MULTI-STAGE EVAPORATIVE HEAT REJECTION PROCESS CYCLE THAT FACILITATES PROCESS COOLING EFFICIENCY, WATER PRODUCTION, AND/OR WATER RECLAMATION FOR FLUID COOLERS AND COOLING TOWERS

Abstract

An evaporative heat rejection cycle for cooling a heat load is presented, including an environmental pre-cooling primary evaporator, an environmental pre-cooling secondary evaporator, a pre-cooled evaporative heat rejection cycle section in thermal communication with a heat load, and a primary pre-cooling evaporative heat exchanger in thermal communication with air that is drawn into thermal communication with a primary evaporator cycle, to enable heat transfer and moisture elimination from the air to a first fluid, where a portion of the first fluid evaporates and absorbs heat and condenses moisture from the air.

Description

BACKGROUND

Evaporative heat rejection equipment is commonly used to reject waste heat into the atmosphere that has been absorbed from power generation processes, radiator processes, industrial processes, or refrigeration cooling process cycles. The evaporative heat rejection equipment includes at least cooling towers, evaporative coolers, surface condensers, and fluid coolers. The evaporative heat rejection equipment is often configured in a tower structure that facilitates the evaporative cooling process.

Wet bulb-driven evaporation systems enable higher system energy efficiencies versus dry bulb-dependent equipment due to the requirement for higher fan horse power requirements for dry condensing heat rejection. Also, dry bulb-driven heat rejection processes generally produce higher temperature process water which is less efficient and adds operational costs to the cycles they serve. The evaporative process utilizes water, in either a spray mist, drizzle, or water fall type process to enable contact time with the wet-bulb atmosphere to effectively absorb heat into the atmosphere and manufacture lower coolant fluid temperatures. These systems are two or three component fluid cooling systems in which air and water, or in some instances, glycol are the only fluids involved in the evaporative cooling process.

There are several disadvantages to the evaporative heat rejection process including the requirement of large quantities of potable water. Since water is a precious resource, and has limited availability in certain regions, the evaporative heat rejection process has an impact on the earth's water resources.

Present day cooling towers, fluid coolers and surface condensers produce relatively cold process water based on a relationship between the atmospheres wet bulb condition, the contact time of the water, the flow of the water, and the air current that is pulled through the cycle using a fan. The delta temperature difference of leaving process water temperature versus available wetbulb is referred to as wet bulb approach temperature. The approach of a particular heat rejection cycle has limitations based on fan horse power, and the maximum contact time that the water can stay in contact with the atmosphere to reject heat. It is normal for the process water production temperature to be within 5-9 degrees ° F. of wetbulb. In some instances, there is equipment that can produce 3-5 degrees ° F. process water. However, this equipment requires oversizing of fans, structure, fill, and/or coils in order to produce lower delta wetbulb approach temperatures.

Conventional water-cooled heat rejection equipment in their current form have significant inherent limitations in their ability to produce lower temperature process water or fluids. They are reliant on environmental decreases in atmospheric conditions in order to produce lower temperature fluids.

Conventional water cooled heat rejection equipment in their current form have significant inherent limitations in their ability to change and optimize their coolant production operation over a full spectrum of environmental weather and load conditions. Their performance capabilities are limited to, and reliant on, the present environmental temperature and humidity conditions (enthalpy) of the atmosphere in which they are operating.

Conventional water cooled heat rejection equipment in their current form require significant chemical treatment systems in order to control internal and external water and air borne bio-hazards, in addition to corrosion inhibiting measures in the pipe system.

Conventional heat rejection equipment are limited in their air flow patterns. Such heat rejection equipment are either a 100% draw-through or 100% blow-through air exchange of air within the environment. They are full air pass-through cycles. The coolant production process can be varied by varying the production water flow rates (basin pumps on or off), the coolant flow rates (condenser water pumping variable frequency drives (VFDs) or speed controls), or the air flow rates (fan VFDs or speed controls).

Conventional heat rejection equipment (e.g., towers, fluid coolers, evaporative coolers, etc.) in their current form are not capable of effectively containing, capturing or processing the intake vapor that is present in the air that passes into the cycle in advance of the heat rejection process.

Conventional heat rejection equipment (e.g., towers, fluid coolers, evaporative coolers, etc.) in their current form are not capable of effectively containing, capturing or processing the vapor that is discharged into the atmosphere that is a by-product of the heat rejection process.

Conventional heat rejection equipment (e.g., towers, fluid coolers, evaporative coolers, etc.) in their current form are not capable of producing potable (distilled) water as a by-product of the cycle.

Conventional heat rejection equipment (e.g., towers, fluid coolers, evaporative coolers, etc.) rely on external feeds for water in their current form, and are not capable of extracting water out of the atmosphere and utilizing that water in their cycle. Rather, the cycle consumes tremendous amount of potable water.

Conventional heat rejection equipment (e.g., towers, fluid coolers, evaporative coolers, etc.) have limited ability to regulate the leaving process water temperature. The limitations are, for example, atmospheric conditions, fan speed, water flow rates, and control water pipe bypasses. Water cooled refrigeration cycles require additional power (kw/ton increases) with each degree of increase of process condenser water temperature.

Conventional water cooled refrigerant cycles that operate in high wetbulb environments, and rely on cooling towers, fluid coolers, for their process water, require more power to operate in these harsher environments.

SUMMARY

The present disclosure relates to a heat rejection cycle that can produce and process its own water from the environment, reclaim and process discharge vapor which produces additional distilled water, facilitate greater efficiencies on process water production and dramatically increase chiller efficiency performance.

The cycle significantly improves system fluid production temperature tolerances to provide a more stable environment for refrigeration circuits that may be fed from the heat rejection equipment.

The cycle can operate as an atmospheric water pre-production unit. The entering air can be efficiently lowered to effectively draw out moisture (condensed) from the available atmosphere in an effort to produce all or a portion of the water that will be consumed in the evaporative heat rejection process that will occur further down stream in the cycle.

The cycle can process and reclaim the water vapor that is produced in the evaporator heat rejection cycle. This can be accomplished utilizing limited mechanical DX compression and very low kw/ton ratios. The water is potable quality water which can be harvested for re-use in the cycle or for other purposes.

The cycle can deliver cool fresh conditioned air as a by-product of the after cooler water recovery cycle. This air can be used to cool various loads, electronics equipment, or other heating ventilation, and/or air-conditioning (HVAC) or process cooling needs.

The cycle is not reliant on atmospheric conditions alone to produce lower temperature process water. Rather, it has the ability to treat and lower the inlet wet-bulb conditions to produce a desired lower temperature process water with very little energy.

The cycle significantly reduces the need for chemicals that are normally required for biological and corrosion purposes in the process water. This is because a majority of the water that is introduced into the cycle has been extracted and condensed from the atmosphere. This process produces clean fresh water that is free of contaminants and is PH neutral.

Moreover, the cycle has an environmentally friendly impact. The cycle requires less blow-down cycle discharges versus a traditional cooling tower or fluid cooler cycle that rely on water from external sources that may not be good quality water free of particulate(s) or adverse PH quality. The requirement for less frequent blow-downs aids in the conservation of water and facilitates greater production capacity for other uses. Since the cycle can utilize better quality water that it processes and produces, it significantly lessens the impact on sewage discharges that are necessary with traditional towers and fluid cooler systems.

The system water production and internal chamber temperature control can be finely tuned, thus enabling an optimized cycle that is not normally possible with standard cooling towers and fluid cooler systems. The cycle can be optimized for colder water production processes, water conservation, and discharge of air conditioning. Normally the control of these various system cycles are in silos and are not directly interrelated or interconnected. This holistic system approach to the inter-related cycles enables simple close tolerance algorithms which can proportionally control the system in relation to changes in environmental conditions, water production needs, and energy efficiency enhancements for the load system.

The system utilizes a stepped proportional in-series cooling approach for the pre-cooling inlet and after-cooling discharge air treatment. This in-series stepped approach to cooling the air enables the majority of the cooling load to be handled with a pumped refrigerant solution, and then a resultant smaller portion to be accomplished with a compressed direct expansion (DX) cycle.

By pre-cooling the inlet air, and creating a lower temperature environment in the chamber of the cycle, load process cooling can be accomplished at extremely high efficiencies and at low kw/ton ratios. At the same time, the lower false atmosphere in the chamber facilitates lower temperature process water production with a net savings of overall system energy use.

The water vapor recovery system includes an add-on dual air circuit. This circuit adds a benefit to the overall system efficiency, by producing clean fresh water that can be reused in the cycle, thus enabling better heat transfer in the pipe system and equipment, and further reducing chemical treatment requirements. The system is includes the same dual in-series cooling evaporators with the primary cooling being performed by the efficient pumped refrigerant circuit, and the resultant load handled by the secondary smaller DX circuit.

The exemplary circuits described in this application apply to new cooling towers, fluid coolers, as well as retrofit applications. The evaporators, refrigerant cycles, and control systems can be either factory applied to new equipment or retrofitted to existing equipment.

The cycle equipment can be fitted with discharge duct connections to facilitate delivery of cold conditioned air.

The cycle apparatus can be fitted with discharge air, face and bypass dampers, enthalpy control, and inlet air connections to facilitate greater efficiencies at the intake air assembly of the cycle. The heat load at the intake pre-cool evaporators can be reduced by allowing a portion of the cold discharge air to be ducted in a bypass arrangement back to the inlet of the apparatus. This can be done on either new factory equipment or retrofitted on existing fluid coolers and cooling towers.

Further scope of applicability of the present disclosure will become apparent from the detailed description given hereinafter. However, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the present disclosure, are given by way of illustration only, since various changes and modifications within the spirit and scope of the present disclosure will become apparent to those skilled in the art from this detailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

The above and other aspects, features, and advantages of the present disclosure will become more apparent in light of the following detailed description when taken in conjunction with the accompanying drawings in which:

FIG. 1 is a schematic diagram illustrating a cooling tower with an inlet air pre-cooling dual refrigerant evaporator circuit, in accordance with the embodiments of the present disclosure;

FIG. 2 is a schematic diagram illustrating a cooling tower with an inlet air pre-cooling, as well as a discharge air after cooler dual refrigerant evaporator circuit, in accordance with the embodiments of the present disclosure;

FIG. 3 is a schematic diagram illustrating a fluid cooler with an inlet air pre-cooling as well as a discharge air after cooler dual refrigerant evaporator circuit, in accordance with the embodiments of the present disclosure;

FIG. 4 is a schematic diagram of a face and bypass and ducted connections from the discharge to the air inlet of the apparatus, in accordance with the embodiments of the present disclosure; and

FIG. 5 are schematic diagrams of various air flow patterns including induced and forced draft flow air flow patterns for cooling towers and fluid coolers, in accordance with the embodiments of the present disclosure.

The figures depict preferred embodiments of the present disclosure for purposes of illustration only. One skilled in the art will readily recognize from the following discussion that alternative embodiments of the structures and methods illustrated herein may be employed without departing from the principles of the present disclosure described herein.

DETAILED DESCRIPTION

Particular embodiments of the present disclosure are described hereinbelow with reference to the accompanying drawings; however, it is to be understood that the disclosed embodiments are merely exemplary of the disclosure and may be embodied in various forms. Well-known functions or constructions are not described in detail to avoid obscuring the present disclosure in unnecessary detail. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a basis for the claims and as a representative basis for teaching one skilled in the art to variously employ the present disclosure in virtually any appropriately detailed structure.

The term “exemplary” is used herein to mean “serving as an example, instance, or illustration.” Any embodiment described herein as “exemplary” should not necessarily be construed as preferred or advantageous over other embodiments. The word “example” may be used interchangeably with the term “exemplary.”

The present disclosure relates to an apparatus that is capable of efficiently improving environmental conditions (wet-bulb) in order to optimize chiller and other heat rejection processes. The apparatus can be fitted with inlet dual stage heat rejection coils that can lower the inlet latent and sensible air loads to create a more efficient false atmosphere within the air chamber, that enables the production of colder process water. By lowering the chamber atmospheric wet bulb temperature the apparatus can produce colder process water. The production of colder process water facilitates greater efficiencies on the load side or system side that the apparatus is serving as a heat rejection apparatus. As a result of the production of lower temperature process water, chillers and other equipment connected to the apparatus exhibit higher efficiencies. For instance a chiller gains approximately 2% efficiency per each degree lowered on the supply condenser (processor) water. Since the inlet pre-cooling cycle can lower the inlet air temperature with minimal energy expended, there are significant net savings in energy across the system. The total combined power use in the system is significantly reduced because the load system equipment exhibits high efficiency gains due to the production of cooler process water through the false atmosphere. It therefore enables a net energy system savings in addition to producing water and re-claiming water.

The inlet air pre-cooler evaporator circuits are capable of lowering the entering air temperature conditions through a dual (or stepped) cooling process. This process lowers the enthalpy of the entering air to a controlled and desired set-point. The staged process which uses a plural refrigerant pumped solution is able to cool the entering air incrementally through a series of inlet air evaporator coils. The staged cooling process offers a highly efficient cooling kw/ton ratio.

The majority of the entering air heat load (about 50-75%) is accomplished without utilizing direct mechanical compression assistance. The primary heat load is absorbed into the evaporator utilizing a pumped refrigerant. The pumped liquid refrigerant temperature (saturation line) set point is at approximately 1 degree below the desired leaving air temperature off of the primary inlet air evaporator. The temperature of the pumped liquid supply refrigerant correlates directly to the temperature of the related condenser water supply water temperature. The refrigerant condensing line is maintained at approximately 0.5 to 1 degree approach temperature. This approach temperature is the delta, T, between the entering supply condenser water at the condenser versus the leaving fully condensed pumped refrigerant, which is then supplied to the primary air evaporator coil.

The available condenser water supply temperature in the cold water basin is cooler than it would normally be if the pre-cooler evaporators did not pre-treat and lower the entering outside entering air to the desired leaving air temperature entering the air chamber. The cooler pre-treated air is then pulled up through (or pushed through in a cross-flow cycle) where it is in contact with the water film that is moving its way down the cooling tower fill or condensing coil if it is a fluid cooler cycle. The water collects in the cold water basin after it has completed its interaction with the cold air stream in the air chamber. This cooler process water can be delivered to the external process equipment that it feeds, and it is available to feed the condensing equipment, including the internal refrigerant circuits that pre-cool the entering, and if applicable, after-cooler circuits.

The inlet air pre-cooler cycle evaporator coils can be located on a single or multi-sided faced towers or fluid coolers.

In the instance of multiple face inlet air pre-coolers cycle evaporators they can be fed from (i) a common primary or (ii) multiple primary and secondary refrigerant circuits.

The pre-cooler inlet and after-cooler outlet evaporators can be fed from (i) common or (ii) multiple primary and secondary refrigerant circuits.

The final after-cooler evaporative cooling circuits can further remove a portion of the heat load that has been introduced into the airstream from the process return water. The level of heat rejection that is accomplished at the after cooler is dependant on the cycle demand requirements for moisture removal or cold fresh air production.

The after-cooler evaporator circuits can be fitted with similar air flow and refrigerant circuits to the pre-cooling inlet air cycles. The initial heat load of about 50-75% can be accomplished at the primary evaporator coil before it enters the secondary pre-cooler evaporator. The resultant load on the secondary after cooler evaporator is reduced by approximately 50-75% similar to the pre-cooler evaporator cycles.

This final heat load is accomplished utilizing a compression circuit which operates on an in-series refrigerant to the refrigerant circuit. The system coefficient of performance and kw/ton are significantly lower than normal operating DX refrigerant systems because the overall “lift” of the refrigerant circuit is approximately only about 10-15% that of a normal DX compression system. This is due to the availability of cold process condenser water, which is produced as a by-product of the pre-cooler and water recovery system at the air inlet to the system.

The apparatus can be housed in or attached to a traditional cooling tower, or fluid cooler structures, or can be arranged in typical draw-through or blow-through air handling unit style coil and fan configurations.

The types of fans utilized in the apparatus can vary by efficiency performance.

The type of evaporation media, tower fill, condensing coils, wicking material and water contact evaporation mass, or combinations thereof are interchangeable to enable greater efficiencies in fan horsepower performance and better heat transfer.

The system utilizes conventional micro-channel evaporator coils, however, if future coil technology facilitates greater air pressure efficiency (lower static pressure losses), or better heat transfer coil characteristics they may be substituted. One skilled in the art may contemplate a plurality of different evaporator coils. The exemplary systems of the present disclosure are not limited with regard to evaporator coils.

The apparatus can be housed in an enclosure including face and bypass modulating intake and discharge dampers. Modulation of the dampers enables full proportional control of the air intake from and air discharge to the external environment, as well as regulation of the amount and quality of air that is taken and rejected (enthalpy control). It is noted that the spray water cycle and the collection basin allows the apparatus to act as an evaporative cooler.

The in-series evaporator coils are capable of reducing the high latent air sufficiently below the dew point in order to extract water from the high latent vapor. The coils can also be utilized to lower the effective wet bulb condition ahead of the heat rejection coil, thereby creating a “false atmosphere.” This facilitates greater efficiency benefits for producing cooler leaving water off the heat rejection coil(s). By placing the coils in series, the cycle to cool the entering hot latent air is enabled. The air is cooled as it enters the primary heat exchanger evaporator coil.

The heat absorption is accomplished by rejecting the heat through the process of latent heat of vaporization. The heat is absorbed into the pumped liquid refrigerant that is present at the evaporator heat exchanger. The refrigerant cycle utilizes a pump to deliver liquid refrigerant to the evaporator coil. It is an “over feed” or “over-pumped” system. The amount of heat that is absorbed at the primary coil is dependent on the rate of boil-off of the refrigerant. This is a function of “setting” the condensing saturation line at a temperature/pressure set-point to facilitate boil-off of refrigerant at a rate that is commensurate with the available heat and moisture content in the air stream that is in thermal communication with the evaporator.

The boil-off temperature set point (condensing line) is set at the primary condenser. The primary pre-cooler evaporator circuit is capable of cooling the high latent air down (intake air) to within approximately 2 degrees of the false atmosphere wet bulb in the chamber. This is accomplished by circulating refrigerant that is within 1-1/12° F. below the leaving air temperature set-point.

The leaving air temperature can be further reduced, by enabling the compressor circuit on the secondary pre-cooler evaporator to operate. The compressor circuit further absorbs the heat that is present at intake air as it passes through the secondary pre-cooler evaporator. The leaving air temperature is regulated by the operating controls of the compressor circuit at a demand requirement to meet a specific set-point (enthalpy space condition) that is to be maintained in the evaporative heat rejection chamber. By maintaining a low set-point temperature in the heat rejection, three significant efficiency gains are accomplished. The first is that it enables colder process water to be produced, which in turn enables high efficiency gains on the process water equipment, (load side). The second is that it produces cooler condenser water fluid which in turn can be used to set lower condenser set-points (refrigerant boil-off) at the primary pumped refrigerant circuit condensers. Third, is that it facilitates lower compression lift ratios to enable lower kw/ton energy ratios on the secondary pre- and after-cooler refrigerant compression circuits.

The in-series pumped refrigerant evaporators and heat rejection cycle enable a cascading effect in energy use effectiveness. By creating a lower atmosphere, the cycle creates an environment that is conducive to facilitating low-lift energy efficiency on both the system load compressors, as well as the compression on the secondary trim cycles.

The secondary evaporator circuit has similar operational characteristics at the primary circuit by utilizing a pumped refrigerant to deliver the fluid to the evaporator. However, the secondary circuit also has a compression circuit (refrigerant to refrigerant) to facilitate a further reduction in the inlet air temperature and moisture removal processes. The effective load on the secondary compressor is significantly reduced because much of the heat load has already been rejected at the primary evaporator coil circuit without the need for mechanical compression.

A pumped water cooled condenser cycle is in series with the cold water basin collection pan, the air stream (spray nozzles), and the water cooled condenser to reject the heat from the evaporator coils that are in the air stream. The apparatus can vary its water production, water reclaim, and interior chamber enthalpy dependant on load requirements, environmental conditions, and a particular desire to operate as a free cooler, or a combination of operating modes.

Reference will now be made in detail to embodiments of the present disclosure. While certain embodiments of the present disclosure will be described, it will be understood that it is not intended to limit the embodiments of the present disclosure to those described embodiments. To the contrary, reference to embodiments of the present disclosure is intended to cover alternatives, modifications, and equivalents as may be included within the spirit and scope of the embodiments of the present disclosure as defined by the appended claims.

More particularly, referring to FIGS. 1-5, a liquid refrigerant-assisted evaporative cooling system 100 is presented according to an exemplary embodiment of the present disclosure. A cooling tower or fluid cooler 102 is described in more detail below. It is noted that cross-flow and counter-flow air pattern arrangements place inlets and outlets at opposite ends of the cycle. The flow of inlet air 10 passes through an intake, as indicated by arrow 10. The air 10 passes through and is in thermal communication with a primary pre-cooler evaporator 331, the air 20 is partially cooled and a portion of moisture from the air 20 (Q4) is removed. The air 20 continues and passes through and is in thermal communication with a secondary pre-cooler evaporator 332. Thus, further cooling and moisture removal (Q5) is accomplished. The air 30 enters the heat rejection chamber 304 where it is in thermal communication with the water film 120a (QRC), (or water 300 for Fluid Cooler, as shown in FIG. 3) that is cascading down the fill 105. The cold air 30 is in thermal communication with the water film 120a and the evaporative heat rejection process thus takes place. The latent heat from the process water 120a is absorbed into the air 40. The remaining process water 120a that has not evaporated, is cooled by the evaporative process and cascades down the fill 105 and is collected in the cold water basin 350.

The basin cold water 300 is discharged out of the cold water basin 350 by the system load header pump 2100. The fluid 120b is circulated through the process water system 50 to continue the heat rejection cycle. The warm latent air 40 enters the fan(s) 310, and it is discharged out into the atmosphere, as shown in FIG. 1, or enters into thermal communication with the after-cooler evaporator circuits 333 and 334, as shown in FIG. 2. After-cooler evaporator cycles 333 and 334 are in thermal communication with the entering air 40, in advance of discharge to the atmosphere or to be utilized for conditioned cooling air 40, or enter a face and bypass air cycle chamber 600, as illustrated in FIG. 4.

The control and monitoring of the air 10-80 through its various steps of pre-cooling, heat absorption and after-cooling is accomplished via thermal enthalpy temperature sensors T1-T7. The sensors monitor and regulate the various refrigerant cycles in order to maintain desired space temperature and moisture content in the air stream at the various thermal communication heat exchanges.

If after-cooler circuit evaporators 333 and 334 are present they may be fed from the same cycles 2001 and 4001 that serve the pre-cooler evaporators 331 and 332, or they may be fed from alternative cycles if the combined load requirements of the pre-cooler and after-cooler cycles are too great for a single circuit to handle on its own.

If after-coolers 333, 334 are present, and a water reclaim cycle is initiated, the latent air 40 enters and is in thermal communication with the primary after-cooler evaporator 333. The air 40 is partially cooled and a portion of moisture is recovered (Q6) from the air 50. The desired temperature set point for the leaving air 50 off of the primary after-cooler evaporator is regulated by the temperature sensor T5. T5 is located in the air stream between primary after-cooler evaporator 333 and the secondary after-cooler 334.

If there is a desire to further reclaim moisture or cool the outlet air 50, the air 50 may be in thermal communication with the after-cooler evaporator 334. The air 50 can be further partially cooled and additional water recovery (Q7) can be accomplished at this heat exchange.

The cold air 60 which has now been fully after-cooled, and a portion of desired moisture has been extracted, (Q7) continues to be circulated through the cycle.

The cold air 60 continues and can be discharged to the atmosphere 10, or a portion of the cold air 60 can enter the face and bypass air cycle 600, as shown in FIG. 4.

In FIG. 4, a portion of the air 60 exits the apparatus through a discharge spill air damper 610. The balance of the regulated cold air 60 enters into a bypass duct 620. The volume or portion of the air 60 that is allowed to enter into the 620 bypass duct is limited or regulated through a bypass damper 630.

The bypass air 60 enters into a mixing air chamber 70. The air 60 is in thermal communication (Q8), with the intake air 10. The blended air 15 facilitates a decrease in heat load on the primary air 10 that enters the primary pre-cooler evaporator 331.

Liquid refrigerant assist cycles 2001 and 4001 are included within the cooling tower 102 within a first or lower section 102a of the cooling tower 102 that functions as a Cooling Distribution Unit (CDU). Those skilled in the art will recognize that the CDU within the first or lower section 102a may also be configured as a stand-alone CDU.

More particularly, via cooling water return header pump 2100, the now cooled cooling water supply from the heat load 50, representing the transfer of heat (Q₀) to the cooling water supply header 120a on the suction side of the cooling water supply header pump 2100, is in fluidic communication with the cooling water supply header pump 2100. The cooling water supply discharges from the cold water basin 350, supplying cold water to the header pump 2100. The cold process water 120b is used to facilitate heat rejection in the load system 50. The load process water return 120a is returned to the cooling tower 102 to enable heat rejection to occur. The fluid return 120a is distributed to a hot deck water basin 103, where it passes through basin water nozzles 104. The fluid return 120a drizzles down through flow distribution nozzles 104 and creates a water film on the interior chamber plastic fill or wicking material 105 where it is in thermal contact with the pre-cooled air 30 that is present in the air chamber 304.

The fluid 120a flowing over the wicking fill 105 is in thermal communication with the pre-cooled air 30, which has now been cooled by pre-cooling evaporators 331 and 332, respectively. The evaporative process takes place in the chamber 304, as illustrated in FIG. 1, by the transfer of heat (Q_RC) from the water evaporation process in contact with the fluid 120a.

Thus, the heat load (Q₀) at 50 is in thermal and fluidic communication with the evaporative recirculation cooling cycle via cooling water (or refrigerant or process fluid) supply header 120b.

The evaporative recirculation cooling cycle includes one or more circulation fans 310 and also first and second spray nozzle headers 121a and 121b that are in thermal and fluidic communication with the heat rejection chamber 304.

As explained in more detail below, due to the pressure of the water in the spray nozzle headers 121a and 121b, the water seeks a proper elevation level in the hot deck distribution pan 103, and is distributed to the spray nozzles 104. Within the second section of the cooling tower 102, an air or a mixture of air and water spray and water film is circulated across the fill wicking material 105, via the circulation fan(s) 310 as shown by the arrows, thus resulting in the transfer of heat (Q_RC) from the heat rejection load system 50 to the air stream 30 in the heat rejection chamber 304. The quantity of entering air is regulated by the fan(s) 310 and is based on enthalpy temperature control through the various stages of pre-cooling 331 and 332, and or blended return air 70 and outside air 10.

In the exemplary embodiment of FIG. 1, the liquid refrigerant assist cycles 2000 and 4000 are implemented by providing a first liquid refrigerant assist cycle 2001 and a second liquid refrigerant assist cycle 4001. The first liquid refrigerant assist cycle 2001 is dedicated to, and in fluid communication with, the first evaporation coil 331 while the second liquid refrigerant assist cycle 4001 is dedicated to, and in fluid communication with, the second evaporation coil 332. The assist cycles 2001, 4001 may also be used to serve the after-cooler evaporator circuits 333, 334.

Accordingly, the first and second evaporation coils 331 and 332 are in thermal and fluid communication with the first and second liquid refrigerant assist cycles 2001 and 4001 via first liquid refrigerant assist cycle supply headers 207, 211, 407, 411 and first liquid refrigerant assist cycle return headers 210, 212, 410, 412, respectively.

As liquid refrigerant is supplied to first evaporation coil 331, and after cooler evaporator 333 via the first liquid refrigerant assist cycle 2001, supply headers 407, and 411 the liquid refrigerant is at least partially vaporized by transfer of heat (Q4 and Q6), from the evaporation coils 331 and 333, such that at least partially vaporized refrigerant in the form of (i) a gas or (ii) a gas and liquid refrigerant mixture is returned via liquid refrigerant assist cycle return header 410, to condenser 400, in liquid refrigerant assist cycle 4001.

Within the condenser 400, heat (Q3) is transferred from the (i) gas or (ii) gas and liquid refrigerant mixture, such that condensation of the liquid refrigerant occurs within the condenser 400, and liquid refrigerant is discharged to the liquid receiver 402 via supply line 401. The liquid refrigerant receiver 402 is operated to maintain a supply of liquid refrigerant on the suction side of liquid refrigerant pump 404, which discharges liquid refrigerant into the liquid refrigerant assist cycle supply headers 407 and 411 to supply liquid refrigerant to the evaporation coils 331 and 333, respectively.

In the exemplary embodiment of FIG. 1, the second liquid refrigerant assist cycle 4001 is dedicated to, and in fluid communication with, the second pre-cooler evaporation coil 332. The assist cycles 2001, 4001 may also be used to serve the after-cooler evaporator circuit evaporator coil 334 should they be desired to do so, as illustrated in FIGS. 1 and 2.

Accordingly, the second evaporation coils 332 and 334 are in thermal and fluid communication with the first liquid refrigerant assist cycle 2001 via first liquid refrigerant assist cycle supply headers 207, 211 and first liquid refrigerant assist cycle return headers 210, 212, respectively.

As liquid refrigerant is supplied to second evaporation coil 332, and after cooler evaporator 334 via the first liquid refrigerant assist cycle supply headers 207, and 211 the liquid refrigerant is at least partially vaporized by transfer of heat (Q5 and Q7), from the secondary evaporation coils 332, 334 such that at least partially vaporized refrigerant in the form of (i) a gas or (ii) a gas and liquid refrigerant mixture is returned via liquid refrigerant assist cycle return headers 210 and 212 to the evaporator 200, serving liquid refrigerant assist cycles 2001, 4001.

Within the evaporator 200, heat (Q1), is transferred from (i) the gas or (ii) the gas and liquid refrigerant mixture such that condensation of the liquid refrigerant occurs within the evaporator 200 and liquid refrigerant is discharged via the evaporator 200 to the liquid receiver via header supply line 201 to liquid receiver 202. The liquid refrigerant receiver 202 is operated to maintain a supply of liquid refrigerant on the suction sides of liquid refrigerant pump 204, which discharges liquid refrigerant into the liquid refrigerant assist cycle supply headers 207 and 211 to supply liquid refrigerant again to the evaporation coils 332 and 334, respectively.

Flow of (i) the gas or (ii) the gas and liquid refrigerant mixture may be bypassed around the evaporator coils 331-334 by utilizing bypass valves 206 and 406. A portion of the fluid can be bypassed directly to the receivers 202 and 402 in order to maintain a stable level of liquid refrigerant ahead of the refrigerant pumps 204 and 404. The control of the valves 206 and 406 is regulated by level control sensors 202a and 402a.

The circulation or flow of a first liquid refrigerant circuit 2001, from the evaporator 200 to the evaporator coils 332 and 334 via the liquid refrigerant pump 204 and the liquid receiver 202 and back to the condenser evaporator 200 as (i) a gas or (ii) a gas and liquid refrigerant mixture, respectively, define the first liquid refrigerant loop.

The circulation or flow of the second liquid refrigerant circuit 4001, and from the condenser 400 to the evaporator coils 331 and 333, via the liquid refrigerant pumps 404 and the liquid receiver 402, and back to the condenser 400, as (i) a gas or (ii) a gas and liquid refrigerant mixture respectively define first liquid refrigerant loops.

The heat flow (Q1) is transferred within the evaporator 200 and from the condensation side represented by the input flow of (i) gas or (ii) gas and liquid refrigerant mixture in the liquid refrigerant assist cycle return headers 210, 212 to the liquid refrigerant assist cycle supply headers 207, 209 to the trim the evaporation side of the evaporator 200. The trim evaporation side is represented by the input flow to the evaporators 200 of a second liquid refrigerant flowing in second liquid refrigerant loop 5001, as shown in FIG. 2. The trim evaporation side is also represented by the second liquid refrigerant loop 5001, in which a second liquid refrigerant is circulated from the evaporators 200 to a condensers 502 such that the second refrigerant is received in liquid form from the condensers 502 via second liquid line 503, and circulated to an expansion device 504, thus enabling evaporation to occur at evaporator 200.

The fully evaporated second refrigerant gas is evaporated via a trimming method, and circulates from the evaporator 200 via the suction line 506 to a compressor 500, where the compressed gas is discharged out via line 501 and enters condenser 502. The refrigerant fully condenses and transfers its heat to the condenser water circuit 300.

The compressor 500 compresses the fully evaporated second refrigerant to a high pressure gas having a pressure range of approximately 100-115 Pa. The high pressure gas second refrigerant circulates from the discharge side of compressor 500 to the condenser side of condenser 502 via compressor discharge to condenser connection lines 501. Heat (Q5) is transferred from the condenser side of condenser 500 to water the sides of the condenser 500.

The refrigerant circuits 2001 and 4001 are fed by a circulated water cooled condensing circuit 3000 to absorb and reject the heat that is generated in the pre-cooler, after-cooler, and system load processes. The condensing circuit 3000 consists of a cold water supply, a cold water collection basin 350, a supply distribution pipe 353, a circulating pump 352, supply headers 353, 354, serving condensers 400, 502 respectively, return header 355, and connections to spray distribution headers at cooling towers 121a and 122a, as shown in FIGS. 1 and 2, or spray nozzles 1000 at fluid cooler, as shown in FIG. 3.

The cold water (approximately 65° F.) 300 that has been collected and has completed the evaporation cycle, is in thermal contact with the cold air stream 30. The cold water 300 is collected and present in the cold water basin 350. The cold water 300 is circulated out of the discharge of the cold water basin 350, via discharge line 352. The cold water 300 is circulated via cold supply water header 353. The cold water 300 enters and is in thermal contact with condenser 400.

The heat of the second refrigerant circuit 4001 is then exchanged (Q3). The warmer condenser water 300 (approximately 71° F.) exits the condenser via condenser discharge line 354. The warmer condenser water 300 enters and is in thermal contact with condenser 502. The heat of the circuit 2001 is then exchanged (Q2). The hot water (approx. 80° F.) exits condenser 502. It is circulated via return water header 355. The hot water enters the spray distribution headers 121a and 122a, where it blends with the system load return water 120a. The hot water collects in the hot deck water basins 103, and is distributed down through the flow distribution nozzles 104. The water 120a cascades down through the fill or wicking media 105 where it is in fluidic thermal contact with the cold air stream 40 in the air chamber. It is noted that the fluid cooler, as shown in FIG. 3, is a closed circuit. Therefore, the cascading water is in fluidic thermal contact with the load system heat rejection coil 105a, as shown in FIG. 3.

Additionally moisture can be re-captured from the air stream utilizing the after-cooler evaporators 333 and 334, respectively. The level of moisture elimination and additional cooling (Q6 and Q7) can be regulated by the enthalpy temperature sensors T5 and T6 located in the air stream after their respective evaporator coils 333 and 334. Since the cooling tower or fluid cooler 102 can process fresh water in advance of the cycle, or after-cool and re-claim additional moisture from the air stream, the circuit has been fitted with water collection channels 600 and 601, respectively, as shown in FIGS. 2 and 3. The channels can be used to collect the potable water and direct it to the cold water basin sump 350, or can forward it to a water collection tank or system.

By lowering the temperature at primary evaporator coil 331 by increasing the heat transfer (Q4), and further lowering the temperature below the dew point of the air flowing in the direction of arrow B at secondary evaporator coil 332, Q5, pure water can be processed from the air stream, and drips down from evaporator coil 331 and/or evaporator coil 332, and collects as potable water in water collection channels 600 and 601, as shown in FIGS. 2 and 3. The potable water can be delivered to the cold-water basin 350, or it can be redirected to an alternative water collection device or system.

The temperature of the load system water, or the cold condenser basin water, is mixed with the load system water (cooling tower), or sprayed directly at the spray water nozzles. Water nozzle headers 3200 (see FIG. 3) range from approximately 65° F. to approximately 76° F. The water in the cold water basin 350 provides suction head to spray water pump 352, which pumps spray water 352, to and through the water side of condensers 502 and 400, via cold water basin to condenser connection lines 353. The water 300 absorbs the heat (Q2 and Q3) that is rejected from the primary evaporator process and the trim circuit compressors via heat transfer within the condensers 400 and 502, respectively.

The cool water, which is generally approximately 6-7 degrees ° F. hotter at the outlet side of condenser 400 (71-72° F.) and additionally 6-7 degrees hotter at the outlet side of condenser 502 (78-79° F.), is then circulated to the system load 210 spray nozzles headers 121a and 122a (Cooling Tower) or fed directly to the spray nozzles 3200 (Fluid Cooler), see FIG. 3. The 120a water (or water 300) drizzles down the fill (or heat rejection coil) and is in thermal communication with the cold air stream 30. The water that does not evaporate is cooled and drops to the lower cold water basin 350. The condenser water 300 supply would range from about approximately 60° F. to about approximately 80° F. This is dependent on the level of pre-cooling of the atmosphere that takes place at the pre-cooler evaporators 331 and 332.

As shown in FIG. 4, the flow of the cool discharge air 60 can be controlled by the set of dampers 610, bypass 630, and intake 650. This cool or tempered air is a by-product of the after-cooler evaporation process occurring at evaporator coils 333, 334. The temperature of the air 60 is controlled by temperature sensors T4 and T5 located in the air stream immediately following the discharge of after-cooler evaporators 333 and 334, respectively. The discharge air 60 temperature is regulated from approximately 55° F. to 60° F. when used for external cycle HVAC or process cooling air.

A face and bypass duct arrangement as depicted in FIG. 5 includes modulating intake air dampers 650, spill air dampers 610, and bypass air dampers 630. This air bypass circuit 600 enables further energy savings to the cycle by pre-treating a portion of the inlet air 10 with a portion of cold discharge air 60. The air is blended at the inlet-mixing chamber 70. This air bypass facilitates a reduction in load capacity (Q7) on the primary and secondary pre-cooler evaporator circuits 331 and 332, respectively.

The electrical power that is consumed in the evaporative process to pre-treat the air, and create a false atmosphere, is less than the power that the cycle saves on the system load side. By pre-cooling the atmosphere, the cycle facilitates a reduction of total combined power of the system to approximately 30%-40%, versus the power that would have been consumed if the normal atmosphere were in contact with the load system at the heat rejection process.

Because the condenser water 120b is significantly cooled by the pre-cooling and evaporation process in the chamber 304, the refrigerant fluid of the primary circuit is able to set a very low condensing point without any mechanical compression assistance. The primary refrigerant circuit 2001 is thereby able to absorb approximately 66 percent of the latent and sensible heat loads from the entering air 10 without compression assistance. The work of this initial heat rejection cycle 2002 is performed by a minimal horsepower refrigerant pump 256 (3-5 horsepower), which requires less than 5% of the power that would have ordinarily been required by a refrigerant DX compressor.

A 66%-75% reduced DX compression circuit 4001 can handle the resultant load that remains on the inlet air stream 20. However, the actual kw/ton that the compressor 500 can operate at is significantly reduced because the system lift has been reduced by closer tolerance suction and discharge operating pressures. As a result, the entering condenser water has experienced a temperature reduction. The delta temperature span of the inlet condenser water 300 (approximately 71° F.) versus the leaving pumped refrigerant 253 (approximately 64° F.) is only approximately 7° F. This delta between the inlet hot side fluid and the outlet cold side fluid enables a low lift condition for the compressor to operate under. This allows for a kw/ton of approximately 0.20 kw/ton, which is about 25% of the normal required kw/ton of a compressor circuit operating in a “normal” high lift atmosphere.

In addition to the energy benefits, the cycle facilitates initial water capture through the air stream in thermal contact with the pre-cooler evaporator 331 and 332, respectively. The cycle may also recapture all, or a portion of the moisture that has been evaporated into the air stream 40 following the heat rejection process of the base system load 50.

The evaporative cooling system, as represented in FIG. 3, is similar to the evaporative process depicted in FIGS. 1 and 2. However, the fluid cooler circuits have a closed circuit evaporative heat rejection process versus the atmosphere cycle that is indicative of cooling towers.

The following description illustrates the differences in the fluid cooler circuits. The fluid cooler has a fluid in thermal and fluidic communication with a generalized heat load 50 via a cooling water return (or refrigerant or any other process cooling fluid) header 120a from the heat load 50 and a cooling water (or refrigerant) supply header 120b. For the purposes of illustration herein, the return header 120a and the supply header 120b are described herein as cooling water return header 120a and cooling water supply header 120b. Although, a refrigerant or any other process cooling fluid may flow through the headers 120a and 120b to transfer heat from the heat load 50.

The evaporative heat process takes place with the water 102a in thermal communication (QRC) and contact time with the fluid cooler heat rejection coil 105a. The evaporative cooling system has a fluid 102b in thermal and fluidic communication with a generalized heat load 50 via a cooling water return (or refrigerant or any other process cooling fluid) header 120a from the heat load 50 and a cooling water (or refrigerant) supply header 120b. For illustration purposes, the return header 120a and the supply header 120b are described herein as cooling water return header 120a and cooling water supply header 120b. Although, a refrigerant or any other process cooling fluid may flow through the headers 120a and 120b to transfer heat from the heat load 50. The evaporative heat process takes place with the water 120a in thermal communication and contact time with the fluid cooler internal heat rejection coil 105a.

FIG. 3 pertains to closed circuit fluid coolers which have by nature a closed circuit coil 105a to facilitate the evaporative heat absorption process versus an open cooling tower system, as depicted in FIGS. 1 and 2. The heat that is evaporated and rejected in the fluid cooler cycles occurs when the condenser water fluid is sprayed and drizzled over the heat load rejection coil, where heat from the load is rejected into the atmosphere chamber 304. The warm latent air 40 is then circulated up to the after-cooler evaporators 333, and 334, respectively, (if present) and the process is similar to the cooling tower cycles previously depicted in FIG. 2.

In summary, an evaporative cooling cycle that can efficiently produce its own water without expending additional power is presented. Also, a water production and reclaim cycle that can efficiently produce its own water and recover additional moisture that would normally escape into the atmosphere is presented. The exemplary embodiments further describe a water production and recovery cycle that can be retrofitted onto existing cooling towers and fluid coolers enabling them to become water production and recovery equipment. The exemplary embodiments of the present disclosure further describe an efficient cooling cycle that enables heat rejection apparatuses to assist in greater system efficiency gains by producing colder process water than what the environment would normally facilitate at a net savings in power use.

The exemplary embodiments of the present disclosure further describe a three-stage in series cooling and heat rejection cycle that enables the primary evaporator process to gain higher and more efficient heat rejection capabilities as a result of being in an in-series process with the secondary evaporator and the ultimate evaporative water heat rejection process. The three-stage in series cooling and heat rejection cycle enables the secondary evaporator process to gain more efficient heat rejection capabilities as a result of being in an in-series process with the primary evaporator and the ultimate evaporative heat rejection process. Moreover, the three-stage in series cooling and heat rejection cycle enables the production of colder process water because it is in series with a primary and secondary evaporator process. Additionally, the three-stage in series process cycle can be adapted to include two additional efficient stages of water recovery and cooling production.

The exemplary embodiments of the present disclosure further disclose a three-stage in-series cycle that can produce its own water, produce a false atmosphere with very little energy expended, recapture moisture form the air stream, and produce cool conditioned air. The three-stage evaporative heat rejection cycle enables a reduction in the need for outside water sources and produces good quality potable makeup water which significantly reduces water losses due to excessive blow down requirements. Moreover, the three-stage evaporative heat rejection cycle significantly reduces chemical blow-down effluents into the environment and the sewage support structure.

Persons skilled in the art will understand that the devices and methods specifically described herein and illustrated in the accompanying drawings are non-limiting exemplary embodiments. The features illustrated or described in connection with one exemplary embodiment may be combined with the features of other embodiments. Such modifications and variations are intended to be included within the scope of the present disclosure. As well, one skilled in the art will appreciate further features and advantages of the present disclosure based on the above-described embodiments. Accordingly, the present disclosure is not to be limited by what has been particularly shown and described, except as indicated by the appended claims.

It should be understood that the foregoing description is only illustrative of the present disclosure. Various alternatives and modifications can be devised by those skilled in the art without departing from the disclosure. Accordingly, the present disclosure is intended to embrace all such alternatives, modifications and variances. The embodiments described with reference to the attached drawing figs. are presented only to demonstrate certain examples of the disclosure. Other elements, steps, methods and techniques that are insubstantially different from those described above and/or in the appended claims are also intended to be within the scope of the disclosure.

Claims

1. An evaporative heat rejection cycle for cooling a heat load, comprising:

an environmental pre-cooling primary evaporator;

an environmental pre-cooling secondary evaporator;

a pre-cooled evaporative heat rejection cycle section in thermal communication with the heat load; and

a primary pre-cooling evaporative heat exchanger in thermal communication with air that is drawn into thermal communication with the primary evaporator to enable heat transfer and moisture elimination from the air to a first fluid,

wherein a portion of the first fluid evaporates and absorbs heat and condenses moisture from the air,

wherein the first fluid transports the heat to a condenser where it is in thermal communication with a second fluid that at least partially condenses the first fluid,

wherein the second fluid is circulated to a discharge pipe with atomizing spray nozzles that are in thermal communication with the air that is being pulled through a closed evaporative heat rejection chamber,

wherein the second fluid is in contact with the air and creates a film on the fill or evaporator coil to enable partial water evaporation to the atmosphere as well as cooling the remaining first fluid as it travels down through a circuit in thermal contact with the air,

wherein a portion of the cooled second fluid drops and collects at a cold water basin, and

wherein the second fluid is circulated from the cold water basin and is pumped to the condenser to repeat the cycle.

2. The heat rejection cycle according to claim 1, further comprising a secondary pre-cooling evaporative section in thermal communication with the pre-cooled air,

wherein the air is in thermal contact with the secondary pre-cooling evaporative section to enable further heat and moisture elimination to a third fluid, the third fluid being circulated to another evaporator, the third fluid being in thermal communication with a fourth fluid which evaporates the rejected heat into the fourth fluid, the fourth fluid being pulled through the suction of a compressor.

3. The heat rejection cycle according to claim 2, wherein the compressor compresses the fourth fluid and delivers it to another condenser where it is in thermal communication with the second fluid which fully condenses the fourth fluid into a liquid and wherein the fourth fluid liquid is transported through an expansion valve, wherein the fourth fluid expands and evaporates in thermal communication with the third fluid in the another evaporator.

4. The heat rejection cycle according to claim 3, wherein, the second fluid which is in thermal communication with the fourth fluid at the condenser, is circulated to the discharge pipe with the atomizing spray nozzles that are in thermal communication with the air that is being pulled through the closed evaporative heat rejection chamber.

5. The heat rejection cycle according to claim 4, wherein the second fluid is in contact with the air and creates the film on the fill or the evaporator coil to enable partial water evaporation to the atmosphere, as well as to cool remaining first fluid as it travels down through the circuit in thermal contact with the air.

6. The heat rejection cycle according to claim 5, wherein a portion of the cooled second fluid drops and collects at the cold water basin and wherein the second fluid is circulated from the cold-water basin and is pumped to the condenser to repeat the cycle.

7. The heat rejection cycle according to claim 6, wherein the atmospheric air enters the cycle at the primary pre-cooling evaporator and is either pushed or pulled through the cycle utilizing fans, wherein the air is pre-cooled, a portion of the moisture in the air is eliminated, and the air is transported to the secondary pre-cooler evaporator.

8. The heat rejection cycle according to claim 7, wherein the cool air enters the air chamber and is pushed or pulled across and up through the evaporative heat rejection chamber where it is in thermal contact with the second fluid.

9. The heat rejection cycle according to claim 8, wherein warm heated air is either rejected into the atmosphere, or warm latent air enters into the secondary after cooler evaporator.

10. A primary after-cooler evaporative heat exchanger in thermal communication with warm process heat rejection air is drawn into thermal communication with a primary after-cooler evaporator cycle, to enable heat transfer and moisture elimination from air to a first fluid, the heat exchanger enabling:

a portion of the first fluid to evaporate and absorb heat and condense moisture from the air;

the first fluid to transport heat to a condenser where it is in thermal communication with a second fluid that at least partially condenses the first fluid; and

the second fluid to be circulated to a discharge pipe with atomizing spray nozzles that are in thermal communication with the air that is being pulled through a closed evaporative heat rejection chamber.

11. The heat exchanger according to claim 10, wherein the second fluid is in contact with the air and creates a film on a fill or evaporator coil to enable partial water evaporation to the atmosphere, as well as to cool remaining first fluid as it travels down through a circuit in thermal contact with the air.

12. The heat exchanger according to claim 11, wherein a portion of the cooled second fluid drops and collects at a cold water basin and wherein the second fluid is circulated from the cold-water basin and is pumped to the condenser to repeat the cycle.

13. The heat exchanger according to claim 12, further comprising a secondary after-cooler evaporative section in thermal communication with the pre-cooled air, wherein the air is in thermal contact with the secondary pre-cooling evaporator to enable further heat and moisture elimination to a third fluid, the third fluid being circulated to another evaporator where it is in thermal communication with a fourth fluid which evaporates the rejected heat into the fourth fluid, the fourth fluid being pulled through a suction of a compressor.

14. The heat exchanger according to claim 13, wherein the compressor compresses the fourth fluid and delivers it to another condenser where it is in thermal communication with the second fluid which fully condenses the fourth fluid into a liquid.

15. The heat exchanger according to claim 14, wherein the fourth fluid liquid is transported through an expansion valve, where it expands and evaporates in thermal communication with the third fluid in the another evaporator.

16. The heat exchanger according to claim 15, wherein the second fluid, which is in thermal communication with the fourth fluid at the condenser, is circulated to the discharge pipe with the atomizing spray nozzles that are in thermal communication with the air that is being pulled through the closed evaporative heat rejection chamber and wherein the second fluid is in contact with the air and creates the film on the fill or evaporator coil to enable partial water evaporation to the atmosphere, as well as to cool the remaining first fluid as it travels down through the circuit in thermal contact with the air.

17. The heat exchanger according to claim 16, wherein the second fluid is circulated from the cold-water basin and is pumped to the condenser to repeat the cycle, and a warm heat rejection air enters the cycle at the primary pre-cooling evaporator where it is either pushed or pulled through the cycle by utilizing fans.

18. The heat exchanger according to claim 17, wherein the air is pre-cooled, a portion of the moisture in the air is eliminated, and the air is then transported to the secondary pre-cooler evaporator, and

wherein the cool air enters an air chamber and is pushed or pulled across and up through the evaporative heat rejection chamber where it is in thermal contact with the second fluid.

19. The heat exchanger according to claim 18, wherein the warm heated air enters into the primary after-cooler evaporator where the air is after-cooled and a portion of the moisture is eliminated.

20. The heat exchanger according to claim 19, wherein the air enters the secondary after-cooler evaporator where the air is further cooled and additional moisture is eliminated, and

wherein the cooler dry air is discharged into the atmosphere or is distributed as conditioned air.