LIGHT-EMITTING DIODE LIGHT SOURCE
An LED light source includes a carrier, a plurality of LED chips and at least one set of lenses. The carrier has a mounting surface and the LED chips are mounted on the mounting surface. The set of lenses disposed on the carrier includes a first lens and a second lens, and the first lens encapsulates one of the LED chips and a lighting pattern provided from the LED chip encapsulated by the first lens is converted into a first lighting pattern. The second lens encapsulates one of the LED chips and a lighting pattern provided from the LED chip encapsulated by the second lens is converted into a second lighting pattern. The second lighting pattern is different from or compensates the first lighting pattern.
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This application claims the priority benefits of U.S. provisional application serial no. 61/557,352, filed on Nov. 8, 2011. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.
TECHNICAL FIELDThe disclosure relates in general to a light source. More particularly, the disclosure relates to a light-emitting diode (LED) light source.
BACKGROUNDBecause they save power and are environmentally friendly, high power LEDs have been rapidly developed and have become mainstream for illumination lamps.
Since incandescent lamps are now forbidden by law to be used or fabricated , high power LEDs have become the new generation light source and the development of high power LEDs by manufacturers has actively progressed . Generally, illumination coverage of incandescent lamps is about 300°, illumination coverage of fluorescent lamps is about 260°, and illumination coverage of LED light bulbs is about 120°. Since the currently available LED light bulbs have less illumination coverage, users have a mistaken impression that the LED light bulbs have insufficient illumination. Accordingly, some have proposed solutions to further increase the illumination coverage of the LED light bulbs, such as LED chips bonded onto a plurality of inclined surfaces of a heat sink, so that light emitted from the LED chips can propagate towards different directions and so obtain illumination coverage greater than 290° . However, it is difficult to bond the LED chips onto the inclined surface of a heat sink. In addition, the LED chips are required to be bonded onto two opposite surfaces of the heat sink. Accordingly, the design is disadvantageous to mass production.
SUMMARY
The disclosure provides an LED light source capable of providing a lighting pattern with large illumination coverage.
The disclosure provides an LED light source including a carrier, a plurality of LED chips and at least one set of lenses. The carrier has a mounting surface and the LED chips are mounted on the mounting surface. The set of lenses is disposed on the carrier and the set of lenses includes a first lens and a second lens. The first lens encapsulates one of the LED chips and a lighting pattern provided from the LED chip encapsulated by the first lens is converted into a first lighting pattern. The second lens encapsulates one of the LED chips and a lighting pattern provided from the LED chip encapsulated by the second lens is converted into a second lighting pattern. The second lighting pattern is different from the first lighting pattern.
Through the set of lenses, the disclosure can provide LED light sources with large illumination coverage and mixed lighting patterns. Accordingly, the LED light sources can be widely applied in illumination or other fields.
In order to make the aforementioned and other features and advantages of the disclosure more comprehensible, several embodiments accompanied with figures are described in detail below.
First Embodiment
When the LED chip 120a, the LED chip 120b, the first lens 130a and the second lens 130b are disposed on the carrier 110, the first lighting pattern P1, P1′ and the second lighting pattern P2, P2′ compensate each other through the optical design of the first lens 130a and the second lens 130b. Specifically, the first lighting pattern P1, P1′, whose illumination coverage is greater than 90°, can be obtained through the optical design of the first lens 130a. The first lighting pattern P1 represents the light distribution at the upper side of the carrier 110, and the first lighting pattern P1′ represents the light distribution at the lower side of the carrier 110. Similarly, the second lighting pattern P2, P2′, whose illumination coverage is greater than 90°, can be obtained through the optical design of the second lens 130b. The second lighting pattern P2 represents the light distribution at the upper side of the carrier 110, and the second lighting pattern P2′ represents the light distribution at the lower side of the carrier 110.
Since the first lighting pattern P1, P1′ and the second lighting pattern P2, P2′ are both lighting patterns whose illumination coverage is greater than 90°, the illumination coverage of the mixed lighting pattern formed by overlapping the first lighting pattern P1, P1′ and the second lighting pattern P2, P2′ is greater than 180°. In other words, the combination of the first lens 130a and the second lens 130b can provide a mixed lighting pattern whose illumination coverage is greater than 180°.
As shown in
As shown in
As shown in
Since the first lighting pattern P1, P1′, the second lighting pattern P2, P2′ and the third lighting pattern P3, P3′ are all lighting patterns whose illumination coverage is greater than 90°, the illumination coverage θ (shown in
As shown in
As shown in
Furthermore, since the LED chips 120a, 120b, 120c and the set of lenses 130 are installed at the same side of the carrier 110 (mounted on the mounting surface 112), the die-bonding process of the LED chips 120a, 120b, 120c is not complicated.
Second Embodiment
L<r+h/tan [(180−θ)/2]
For example, when the radius r of the carrier 110 is 2 cm, the illumination coverage θ is 270° and the height h of the protruding portion 142 is 1 cm, the radius L of the heat dissipation lamp holder 140 should be equal to or less than 3 cm. In this case, the light emitted from the LED chips is not blocked by the heat dissipation lamp holder 140.
Through using the sets of lenses, the disclosure can provide LED light sources with large illumination coverage and mixed lighting pattern covering both the upper side and the lower side of the carrier. Accordingly, the LED light sources can be widely applied in illumination or other fields.
Although the disclosure has been described with reference to the above embodiments, it will be apparent to one of the ordinary skill in the art that modifications to the described embodiment may be made without departing from the spirit of the disclosure. Accordingly, the scope of the disclosure will be defined by the attached claims not by the above detailed descriptions.
Claims
1. A light-emitting diode (LED) light source, comprising:
- a carrier having a mounting surface;
- a plurality of LED chips, disposed on the mounting surface;
- at least one set of lenses disposed on the carrier, the set of lenses comprising: a first lens encapsulating one of the LED chips, wherein a lighting pattern provided from the LED chip encapsulated by the first lens is converted into a first lighting pattern; and a second lens encapsulating one of the LED chips, wherein a lighting pattern provided from the LED chip encapsulated by the second lens is converted into a second lighting pattern.
2. The LED light source of claim 1, wherein the carrier comprises a ring-shaped carrier.
3. The LED light source of claim 1, wherein the first lighting pattern and the second lighting pattern compensate each other.
4. The LED light source of claim 1, wherein an illumination coverage of the first lighting pattern is greater than 90°, an illumination coverage of the second lighting pattern is greater than 90°, and a combination of the first lens and the second lens provides a mixed lighting pattern whose illumination coverage is greater than 180°.
5. The LED light source of claim 1 further comprising a third lens, wherein the third lens encapsulates one of the LED chips, the lighting pattern provided from the LED chip encapsulated by the third lens is converted into a third lighting pattern, the third lighting pattern is different from the second lighting pattern, and the third lighting pattern is different from the first lighting pattern.
6. The LED light source of claim 5, wherein the first lighting pattern, the second lighting pattern and the third lighting pattern compensate each other.
7. The LED light source of claim 5, wherein an illumination coverage of the first lighting pattern is greater than 90°, an illumination coverage of the second lighting pattern is greater than 90°, an illumination coverage of the third lighting pattern is greater than 90°, and a combination of the first lens, the second lens and the third lens provides a mixed lighting pattern whose illumination coverage is greater than 270°.
8. The LED light source of claim 1, wherein a quantity of the set of lenses is greater than one, the plurality of sets of lenses are arranged on the carrier along a ring-shaped path, and the plurality of sets of lenses are installed at a same side of the carrier.
9. The LED light source of claim 1 further comprising:
- a heat dissipation lamp holder; and
- a driving circuit, electrically connected to the LED chips, wherein the carrier and the driving circuit are disposed on the heat dissipation lamp holder.
10. The LED light source of claim 9 further comprising a lamp shade disposed on the heat dissipation lamp holder, wherein the lamp shade covers the carrier, the LED chips and the set of lenses.
11. The LED light source of claim 9, wherein the heat dissipation lamp holder comprises a protruding portion, and the carrier is disposed on the protruding portion.
12. The LED light source of claim 11, wherein an outer dimension of the protruding portion is smaller than that of the carrier.
13. The LED light source of claim 12, wherein a radius of the heat dissipation lamp holder is L, a radius of the carrier is r, and L, r satisfy the following relationship: where θ is an illumination range of the LED light source, and h is a height of the protruding portion.
- L<r+h/tan [(180−θ)/2]
Type: Application
Filed: Mar 2, 2012
Publication Date: May 9, 2013
Patent Grant number: 8764231
Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (Hsinchu)
Inventors: Hsiang-Chi Chung (Hsinchu County), Ji-Feng Chen (Taipei City), Hung-Lieh Hu (Hsinchu City), Chen-Kun Chen (Changhua County)
Application Number: 13/410,312
International Classification: F21V 5/04 (20060101); F21V 29/00 (20060101);