CROSS-REFERENCE TO RELATED APPLICATION This application claims priority to U.S. Provisional application No. 61/766,687, filed on Feb. 19, 2013, the disclosure of which is incorporated herein by reference in its entirety.
FIELD The technology described herein relates to pillows, such as a bed pillow.
BACKGROUND Chipped foam (also referred to herein as “chip foam”) has been used in pillows. Chip foam typically has a rough, bumpy texture. Different styles of pillows are known, such as pillows 2 that have a baffle 3 around the sides of the pillow 2, as shown in FIG. 1, or pillows 4 that have a continuous side seam 5 that couples together a top and bottom cover surface 6, 7, as shown in FIG. 2.
SUMMARY An example pillow that utilizes chip foam in a centrally disposed position on the pillow is shown and described herein.
BRIEF DESCRIPTION OF THE DRAWING FIGURES FIG. 1 is a perspective view of a first type of pillow having a baffle running around the exterior side edges of the pillow;
FIG. 2 is a perspective view of a second type of pillow having a seam running around the exterior edge of the pillow;
FIG. 3 is a cross-sectional view of the first example pillow of FIG. 1 taken at line 3-3;
FIG. 4 is a cross-sectional view of an alternative first example pillow of FIG. 1 taken at line 4-4;
FIG. 5 is a cross-sectional view of another alternative first example pillow taken at line 5-5 of FIG. 1;
FIG. 6 is a cross-sectional view of another alternative first example pillow taken at line 6-6 of FIG. 1;
FIG. 7 is a cross-sectional view of another alternative first example pillow taken at line 7-7 of FIG. 1;
FIG. 8 is a cross-sectional view of the second example pillow of FIG. 2 taken at line 8-8;
FIG. 9 is a cross-sectional view of an alternative second example pillow of FIG. 2 taken at line 9-9;
FIG. 10 is a cross-sectional view of another alternative second example pillow taken at line 10-10 of FIG. 2;
FIG. 11 is a cross-sectional view of another alternative second example pillow taken at line 11-11 of FIG. 2;
FIG. 12 is a cross-sectional view of another alternative second example pillow taken at line 12-12 of FIG. 2;
FIG. 13 is a cross-sectional view of another alternative second example pillow taken at line 13-13 of FIG. 2;
FIG. 14 is a cross-sectional view of a third example pillow according to the invention in a view similar to that taken at line 8-8 of FIG. 2;
FIG. 15 is a cross-sectional view of another third example pillow in a view similar to that taken at line 3-3 of FIG. 1;
FIG. 16 is a cross-sectional view of yet another third example pillow in a view similar to that taken at line 8-8 of FIG. 2;
FIG. 17 is a cross-sectional view of a fourth example pillow in a view similar to that taken at line 8-8 of FIG. 2;
FIG. 18 is a cross-sectional view of a fifth example pillow in a view similar to that taken at line 8-8 of FIG. 2; and
FIG. 19 is a cross-sectional view of a sixth example pillow in a view similar to that taken at line 8-8 of FIG. 2.
DETAILED DESCRIPTION The example pillow 10 is shown in the figures as incorporating a central core of chip foam 12 and an outer layer of fiber 14 and/or a quilted material 16. The chip foam 12 may be any type of foam that is known for use in pillows, including polyurethane, latex, memory, or other types of foam. The chip foam 12 may alternatively be referred to as shredded foam or chipped foam. The chip foam 12 is preferably housed in a leak proof liner 18 such that the chip foam 12 cannot escape from the liner 18. One type of known leak proof liner 18 is a down proof liner.
The chip foam 12 forms the core of the example pillow 10 inside a liner 18 and may be surrounded by one or more layers of fiber 14 and/or a quilted layer 16. The layers of fiber 14 may be sheets of polyester fiber or cotton fiber, among other types of fiber layers. Alternatively, the fiber layer may be a natural material, such as down, feathers, or a combination thereof. The fiber 14 may be positioned on top of and below the chip foam core 12, e.g., on both a first side and the second side of the chip foam core 12. Alternatively, a single layer of fiber 14 may be positioned either above or below the chip foam core 12, e.g., on only one side of the chip foam core 12. The fiber layer 14 may be housed in a separate liner 20 or may be positioned directly against the chip foam core liner 18. The fiber and chip foam core 12 may be housed within a unitary cover 22 that forms the exterior of the pillow. The unitary cover 22 may be formed from a sheet of fabric, or may the exterior of the quilted layer 16.
Any type of pillow may utilize the design, including bed pillows or decorative pillows. The chip foam core 12 is preferably moldable such that a user can select a shape for the pillow. The exterior layer (or layers) of fiber 14 helps to provide a smooth and comfortable surface to position against a user's skin such that the chip foam core 12 does not feel lumpy or bumpy. The fiber 14 may be a continuous layer that surrounds the core 12 or may be a top and/or a bottom layer that surrounds the chip foam core 12. The example pillow 10 described herein permits the use of a chip foam core 12, which is moldable by a user, and a fiber 14 and/or quilted 16 cover that removes the bumpiness of the chip foam core 12.
Where the pillow 19 has a continuous outer seam 5 around the exterior of the pillow, the fiber 14 and chip foam core 12 may be sewn together around the exterior edges of the pillow so that the chip foam core 12 is non-floating. Alternatively, the chip foam core 12 may float within the fiber layer(s) 14 or the quilted outer layer 16.
The central chip foam core 12 extends substantially across the width and length of the pillow 10, but could take up less room in the interior of the pillow 10, with the fiber layers 14 and/or quilted layers 16 taking up more space within the interior of the pillow 10. The fiber layers 14 and/or quilted layers 16 may be of a constant thickness, or could be thicker in the central area of the pillow than around the outer periphery of the pillow 10.
Referring to the figures, FIGS. 1 and 2 depict two different types of know pillow covers. FIG. 1 depicts a pillow 10 having a substantially rectangular first outer layer and a second substantially rectangular second outer layer, with one of the outer layers forming a top surface 24 of the pillow 10 and the other outer layer forming a bottom surface 26 of the pillow 10. The top and bottom surfaces 24, 26 are coupled around their outer edges by a baffle 3 utilizing stitching. The baffle 3 separates the first and second surfaces.
FIG. 2 depicts another pillow cover that has a first outer layer and a second outer layer. The first outer layer may form the top surface 24 of the pillow 10 and the second outer layer may form the bottom surface 26 of the pillow 10. The first and second layers are coupled together around their outer edges by a row of continuous stitching 5. The stitching 5 may be the same color as the first and second outer layers, or could be a different color from the first and second outer layers. The first and second outer layers shown in FIG. 2 are substantially rectangular, but could have other shapes. A zipper or other means (not shown) that permits opening and closing of the cover 22 may be disposed along at least part of the length of the row of continuous stitching 5.
FIGS. 3-7 depict a cross-sectional view of an example pillow 10 like that shown in FIG. 1 that has a baffle 3 extending around the sides of the pillow 10. FIG. 3 depicts an example pillow 10 having a core of chip foam 12, which includes a liner 18 with chip foam 12 positioned inside the liner 18. A layer of fiber 14 surrounds the chip foam core 12. A pillow cover 22 is positioned around the layer of fiber 14. The fiber 14 may be positioned in its own liner 20, or could be utilized without a separate liner. The baffle 3 is coupled to the first outer surface and the second outer surface via stitching around the outer periphery of the pillow 10 at the edges of the baffle. The chip foam core 12 floats within the fiber layer 14.
FIG. 4 depicts an example pillow 10 having a core of chip foam 12, with the chip foam 12 being surrounded by a liner 18 that houses the chip foam 12. A layer of fiber 14 is positioned around the chip foam core 12, with the fiber 14 being positioned within an outer liner 20. As with FIG. 3, the baffle 3 is coupled to the first outer surface and the second outer surface via stitching. The chip foam core 12 floats within the fiber layer 14. The outer liner 20 could include a zipper (not shown), such as discussed in connection with FIG. 2.
FIG. 5 depicts an example pillow 10 having a core of chip foam 12 that is positioned inside a liner 18, which could alternatively be a baffle. A layer of fiber 14 is positioned above and below the chip foam core 12 and surrounded by the top and bottom surfaces of the pillow 10. As with FIG. 3, the baffle 3 is coupled to the first outer surface and the second outer surface around the sides of the pillow 10 via stitching. In this example, the chip foam core 12 is coupled at its outer edges to the baffle 3 so that the chip foam core 12 does not float. The liner 18 of the chip foam core 12 may be coupled to the baffle 3 by stitching, or other known means.
FIG. 6 depicts an example pillow 10 having a core of chip foam 12 that is positioned inside a liner 18. A quilted layer 16 is also positioned around the chip foam core 12, with an outer layer of the quilted layer 16 forming the outer surfaces of the pillow 10. The chip foam core 12 is coupled to the baffle 3 on the sides of the pillow 10 around its exterior so that it is non-floating. The quilted outer layers 16 are positioned above and below the chip foam core 12. The first outer surface of the pillow 10 is coupled to the second outer surface of the pillow 10 by the baffle 3, with the first and second outer surfaces 16 being stitched to the baffle 3. The outer periphery of the chip foam core 12 is coupled to the baffle 3 to deter the chip foam core 12 from moving inside the pillow 10.
FIG. 7 depicts an example pillow 10 having a core of chip foam 12 that is positioned inside a liner 18. The chip foam core 12 is entirely surrounded by a quilted layer 16. The chip foam core 12 floats within the quilted layer 16. The quilted layer 16 is surrounded by an outer cover 22 that includes a first outer layer and a second outer layer, with a baffle 3 coupling the first and second outer layers around their peripheries in spaced relation. Alternatively, the quilted layer 16 could serve as the outer layer of the pillow 10 without a separate cover.
FIGS. 8-13 depict a cross-sectional view of an example pillow 10 like that shown in FIG. 2, which has a continuous seam 5 that couples a first outer surface to a second outer surface around the periphery of the pillow 10. FIG. 8 depicts an example pillow 10 that includes a central core of chip foam 12 that is housed in a liner 18 or baffle. The liner 18 is surrounded on its top and bottom surfaces by a layer of fiber 14. The fiber 14 may be housed within a liner 20, such as within a layer of fabric. Alternatively, the fiber 14 may be a sheet of fiber 14 that is positioned around the chip foam core 12. An inner surface of the fiber layer 14 could serve as the chip foam core 12 liner. The outer periphery of the outer layer of fiber 14 and the outer periphery of the chip foam core 12 are coupled together, such as by stitching. In this example, the inner chip foam core 12 does not float. The example pillow 10 is surrounded by an outer fabric layer, which can serve as a cover 20 that forms the first outer surface and the second outer surface.
FIG. 9 depicts an example pillow 10 that includes a centrally disposed inner core of chip foam 12 that is positioned inside a liner 18 that retains the foam therein. The liner 18 is surrounded by two fiber layers 14 that may or may not be surrounded by a liner 20. The fiber layers 14 could alternatively serve as the liner for the chip foam 12. The liners 18, 20 for the chip foam 12 and fiber 14 may be baffles that are formed in a contiguous structure. The baffles may be made of fabric, for example. FIG. 9 shows how the top layer of fiber 14, or first fiber layer, may be a first material and the bottom layer of fiber 14, or second fiber layer, may be a second material, with the first and second materials being the same as or different from one another. By using a different material for the first and second materials, a different feel can be provided to each side (top and bottom 24, 26) of the pillow 10. FIG. 9 also depicts a cover 20 positioned around the fiber layers 14 that encloses and protects the fiber layers 14. The cover 20 may be openable and includes a seam 5 that extends around the outer periphery. Any known type of cover 20 may be used. The chip foam core 12 is sewn to the fiber layers 14 around the outer periphery thereof, so is non-floating. Alternatively, the chip foam core 12 could float.
FIG. 10 depicts an example pillow 10 that includes a centrally disposed inner core of chip foam 12 that is positioned inside a liner 18 that retains the foam therein. The inner chip foam core liner 18 is similar to a bladder that houses the chip foam 12. The chip foam core 12 is surrounded on a top surface by a first fiber layer 14, which may also be positioned in its own bladder or liner 20, and on a bottom surface by a second fiber layer 14, which may also be positioned in its own bladder or liner 20. The first and second fiber layers 14 float around the inner chip foam core 12. If desired, they may be attached to each other or the inner foam core 12 by an attachment member, such as hook and loop tape, snaps, or by other permanent or non-permanent means, including stitching (not shown). The example pillow 10 also includes an outer cover 20 that serves to enclose and retain the various parts of the pillow 10 therein. The cover 20 may include a zipper or other means for opening and closing the cover 20 and the parts inside the pillow 10 may be removable/replaceable so that the consumer can select a type of fiber 14 and chip foam 12 for the interior elements of the pillow 10. The first fiber layer 14 may be the same material as, or a different material from the second fiber layer 14. By having different materials for the first and second fiber layers 14, a different feel for the pillow 10 can be provided on each surface 24, 26 of the pillow 10.
FIG. 11 depicts an example pillow 10 that has a chip foam core 12 and a quilted outer layer 16 that surround the chip foam core 12 in order to remove any bumpiness that may be associated with the chip foam core 12. The chip foam core 12 and quilted outer layers 16 are coupled together at least at the outer periphery of the pillow 10. The liner 18 or baffle that houses the chip foam 12 may be formed by the inner surface of the quilted outer layer 16, so that an additional liner or baffle is not required. In this example, the outer quilted layer 16 is formed as a first outer surface 24 that is shown positioned on top of the pillow 10 and a second outer surface 26 that is shown positioned on the bottom of the pillow 10. A zipper (not shown) or other means for closing the pillow 10 may be positioned along at least part of the outer periphery of the pillow 10 and the chip foam 12 may be inserted into the pillow 10 using the zipper, if desired. If the chip foam 12 is removable or replaceable, the pillow 10 will have a longer life and can also be customized to the user by adding or subtracting chip foam 12 from the interior. An additional cover 20 may also be placed over the quilted exterior, if desired.
FIG. 12 depicts another example pillow 10 that is similar to the pillow 10 shown in FIG. 9, except the pillow 10 further includes a thick quilted outer layer 16 positioned on the top and bottom surfaces 24, 26 of the pillow 10. The quilted layer 16, fiber layer 14, and chip foam core 12 may be coupled together at the outer periphery of the pillow 10, if desired, so that the inner fiber layer 14 and chip foam 12 do not float. Alternatively, the chip foam core 12 and fiber may be positioned in liners 18 or baffles, with the outer surface of the fiber 14 being positioned against the inner surface of the quilted layer 16. Alternatively, the chip foam core 12 and/or fiber layers 14 may float inside the quilted layer 16. As with prior examples, the quilted layer 16 may include a zipper (not shown) or other means for opening and closing the pillow 10. The pillow 10 includes a top fiber layer 14 or first fiber layer 14 and a bottom fiber layer 14 or second fiber layer 14. The first and second fiber layers 14 may be the same or different from one another. The quilted top and bottom outer layers 16 may be the same as or different from one another. FIG. 13 depicts an example pillow 10 that is similar to the example shown in FIG. 12, but has a thinner quilted outer layer 16 and a larger chip foam core 12.
FIGS. 14-16 depict an alternative example pillow 30 where the chip foam core 12 is not surrounded by a layer of fiber 14 or a quilted layer 16 on both sides of the chip foam core 12. As shown in FIG. 14, the example pillow 30 has two inner layers, with a bottom liner 18 or bladder holding chip foam 12 and the upper layer being a fiber 14. Both layers are surrounded by a cover 29 that may include a zipper or other means for opening the pillow 30. The fiber 14 and chip foam 12 may be positioned in liners 18, 20 that are sewn together to form baffles. Alternatively, the top layer may be a fiber layer 14 that is separate from a lower layer that is a chip foam core 12 and that is simply placed on top of the chip foam core 12. The outer peripheries of the chip foam core 12 and the fiber layer 14 may be coupled together, such as by stitching, if desired. Alternatively, the chip foam core 12 and fiber layers 14 could float inside the pillow 30. The fiber layer 14 and chip foam core 12 could be removable from the pillow 30 and replaceable. Although a single fiber layer 14 is shown, multiple fiber layers 14 could be used. The fiber layer 14 could have different densities of materials, or different types of materials across the extent of the fiber layer 14. For example a first material could be positioned in the center section of the fiber layer 14 while a second material is positioned in the outer sections of the pillow. This way, the pillow 30 can have a different feel depending upon where the user positions their head on the pillow 30. The same is true for the inner chip foam core 12, which could have rows of different types of chip foam (not shown) instead of layers. The pillow 30 shown in FIG. 14 is similar on its exterior to the pillow shown in FIG. 2. Either side (top or bottom 24, 26) of the pillow 30 may be used by a user.
FIG. 15 depicts an example pillow 30 that is similar on its exterior to the pillow shown in FIG. 1, which includes side baffles 3. This example pillow 30 is similar to the pillow shown in FIG. 14, but it does not include a separate outer cover and the chip foam core 12 is coupled to the fiber layer 14 in a non-movable manner.
FIG. 16 depicts an example pillow 30 similar to that shown in FIG. 14, but that also includes a quilted outer layer 16 that extends around the entire outer surface of the pillow 30. The quilted outer layers 16 may have an inner surface that serves to retain the chip foam 12 in the bottom portion of the pillow and the fiber 14 in the top portion of the pillow, with a baffle extending between the fiber 14 and chip foam 12 layers of the pillow 30 to keep the layers separated. Alternatively, the baffle is not required to separate the chip foam 12 and fiber layers 14 and the chip foam 12 could simply seat below any fiber layer 14, with the fiber layer 14 serving to retain the chip foam 12 in an area of the pillow 30. Alternatively, the chip foam 12 could be positioned in its own liner 18 while the fiber layer 14 is positioned in its own liner 20 and with both being positioned inside the quilted outer layers 12 of the pillow 30.
FIG. 17 depicts an alternative example pillow 32 that has an inner chip foam core 34 that is shaped in a contour. The chip foam core 34 in this example has a centrally positioned depression 36 for receiving the head. Any type of contoured inner liner 38 may be used. Multiple contoured inner liners could be used, if desired. In the example shown, chip foam 12 is positioned in a liner 38 that floats in the interior of the pillow 32. The chip foam core 34 is surrounded on its top surface by a first fiber layer 14 and on its bottom surface by a second fiber layer 14. The fiber layers 14 may be made of different types of materials or the same type of materials. The fiber layers 14 may float or be coupled together. FIG. 17 also depicts a second outer fiber layer 40 that surrounds the first and second fiber layers 14. The pillow 32 is surrounded by an outer casing or cover 22 that may include a zipper (not shown) in order to allow the removal and/or replacement of members inside the pillow 32. A quilted layer 16 could be used instead of one or more of the fiber layers 14, 40 or of the cover 22. More than one or two fiber layers could be used, if desired. The various layers may float relative to one another or be coupled together in a fixed and/or non-fixed manner.
FIG. 18 depicts another alternative example pillow 42 that has an inner chip foam core with multiple layers of chip foam. In this example, the pillow has an inner core of a first type of chip foam 44 that is surrounded on both sides with another type of chip foam 46. The chip foam 44, 46 may be provided within liners 18 or baffles, as previously described. The various chip foam layers 44, 46 may float or may be coupled together, as previously described. While two outer chip foam layers 46 are shown surrounding an inner chip foam layer 44, only a single outer chip foam layer could be used, such that the pillow is made up of a first chip foam layer 44 and a second chip foam layer 46. The chip foam layers 44, 46 are surrounded by a quilted outer layer 16 that helps to remove any bumpiness that is associated with the chip foam cores 44, 46. Each of the chip foam layers 44, 46 could be positioned in their own liners 18. Alternatively, a pillow form having baffles could be used to separate the various layers. The inner surface of the outer quilted layer 16 could serve to retain the adjacent chip foam material instead of having a separate baffle or liner, if desired. As with prior examples, the various layers could float relative to one another or could be coupled together at their outer peripheries.
FIG. 19 depicts another alternative example pillow 50 that has an inner chip foam core 46 that surrounds a layer of solid foam 52 or other material, such as fiber. The pillow design shown in FIG. 19 is similar to that shown in FIG. 2, with a continuous side seam 5 around the outer periphery of the pillow 50. The example pillow 50 includes an inner most core 52 that is not made of chip foam, but that is surrounded by chip foam 46 on its top and bottom surfaces. This inner layer 52 may be a solid foam or a fiber, among other types of materials. A first layer of chip foam 46 is positioned on top of the center layer 52 and a second layer 46 of chip foam is positioned below the center layer 52. The first and second layers 46, 52 of chip foam may be the same type of material or different types of materials relative to one another. In the example, shown, the chip foam layer 46 is surrounded on a top surface by a first fiber layer 14 and on a bottom surface by a second fiber layer 14. Alternatively or in addition thereto, a quilted layer 16 could surround the chip foam layers 46, instead of or in addition to the outer fiber layer 14. The first fiber layer 14 may be the same as or different from the second fiber layer 14.
While the examples are shown in the context of either a pillow 10, 30, 32, 42, 50 having a side baffle 3 or a pillow 10, 30, 32, 42, 50 having a continuous centrally located outer seam 5, it should be readily recognized that any of the examples described herein could be used with other types of pillows than those shown.
Any types of materials may be used for the fiber 14, fabrics, and chip foam 12. The chip foam 12 may be shredded foam or granulated foam, if desired, as long as the chip foam core 12 is at least somewhat shapeable by a user. Any known type of chip foam 12, as known by those of skill in the art, may be used. Any known manufacturing process may be used for chipping the foam. The chip foam 12 may be a polyurethane foam, a viscoelastic or memory foam, latex foam, polyethylene foam, or other known types of foams, or combinations thereof. The chip foam 12 may have a range of density based upon the desired feel of the pillow to a consumer.
The solid foam layer 52 used in FIG. 19 may be made of polyurethane, a viscoelastic or memory foam, latex foam, polyethylene foam, or other types of foams, or combinations thereof. The solid foam layer 42 may have a range of density based upon the desired feel of the pillow to a consumer.
The fiber 14 may be any known type of fiber that is for use in pillows, including polyester, polyurethane, natural, organic, or synthetic fibers, or combinations thereof. Down, feathers, or a combination thereof could also be used as the fiber layer. The fiber 14 may be prepared in sheets of material that are wrapped or positioned around the core. Alternatively, the fiber 14 may be blown into a liner 20 that is subsequently positioned around the core.
The quilted layer 16 may be any type of quilted layer 16, as known by those of skill in the art. The quilted layer 16 may include stitching (not shown) that extends through the quilted layer 16 in a pattern, as known by those of skill in the art. The quilted layer 16 may include a first outer layer, a second outer layer, and a fiber positioned between the first and second outer layers, with stitching coupling the first and second outer layers together. White or colored stitching may be used. The thread may be the same type of material as the fabric layers. The fabric layers may be cotton, polyester, tencel, natural fibers, synthetic fibers, other materials, or combinations thereof. The fiber layer 14 may be polyurethane, polyethylene, natural, organic, or synthetic fibers, feathers, down, or combinations thereof.
An outer cover 22 of the example pillow may be made of a single layer of fabric and may include a zipper or other attachment member that permits the interior of the pillow to be accessed. Alternatively, the outer cover 22 may be quilted and may also include a zipper or other attachment member. Any known types of materials may be used for the outer cover 22, as known by those of skill in the art.
An example pillow includes a core of chip foam 12, at least one fiber layer 14, and a cover 22. The core of chip foam 12 is positioned in a leak proof liner 18. The at least one fiber layer 14 is positioned at least in part around the chip foam core 12. The cover 22 encloses the chip foam core 12 and the at least one fiber layer 14.
The fiber layer 14 may be positioned only on one side of the chip foam core 12. The pillow may also include a quilted layer 16 at least one of forming the cover 22 and/or positioned around the at least one fiber layer 14. The chip foam may be a polyurethane or latex foam material.
The pillow may also include a solid foam layer 52 positioned inside the quilted layer 12. The quilted layer 12 may include at least a first type of chip foam and at least a second type of chip foam. The first and second types of chip foam may be intermixed. The first and second types of chip foam may be positioned in separate layers, with each layer being positioned in a liner.
The at least one fiber layer 14 may include a pair of fiber layers 14, with one fiber layer 14 positioned on top of the quilted layer 12 and a second fiber layer 14 positioned under the quilted layer 12. The at least one fiber layer 14 may include multiple fiber layers 14. The at least one fiber layer 14 includes a plurality of fiber layers 14, with a first fiber layer 14 positioned above and below the quilted layer 12, and a second fiber layer 14 positioned above and below the first fiber layer 14. The at least one fiber layer 14 may include a single fiber layer 14 that completely surrounds the quilted layer 12.
The liner 18 is leak proof in that it deters chip foam 12 from passing through the liner 18. Any type of material may be used to house the chip foam 12, such as cotton, polyester, synthetic, other natural fiber materials, or combinations thereof. The liner 20 used to house the fiber 14 may be the same as or different from the liner 18 for the chip foam 12. The cover 22 may be made of any type of material, such as cotton, polyester, synthetic fibers, natural fibers, or combinations thereof.
In another example, a pillow includes a core of chip foam 12 positioned in a liner 18 and a quilted layer 16 positioned at least in part around the core of chip foam 12. The pillow may also include a fiber layer 14 positioned between the quilted layer 12 and the quilted layer 16. Alternatively, the fiber layer 14 may be positioned around part of the quilted layer 12 between the quilted layer 16 and the quilted layer 12.
The fiber layer 14 may be positioned in a liner 20. The fiber layer 14 may include multiple fiber layers 14, 40 that are stacked on top of one another. The fiber layer 14 may be positioned directly adjacent the quilted layer 12.
The quilted layer 12 includes at least a first type of chip foam and at least a second type of chip foam. The first and second types of chip foam may be intermixed. The first and second types of chip foam may be positioned in separate layers, with each layer being positioned in a liner. The quilted layer 12 may include a layer of foam or a layer of fiber 14 positioned inside the quilted layer 12.
The fiber layer 14 may be positioned only on a top surface of the quilted layer 12. The fiber layer 14 may include a first fiber layer 14 positioned on a first side of the quilted layer 12 and a second fiber layer 14 positioned on a second side of the quilted layer 12, with the first and second fiber layers 14 being different from one another.
The term “substantially,” if used herein, is a term of estimation.
While various features of the claimed invention are presented above, it should be understood that the features may be used singly or in any combination thereof. Therefore, the claimed invention is not to be limited to only the specific embodiments depicted herein.
Further, it should be understood that variations and modifications may occur to those skilled in the art to which the claimed invention pertains. The embodiments described herein are exemplary of the claimed invention. The disclosure may enable those skilled in the art to make and use embodiments having alternative elements that likewise correspond to the elements of the invention recited in the claims. The intended scope of the invention may thus include other embodiments that do not differ or that insubstantially differ from the literal language of the claims. The scope of the present invention is accordingly defined as set forth in the appended claims.
