such that their respective directions of shift in color point are not parallel. Because the direction of shift of the yellow phosphor and the red phosphor are not parallel, the direction of the color point shift of light emitted by LED based illumination module 100 can be arbitrarily designated. This may be achieved by selecting the proper thickness and/or concentration of each phosphor as discussed above. By way of example, the small spots, 412, 414, 416, and 418 graphically illustrate the color points produced by one LED based illumination module 100 using different wavelength converting components. For example, spot 412 illustrates the color point for the LED based illumination module 100 with one set of wavelength converting components. By selecting a different window 108, the color point shifted for the LED based illumination module 100 to spot 414. As can be seen, the difference in the color points from spot 412 to 414 is parallel with the color line 402. A different sidewall insert 107 is then selected to produce a color point illustrated by spot 416. The difference in the color points from spot 414 to 416 is parallel with the color line 404. While this is within the 3000K target, an attempt to improve the color point by replacing the window 108 resulted in a color point illustrated by spot 418, where the shift between spot 416 and 418 is parallel with the color line 402. By again replacing the window 108 a color point of the LED based illumination module 100 shifted along line 402 to produce a color point illustrated by large spot 420, which is well within the predetermined tolerance from the target color point of 3,000K on the black-body curve.
In addition to accurate color targeting within a given color space as discussed above, the color space in which color targeting is performed is critical to minimize visually perceptible color differences between light sources of different technologies. For example,
The halogen matched color space is based on three color matching functions (CMF′X, CMF′y, and CMF′z). The three tristimulus values (X′, Y′, and Z′) express the halogen matched color space as a three dimensional color space. Each color matching function relates a given spectrum, S(λ), to each of the three tristimulus values, X′, Y′, and Z′, as described in equation (3).
X′=∫CMF′XS(λ)dλ
Y′=∫CMF′YS(λ)dλ
Z′=∫CMF′ZS(λ)dλ (3)
Chromaticity of the halogen matched color space may be expressed as a projection of the three dimensional halogen matched color space onto a two dimensional space (x′y′) such that brightness is ignored. Each color coordinate (x′,y′) may be expressed as a function of the three tristimulus values as described in equation (4).
As discussed above with respect to
Although certain specific embodiments are described above for instructional purposes, the teachings of this patent document have general applicability and are not limited to the specific embodiments described above. In one example, a halogen matched color space is introduced and tuning of an LED based illumination module to visually match a halogen light source is described. However, in other embodiments, any color matched color space may be utilized that is suitable to visually match an LED based illumination module with an arbitrary light source that does not include LEDs. In another example, a LED based illumination module with selectable components to perform color tuning is discussed. In another example,
Accordingly, various modifications, adaptations, and combinations of various features of the described embodiments can be practiced without departing from the scope of the invention as set forth in the claims.
Claims
1. An illumination module comprising:
- at least one light emitting diode operable to produce an amount of light with a spectral power distribution; and
- a first selectable component that includes a first type of wavelength converting material having a first wavelength converting characteristic that is a function of the spectral power distribution, the first selectable component is selected prior to final assembly of the illumination module based on the first wavelength converting characteristic, the first selectable component converting a portion of the amount of light from the at least one light emitting diode to produce light emitted from the illumination module, the first wavelength converting characteristic converts the portion of the amount of light from the at least one light emitting diode to produce light emitted from the illumination module at a first color point with less than a just noticeable difference from light emitted from a light source that does not include a light emitting diode at a second color point, wherein the first color point and the second color point are compared in a visually matched color space prior to final assembly, wherein in the visually matched color space light emitted from the illumination module at the first color point visually matches light emitted from a light source that does not include a light emitting diode.
2. The illumination module of claim 1, further comprising:
- a second selectable component that includes a second type of wavelength converting material having a second wavelength converting characteristic that is different from the first wavelength converting characteristic, wherein the first wavelength converting characteristic of the first selectable component and the second wavelength converting characteristic of the second selectable component convert the portion of the amount of light from the at least one light emitting diode to produce the first color point.
3. The illumination module of claim 1, wherein the light source that does not include a light emitting diode is a light source that emulates an illuminant taken from a group consisting of: an A series illuminant, a B series illuminant, a C series illuminant, a D series illuminant, an E series illuminant, a F series illuminant, and a blackbody radiator.
4. The illumination module of claim 1, wherein the light source is taken from a group consisting of: a halogen lamp, a compact metal halide lamp, a high intensity discharge lamp, and a fluorescent lamp.
5. The illumination module of claim 2, wherein the first and second selectable components are configured to convert a portion of the amount of light emitted by the at least one light emitting diode to an amount of converted light, and wherein the light emitted from the illumination module includes the amount of converted light.
6. The illumination module of claim 1, wherein a light emitted from the illumination module at a target color point in CIE 1931 color space does not visually match a light emitted from the light source that does not include a light emitting diode at the same target color point in CIE 1931 color space.
7. The illumination module of claim 2, further comprising:
- a reflective bottom surface that surrounds the at least one light emitting diode;
- at least one reflective sidewall that surrounds the bottom surface and the at least one light emitting diode; and
- a window coupled to the at least one reflective sidewall.
8. The illumination module of claim 7, wherein each of the first selectable component and second selectable component comprise at least one of the reflective bottom surface, the at least one reflective sidewall, and the window.
9. The illumination module of claim 8, wherein the at least one reflective sidewall is a sidewall insert that is positioned to form the at least one reflective sidewall.
10. The illumination module of claim 7, wherein the first selectable component is the window and the second selectable component is the at least one reflective sidewall.
11. The illumination module of claim 2, wherein the first selectable component and the second selectable component are selectable for their respective wavelength converting characteristics.
12-29. (canceled)
30. An apparatus comprising:
- at least one light emitting diode operable to produce an amount of light with a spectral power distribution; and
- means for converting a portion of the amount of light from the at least one light emitting diode to produce an amount of combined light emitted from the apparatus, wherein the means is selected prior to final assembly of the apparatus based on the spectral power distribution, wherein a color point of the combined light emitted from the apparatus approaches a target color point, and wherein light emitted from the apparatus at the target color point visually matches light emitted from a light source that does not include a light emitting diode at the same target color point.
31. The apparatus of claim 30, wherein the means includes a first selectable component that includes a first type of wavelength converting material having a first wavelength converting characteristic, the first selectable component converting the portion of the amount of light from the at least one light emitting diode to produce light emitted from the apparatus, wherein the first wavelength converting characteristic converts the portion of the amount of light from the at least one light emitting diode.
32. The apparatus of claim 31, wherein the means includes a second selectable component that includes a second type of wavelength converting material having a second wavelength converting characteristic that is different from the first wavelength converting characteristic, wherein the first wavelength converting characteristic of the first selectable component and the second wavelength converting characteristic of the second selectable component convert the portion of the amount of light from the at least one light emitting diode.
33. The illumination module of claim 1, wherein the second color point is within a degree of departure, Δx′y′, of 0.002 of the first color point, wherein x′y′ are color coordinates of the visually matched color space.
Type: Application
Filed: Aug 27, 2010
Publication Date: Mar 1, 2012
Applicant: Xicato, Inc. (San Jose, CA)
Inventors: Gerard Harbers (Sunnyvale, CA), Raghuram L.V. Petluri (Sunnyvale, CA)
Application Number: 12/870,738
International Classification: F21V 9/00 (20060101); G01J 3/46 (20060101); F21V 7/00 (20060101);