DEWING PREVENTION STRUCTURE FOR SUBSTRATE
A dew prevention apparatus is provided. The apparatus includes a dewing prevention structure for a substrate accommodated in a housing. The housing has an opening allowing an inflow of outer air and the dewing prevention structure is configured to suppress dew condensation on the substrate. The dew prevention structure includes a heat conductive member provided inside the housing wherein the heat conductive member contacts each of a predetermined heat source inside the housing and an area of the substrate near the opening.
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This application claims priority from Japanese Patent Application No. 2010-243981 filed on Oct. 29, 2010 including the specification, drawings and abstract thereof, the disclosure of which is incorporated herein by reference in its entirety.
BACKGROUND OF THE INVENTIONAspects of the present invention relate to a dewing prevention structure for a substrate.
DESCRIPTION OF THE RELATED ARTTo prevent migration on a substrate accommodated in a housing of various types of electronic devices, a dew condensation preventive device is proposed in related art to prevent dew condensation on a surface of the substrate. In an electronic unit case, for example, a dew condensation preventive plate is provided around a conductor exposed on a surface of a printed circuit board, and located at a position for preventing a flow of outer air according to Japanese Patent Application Publication No. JP-A-H09-102679. With this dew condensation preventive device, even if high-temperature outer air penetrates to inside the case, the humidity of the outer air is reduced and the conductor is less susceptible to dewing because the outer air blows toward and generates dew on the dew condensation preventive plate that is cooled under a low-temperature environment.
Alternatively, dew condensation is also prevented by coating the surface of the printed circuit board with a protective film for preventing dew condensation.
SUMMARY OF THE INVENTIONHowever, according to the dew condensation preventive device of the related art described above, if a plurality of conductors is provided on the printed circuit board, the conductors must be arranged in a concentrated manner at a location that is surrounded by the dew condensation preventive plate, which places restrictions on the substrate with respect to the layout design of the electronic unit.
With regard to the method for coating the surface of the printed circuit board with a protective film, in addition to the high cost of the coating agent, special equipment must be provided for storing the coating agent and the like, which significantly increases the manufacturing costs of the electronic device.
The present invention was devised in light of the foregoing, and provides a dewing prevention structure for a substrate that can suppress dewing on the substrate, lessen restrictions on the substrate with respect to a layout design of an electronic unit, and reduce the manufacturing costs of an electronic device compared to when a coating agent is used.
According to a dewing prevention structure for a substrate described in a first aspect of the present invention, a predetermined heat source is provided inside a housing, and an area of a substrate near an opening are each in contact with the same heat conductive member. Also, the heat conductive member may be configured such that it does not contact the substrate at portions between the substrate near the opening and the predetermined heat source. Therefore, some heat discharged from the predetermined heat source is transferred to the area of the substrate near the opening through the heat conductive member, which can suppress dew condensation on the substrate. Even if a plurality of conductors is provided on the substrate, the dewing prevention structure for a substrate can be applied without affecting the layout of the conductors, and thus lessen restrictions on the substrate with respect to the layout design of an electronic unit. In addition, the dewing prevention structure for a substrate uses a relatively low-cost heat conductive member, and can be manufactured without special equipment. Therefore, the manufacturing costs of an electronic device can be reduced as compared to when a coating agent is used.
According to the dewing prevention structure for a substrate described in a second aspect of the present invention, the heat conductive member may include a heat sink provided on the substrate for dissipating heat radiated from the predetermined heat source. Utilizing the existing heat sink, for example, thus enables the dewing prevention structure for a substrate to be applied without requiring any compensating design changes to the substrate, the housing, and the like. This further lessens the restrictions on the substrate with respect to the layout design of the electronic unit. In addition, the material costs of the dewing prevention structure for a substrate can be further reduced by using the heat sink, which further reduces the manufacturing costs of the electronic device.
According to the dewing prevention structure for a substrate described in a third aspect of the present invention, the opening may be a connector insertion opening for inserting inside the housing a connector to be connected to the substrate. Therefore, when high-temperature outer air penetrates to inside the housing through the connector insertion opening, the substrate is less susceptible to dew condensation.
Hereinafter, an exemplary embodiment of a dewing prevention structure for a substrate according to the various aspects of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to such an embodiment. Further, note that the dewing prevention structure for a substrate according to the present invention may be applied to any electronic device, with such electronic devices including a navigation device and a car stereo installed in an automobile, for example. In the present embodiment, an example in which the dewing prevention structure for a substrate is applied to a navigation device will be described.
First, the basic configuration of the navigation device will be described.
A navigation device 1 is configured to accommodate a substrate 60 (shown only in
As shown in
As shown in
As shown in
In addition, as shown in
Next, the dewing prevention structure of the substrate 60 in the navigation device 1 thus configured will be described. The dewing prevention structure of the substrate 60 is a structure for suppressing dew condensation on a surface of the substrate 60, in order to prevent migration on the substrate 60 accommodated in the housing 10 of the navigation device 1.
As shown in
The heat sink 70 is disposed on a side surface also mounted with the CPU 61 among upper and lower side surfaces of the substrate 60, and fixed to the substrate 60 in a state of contact with the CPU 61. More specifically, the heat sink 70 is disposed parallel to the CPU 61, and one side surface of the heat sink 70 is in substantially whole contact with one side surface of the CPU 61. Note that the heat sink 70 may contact other components (other heat sources) mounted on the substrate 60 while in contact with the CPU 61 as described above.
Near each corner portion of the heat sink 70, as shown in
Here, areas where the heat sink 70 contacts the substrate 60 (areas where the attachment stay 80 is formed) are set such that at least one area is an area where the substrate 60 is more susceptible to dew condensation. Such an area more susceptible to dew condensation includes an area where outer air is highly likely to contact the substrate 60, such as an area of the substrate 60 near the connector insertion opening 13 (as an example, an area within several centimeters of the connector insertion opening 13). Therefore, in
Next, the operation of the dewing prevention structure of the substrate 60 thus configured will be described.
First, after a power source of the navigation device 1 is turned on and a predetermined time elapses, the current-carrying CPU 61 discharges heat. In this case, some of the heat discharged from the CPU 61 is transferred to an area of the substrate 60 in contact with the CPU 61. This results in an increased temperature at the area of the substrate 60 in contact with the CPU 61 and surrounding areas.
Meanwhile, the remaining heat discharged from the CPU 61 is transferred to the heat sink 70 through contacting surfaces of the CPU 61 and the heat sink 70. Due to the high heat conductivity of the heat sink 70, such heat is efficiently conducted to the area of the substrate 60 near the connector insertion opening 13. This heat is then transferred to the substrate 60 through contacting surfaces of the heat sink 70 and the substrate 60. Therefore, the temperature at the area of the substrate 60 near the connector insertion opening 13 and surrounding areas increases.
Based on the above, with the dewing prevention structure of the substrate 60, for example, if the substrate 60 is exposed under a low-temperature environment, the high-temperature outer air may penetrate to inside the housing 10 through the connector insertion opening 13 and blow toward the area of the substrate 60 near the connector insertion opening 13. Even in such case, heat transferred from the CPU 61 to the substrate 60 through the heat sink 70 warms up the area of the substrate 60 near the connector insertion opening 13, thus making the substrate 60 less susceptible to dew condensation caused by outer air. Therefore, migration can be effectively prevented.
According to the present embodiment described above, the dewing prevention structure of the substrate 60 puts the CPU 61 inside the housing 10 and the area of the substrate 60 near the connector insertion opening 13 in contact with the same heat conductive member. Therefore, some heat discharged from the CPU 61 is transferred to the area of the substrate 60 near the connector insertion opening 13 through the heat conductive member, which can suppress dew condensation on the substrate 60. Even if a plurality of conductors is provided on the substrate 60, the dewing prevention structure of the substrate 60 can be applied without affecting the layout of the conductors, and thus lessen restrictions on the substrate 60 of the navigation device 1 with respect to the layout design of an electronic unit. In addition, the dewing prevention structure of the substrate 60 uses a relatively low-cost heat conductive member, and can be manufactured without special equipment. Therefore, the manufacturing costs of the navigation device 1 can be reduced compared to when a coating agent is used.
The heat conductive member includes the heat sink 70 provided on the substrate 60 for dissipating heat radiated from the CPU 61. Utilizing the existing heat sink 70, for example, thus enables the dewing prevention structure of the substrate 60 to be applied without performing hardly any design changes to the substrate 60, the housing 10, and the like. This further lessens the restrictions on the substrate 60 of the navigation device 1 with respect to the layout design of the electronic unit. In addition, the material costs of the dewing prevention structure of the substrate 60 can be further reduced by using the heat sink 70, which further reduces the manufacturing costs of the navigation device 1.
The connector insertion opening 13 is an opening for inserting inside the housing 10 the connector to be connected to the substrate 60. Therefore, when high-temperature outer air penetrates to inside the housing 10 through the connector insertion opening 13, the substrate 60 is less susceptible to dew condensation.
MODIFICATIONS OF THE EMBODIMENTAn embodiment of the present invention was explained above. However, the specific configuration and units for implementing the present invention may be modified and improved in any manner or form within the scope of the technical ideas of the present invention as set forth in the claims thereof. Examples of such modifications are explained below.
The problems to be solved by the present invention and the effects of the present invention are not limited to the content described above and may vary depending on the environment in which the present invention is practiced and the detailed configuration thereof. The above problems may be only partially solved, and the above effects only partially achieved.
Predetermined Heat Source Provided Inside Case BodyIn the embodiment described above, the predetermined heat source provided inside the housing 10 is a component such as the CPU 61 provided on the substrate 60. However, the present invention is not limited to this example. As another example, the predetermined heat source may be a component such as a speaker amp or the like inside the housing 10 that is not mounted on the substrate 60. Alternatively, if heat discharged from an instrument such as a heater provided outside the housing 10 is transferred to the housing 10 and a side wall of the housing 10 is warmed up by such heat, the side wall may also be utilized as the heat source.
Heat Conductive MemberIn the embodiment described above, the heat conductive member is the heat sink 70. However, the heat conductive member may any type of member that has high heat conductivity, such as a copper plate or aluminum plate, for example. In addition, the heat conductive member may be an assembly of a plurality of members. For example, a copper plate or an aluminum plate may be connected to the existing heat sink 70 whose size corresponds to the shape of the CPU 61, and further connected to an area of the substrate 60 near the opening. Thus, the heat of the heat source may be transferred to the substrate 60 through the heat sink 70, and the copper plate or the aluminum plate. Moreover, as a method of fixing the heat conductive member, adhesion or welding is also conceivable in addition to the threaded fastening described above. Alternatively, provided that the heat conductive member at least contacts the substrate 60, the heat conductive member may not necessarily be fixed.
Opening Allowing Inflow of Outer AirIn the embodiment described above, the opening allowing an inflow of outer air is the connector insertion opening 13. However, the present invention is not limited to this example. As another example, the opening may be the intake opening 11 or the discharge opening 12 provided on the side surface of the housing 10, or an insertion opening for inserting a DVD disc or the like (not shown) provided at the front of the housing 10.
Dewing Prevention Structure of SubstrateIn the embodiment described above, the dewing prevention structure of the substrate 60 puts the heat sink 70 in contact with each of the CPU 61 inside the housing and the area of the substrate 60 near the connector insertion opening 13. However, the dewing prevention structure of the substrate 60 may combine the dewing prevention structure of the substrate 60 with another dewing prevention structure or the like. For example, an area among the area of the substrate 60 near the connector insertion opening 13 that cannot contact the heat sink 70 due to layout space restrictions (an area of the substrate 60 that contacts the receiving-side connector 62 shown in
Claims
1. A dewing prevention structure for a substrate accommodated in a housing that has an opening allowing an inflow of outer air, the dewing prevention structure suppressing dew condensation on the substrate, wherein
- a heat conductive member is provided inside the housing, and
- the heat conductive member contacts each of a predetermined heat source inside the housing and an area of the substrate near the opening.
2. The dewing prevention structure for a substrate according to claim 1, wherein
- the predetermined heat source is a component mounted on the substrate, and
- the heat conductive member includes a heat sink provided on the substrate for dissipating heat radiated from the component.
3. The dewing prevention structure for a substrate according to claim 1, wherein
- the opening is a connector insertion opening for inserting inside the housing a connector to be connected to the substrate.
4. The dewing prevention structure for a substrate according to claim 2, wherein
- the opening is a connector insertion opening for inserting inside the housing a connector to be connected to the substrate.
5. The dewing prevention structure for a substrate according to claim 1, wherein the heat conductive member does not contact the substrate at portions between the substrate near the opening and the predetermined heat source.
Type: Application
Filed: Oct 17, 2011
Publication Date: May 3, 2012
Applicant: AISIN AW CO., LTD. (Anjo-shi)
Inventor: Toshifumi MICHIDA (Okazaki-shi)
Application Number: 13/274,963
International Classification: F26B 19/00 (20060101); F26B 21/08 (20060101);