FLOATING SUB-FLOORING SYSTEM
A floating sub-floor system includes panel assemblies in which each panel assembly includes a surface panel and a base panel. A bottom side of the base panel includes a vent channel system which provides passageways for moisture to evaporate and/or flow under the sub-floor. The surface panel and the base panel are coupled together so that complementary ship lap and overlap joints are formed along the sides of each panel assembly. Methods of fabrication and installation are disclosed.
The present application claims the benefit of:
U.S. Provisional Patent Application Ser. No. 61/839,010, Attorney's Docket No. 4440.2.1p, entitled FLOATING SUB-FLOORING SYSTEM, which was filed on Jun. 25, 2013.
The foregoing is incorporated by reference as though set forth herein in its entirety.
TECHNICAL FIELDThe present disclosure relates to sub-flooring apparatus, systems, and methods of fabrication and use. More specifically, the present disclosure relates to a sub-flooring system that can be installed directly over concrete, wood, or other substrates used in the building construction industry for newly constructed or renovated facilities. The present embodiments may be installed as a floating floor system that can meet the rigorous requirements of heavy commercial applications for foot traffic and sound abatement, as well as providing the warmth, comfort and dryness aspects for use in residential applications.
BACKGROUNDThis present embodiments relate to the use of sub-floor systems installed over substrates in today's building construction industry. Whether the building is a single family home, multi-residential high rise, office building, commercial enterprise, hotel, restaurant or institutional facility, issues of moisture, mold and mildew, sound transmission, and fire resistance are all of concern. In many circumstances, developers and architects are being forced to address and/or mitigate these issue in their building designs.
A substrate is the underlying support surface upon which a sub-floor is installed. In building construction, the substrate is commonly poured concrete or wood based materials adhered to a wood frame structure. Concrete substrates are often not smooth enough to provide a good surface upon which to install finished flooring, and generally cannot meet moisture, sound or mold mitigation requirements set by the architects, designers, or building codes. Also, many wood substrates may not be thick enough, smooth enough, or strong enough to support the finished floor and cannot meet moisture, sound or mold mitigation requirements.
A sub-floor is the underlying surface upon which a finished floor is installed. There are many different types of sub-floors used in the construction industry today; the specific type of sub-floor used may depend on the type of building construction, the geographical location, the finished flooring surface(s) to be installed, and the building code requirements.
In many applications, installing the sub-floor can be a difficult, labor intensive and costly operation. Most sub-floor manufacturers recommend their products be adhered to the substrate. In commercial applications, manufacturers may not warrant the floor system if the sub-floor has not been adhered to the substrate. Current sub-floors may be adhered to the substrate with bolts, or embedded in a layer of mortar, or glued down to ensure the sub-floor has conformed to the rough surface substrate.
Adhering a sub-floor to the underlying substrate may create a number of short and long term failure points in the life cycle of the finished floor installed over the sub-floor. For example, using anchoring bolts to adhere the sub-floor to a concrete substrate creates an ingress point for moisture to flow up through the substrate to the sub-floor. Adhering the sub-floor to a wood substrate with mortar introduces moisture to the wood and over time may cause the wood to distort. Adhering the subfloor to a wood or concrete substrate with adhesives or mortars dramatically increases the cost of floor removal and replacement installation in renovation or insurance claim projects. Removing glues or mortars from the substrate requires special equipment to chip or grind away the material, as well using solvents to clean the material from the rough surface substrate. Removal of the sub-floor in many cases causes significant damage to the substrate, which then has to be repaired or replaced. Finished floor failure is a significant problem within the building construction industry. These failures range from tile and/or grout failures to floors heaving, to buckling of carpets or laminated woods. All of these failures, over time, may create safety issues or trip hazards.
Floor system failures can also create health issues in the building as a direct result of moisture being trapped between the substrate and the sub-floor or between the sub-floor and the finished floor. These failures may actually create an environment for moisture to sponge up the interior walls of the building and allow mold to grow. Exposure to mold can cause cold-like symptoms, respiratory problems, nasal and sinus congestion, watery eyes, sore throat, coughing and skin irritations, and can trigger asthma attacks. Because some mold spores are very small and can easily be breathed deeply into the lungs, it may not be safe to live or work where there are high mold spore levels. Exposure to high mold spore levels can cause development of an allergy to mold. People can react to mold whether it is living or dead.
Rarely are the requirements of a sub-floor met with just one product. In many instances, specifications require the installation of multiple layers of different materials to meet the ever increasing demands of home owners, tenants, building codes, as well as developers, architects and designers. Typical sub-floor requirements include the following:
- 1. Moisture Barrier Used to prevent moisture being absorbed into finished floors, particularly wood products and carpets.
- 2. Anti-Microbial Protection Protection from growth of harmful mold, mildew, and other bacteria as a result of moisture issues.
- 3. Insulation Provide warmth to the finished surface.
- 4. Acoustical Prevent sound transmission between floors.
- 5. Anti-Fracture Protects against cracks in the structural floor from transferring to the finished floor's surface.
- 6. Ergonomics Provides a comfortable surface to walk upon, reducing fatigue, foot pain, and even back pain.
- 7. De-Coupling Easily removable for future renovation or remodelling plans.
- 8. Thickness Material must be low profile such that the overall thickness of the completed sub-floor and finished floor does not create issues with wall trims, door heights, appliances, and the like.
- 9. Environmental Provide green/environmentally friendly products.
It would be an advancement in the art to provide flooring that satisfies the requirements listed above. Further, it would be an advancement in the art to provide such flooring that is usable in various applications, such as in residential, commercial, and/or industrial settings. Further, it would be an advancement in the art to provide such flooring that is inexpensive and easy to produce. Yet further, it would be an advancement in the art to provide such flooring that is low-maintenance and relatively easy to reconfigure or replace.
SUMMARYThe present technology has been designed as a floating sub-floor system that is not adhered to the substrate and can be easily removed for renovation or replacement projects. When the sub-floor system is installed as described below, it creates a monolithic surface that is dimensionally stable and is decoupled from the substrate so that any changes or failures in the substrate will not transfer onto the finished floor material. The technology disclosed herein addresses all of the above sub-floor requirements in a single, low-profile, easy-to-install floating sub-floor system. The technology disclosed herein also provides insect resistance, combustion resistance, and low- to no-VOCs (volatile organic compounds).
Various embodiments of the technology include a sub-floor surface material that is impervious to mold, mildew, moisture, and insects but has sufficient porosity to allow adhesives, tile mortars and other fastening devices to bond with the surface material regardless of the finished flooring being installed over the surface material. Additional requirements of the technology may include insulating value, ergonomic comfort, fire resistance and dimensional stability properties that meet both residential and heavy commercial buildings sub-floor applications and codes.
A sub-floor base material may be added to the surface material. The base material may be impervious to mold, mildew, moisture, and insects yet have sufficient flexibility to conform to minor variations in the substrate it covers. The base material may have air flow channels, otherwise referred to as a duct system, on the underside of the base material that allows for any moisture that ingresses through the substrate or has accumulated on the surface of the substrate to evaporate or flow to a drainage system.
Exemplary embodiments of the technology will become more fully apparent from the following description and appended claims, taken in conjunction with the accompanying drawings. Understanding that these drawings depict only exemplary embodiments and are, therefore, not to be considered limiting of the scope of the technology, the exemplary embodiments will be described with additional specificity and detail through use of the accompanying drawings in which:
Exemplary embodiments of the technology will be best understood by reference to the drawings, wherein like parts are designated by like numerals throughout. It will be readily understood that the components of the technology, as generally described and illustrated in the figures herein, could be arranged and designed in a wide variety of different configurations. Thus, the following more detailed description of the embodiments of the apparatus, system, and method, as represented in
The phrases “connected to,” “coupled to” and “in communication with” refer to any form of interaction between two or more entities, including mechanical, electrical, magnetic, electromagnetic, fluid, and thermal interaction. Two components may be functionally coupled to each other even though they are not in direct contact with each other. The term “abutting” refers to items that are in direct physical contact with each other, although the items may not necessarily be attached together. The phrase “fluid communication” refers to two features that are connected such that a fluid within one feature is able to pass into the other feature.
The word “exemplary” is used herein to mean “serving as an example, instance, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments. While the various aspects of the embodiments are presented in drawings, the drawings are not necessarily drawn to scale unless specifically indicated.
The word “floating” is used herein to mean a floor or a sub-floor that is not coupled to an underlying layer, such as a substrate, for example by nailing or gluing the floor or sub-floor to the underlying layer. A “floating” floor or sub-floor may include individual elements that are coupled to each other, and may be said to “float” on the underlying layer.
The present embodiments have been specified to create a two layered floating sub-floor system that is a thermal barrier, vapour barrier, moisture barrier, sound barrier, and an overall sub-floor system that is decoupled from the underlying substrate preventing failures or changes in the substrate from transferring to the finished floor installed on the subfloor.
Furthermore, the present embodiments have been designed such that any finished flooring surface can be installed directly on the subfloor without additional layers of materials having to be used to meet the specifications or building code requirements.
One of the features of the present embodiments is that these embodiments may meet the specifications or building code requirements for use over concrete, wood based, or other types of substrates in commercial buildings, institutional facilities, hotels, restaurants, high or mid-rise multi-residential buildings, or single family homes.
Referring to
Referring to
Referring to
The vent channel system 200 includes an arrangement of support pads 202 separated by vent channels 204.
In some embodiments, care should be taken to ensure that the overall size, thickness and design pattern of the support pads and the vent channel system is correct to optimize ventilation, strength, and stiffness of the sub-floor system.
Any of the vent channel systems 200, 400, 500, 600, 700 may be varied by rounding corners of the support pads and/or vent channels (both in the plane shown and perpendicular to the page), using other polygonal, curved, or irregular shapes for the support pads, using multiple support pad shapes in a pattern, altering dimensions of the support pads and/or vent channels, rotating or mirroring the patterns, and the like. These variations may change the ratio of the combined area of the support pads to the total area to be less than 50%, between 50% and 60%, or greater than 60% of the total area of the bottom side of the base panel. For example, variations are contemplated in which the combined area of the support pads is 60% to 70% of the total area of the bottom side of the base panel. These variations may also change the vertical and/or horizontal vent channel length(s). For example, the embodiment of
Referring to
The widths 14, 24 of the surface panel 10 and base panel 20 are assembled together in an offset manner such that the top side 21 of the base panel 20 overhangs, or protrudes out from, the surface panel 10 along the full length 12 of the surface panel 10 along the edge 142. This type of offset is referred to as a ship lap joint 27 as shown in
The lengths 12, 22 of the surface panel 10 and base panel 20 are also assembled together in an offset manner such that a ship lap joint 29 is created across the width 14 along the edge 141 of the surface panel 10 as shown in
A method of assembling the sub-floor panel assembly 30 may include the steps of coupling the surface panel 10 to the base panel 20 so that the bottom side 13 of the surface panel 10 faces the top side 21 of the base panel 20, the length 12 of the surface panel 10 is parallel to the length 22 of the base panel 20, and the width 14 of the surface panel 10 is parallel to the width 24 of the base panel 20. Coupling the surface panel 10 to the base panel 20 may include adhering the bottom side 13 of the surface panel 10 to the top side 21 of the base panel 20. Adhering the bottom side 13 to the top side 21 may include applying an adhesive to one or both of the bottom side 13 and the top side 21. The surface panel 10 may be offset relative to the base panel 20 along their mutual length, width, or both, to form ship lap and/or overlap joints.
Referring to
The fixture 80 includes a base panel length stop 82, a base panel width stop 84, a surface panel length stop 86, and a surface panel width stop 88. The example shown in
The base panel length stop 82 and base panel width stop 84 may be any height; preferably, the base panel length stop 82 and base panel width stop 84 are between 0.1 in. and 1 in. in height. The base panel length limit 90 and base panel width limit 92 may be any height less than or equal to 0.25 in; preferably, the base panel length limit 90 and base panel width limit 92 are between 0.1 in. and 0.25 in. in height. In the example of
Referring to
The surface panel 10 is then placed over the base panel 20 shifted or urged opposite to the first direction 112 against the surface panel length stop 86, and opposite to the second direction 114 against the surface panel width stop 88 ensuring the panel is squarely against the edges of the fixture. Hand pressure is used to temporarily adhere the two panels 10, 20 so the panel assembly 30 can be moved to a pressure roll machine. The assembled sub-floor panel assembly 30 is run through a pressure roller which has sufficient pressure to activate the adhesive as recommended by the adhesive manufacturer so as to permanently bond the two panels 10, 20 together.
Referring to
- a) The surface of the substrate 120 should be clean of any debris or accumulated dust.
- b) The substrate 120 should be level. Where there is any apparent unevenness in the substrate of more than 0.25 in., a floor levelling compound (not shown) may be used to fill in these areas. Allow sufficient time for the compound to cure.
- c) Run chalk lines. Measure 16.75 in. out from the opposite end of the existing wall where the first row of the sub-floor system will be installed length wise and snap a chalk line. Measure 16.75 in. out from one end of the existing wall where the first row of the sub-floor system will be installed width wise. Measure 16.75 in. out from the opposite end of the wall where the sub-floor system will be installed width wise and snap a chalk line.
- d) Starting where the first row of the sub-floor system will be installed length wise, place the first full length panel 30 lengthwise with the ship lap joint 27 along the chalk line as shown in
FIG. 5A . - e) Place a 0.1875 in. diameter bead of urethane based adhesive 130 across the end (width) of the first panels' ship lap joint 29 as shown in
FIG. 5B , place the second finished sub-floor panels' overlap joint 19 (width) over the adhesive 130 on the end of the first panel 30 as shown inFIG. 5B and press down firmly ensuring that the seams of the surface panels are butted against each other and that the length of the second panels' ship lap joint 27 is squarely along the chalk line. Note: Any gaps between the end seams of the sub-floor panels 30 is usually caused by the existing walls 122, 124 being out of square or where the ship lap joint 27 of the sub-floor panel 30 has not been place squarely along the chalk line. If the ship lap joint 27 of the sub-floor panel 30 has been placed squarely along the chalk line and a gap between the seams is still present, then these gaps can be filled in with a standard bonding material. - f) Repeat step e) until all the finished sub-floor panels 30 are installed in the first row. Cut the last panel 30 in the first row approximately ¼″ short of the end wall (not shown) for ease of fitting in the remaining space.
- g) To achieve the recommended brick pattern,
FIG. 5D , start the second row of finished sub-floor panels 30 with a panel cut to a length between 12″ and less than a full size panel. In most cases the last panel 30 from the previous row will be the starting panel for the next row provided it is a minimum of 12″ in length. - h) Starting with the second row of sub-floor system panels to be installed, place a 0.1875 in. bead of adhesive 132 along the ship lap joint 27 of the first panel 30 in the first row of sub-floor system panels installed and place the overlap joint 17 of the cut panel of the second row over the adhesive 132 and place the overlap joint width 19 of the cut panel along the second chalk line measured in step c.
- i) Run a 0.1875 in. diameter bead of adhesive 134 along the exposed ship lap joint 27 lengths of each of the first row of panels installed. Run a 0.1875 in. bead of adhesive along the width of the cut panel in the second row, place the corresponding overlap joints 19 of the next full size panel over the adhesive and press down firmly.
- j) Repeat step i) until all sub-floor system panels 30 are installed in the second row. It may be necessary to cut the last sub-floor system panel 30 in the second row to fit the remaining space. Cut the last panel in the second row approximately ¼″ short of the end wall for ease of fitting in the remaining space. The remaining piece of sub-floor system panel can be used in subsequent rows provided it is more than 12″ in length.
- k) Alternate each subsequent row between using a full size sub-floor system panel 30 and a cut sub-floor system panel ensuring that cut panels are a minimum of 12 in. in length to start the row and the seams of the row being installed do not align with the width seams of the previous row. This will achieve the desired brick pattern as illustrated in
FIG. 5D . - l) Installing tile over the sub-floor system requires the use of poly-modified mortars and grouts. The sub-floor system should be clear of any debris or accumulated dust. Use a damp cloth or mop to remove any dust from the sub-floor system.
- m) Carpet tack strips should be adhered to the sub-floor system using both the urethane adhesive used to install the sub-floor system and the nails recommended by the tack strip manufacturer. Apply the adhesive to the back of the tack strip and set in the recommended position by the tack strip or carpet manufacturer. Use the recommended nails to secure the tack strip permanently in place.
- n) Engineered woods and laminated click flooring can easily be installed over the sub-floor system. It is recommended to use the suggested foam pad recommended by the engineered wood or laminated click flooring manufacturers to ensure the installation meets their warranty requirements.
- o) Glued down natural hardwood floors can be installed over the sub-floor system. Use only adhesives recommended by the hardwood floor manufacturers. If nailed down hardwood is desired it may be necessary to add an additional layer of plywood or oriented strand board over the sub-floor system depending on the substrate over which the sub-floor system has been installed.
- p) Vinyl plank floors and vinyl tile floors can be installed over the sub-floor system. Install as per manufacturers suggested installation method. It is not recommended to install thin sheet vinyl over the sub-floor system, unless all seams have been filled in with a filling compound and sanded smooth. Failure to fill the seams and sand smooth will cause the seams to appear in the thin sheet vinyl over time.
Any methods disclosed herein comprise one or more steps or actions for performing the described method. The method steps and/or actions may be interchanged with one another. In other words, unless a specific order of steps or actions is required for proper operation of the embodiment, the order and/or use of specific steps and/or actions may be modified.
Reference throughout this specification to “an embodiment” or “the embodiment” means that a particular feature, structure or characteristic described in connection with that embodiment is included in at least one embodiment. Thus, the quoted phrases, or variations thereof, as recited throughout this specification are not necessarily all referring to the same embodiment.
Similarly, it should be appreciated that in the above description of embodiments, various features are sometimes grouped together in a single embodiment, figure, or description thereof for the purpose of streamlining the disclosure. This method of disclosure, however, is not to be interpreted as reflecting an intention that any claim require more features than those expressly recited in that claim. Rather, as the following claims reflect, inventive aspects lie in a combination of fewer than all features of any single foregoing disclosed embodiment. Thus, the claims following this Detailed Description are hereby expressly incorporated into this Detailed Description, with each claim standing on its own as a separate embodiment. This disclosure includes all permutations of the independent claims with their dependent claims.
Recitation in the claims of the term “first” with respect to a feature or element does not necessarily imply the existence of a second or additional such feature or element. Elements recited in means-plus-function format are intended to be construed in accordance with 35 U.S.C. §112 Para. 6. It will be apparent to those having skill in the art that changes may be made to the details of the above-described embodiments without departing from the underlying principles of the technology.
While specific embodiments and applications of the present technology have been illustrated and described, it is to be understood that the technology is not limited to the precise configuration and components disclosed herein. Various modifications, changes, and variations which will be apparent to those skilled in the art may be made in the arrangement, operation, and details of the methods and systems of the present technology disclosed herein without departing from the spirit and scope of the technology.
Claims
1. A sub-floor system, comprising:
- a surface panel having a top side and a bottom side opposite the top side; and
- a base panel having a top side and a bottom side opposite the top side;
- wherein the top side of the base panel is coupled to the bottom side of the surface panel, wherein the bottom side of the base panel comprises an arrangement of support pads separated by vent channels, wherein each vent channel encounters at least one three-way intersection with other vent channels.
2. The sub-floor system of claim 1, wherein the surface panel comprises a material selected from the group consisting of wood, plastic, rubber, magnesium oxide, magnesium phosphate, and combinations thereof.
3. The sub-floor system of claim 1, wherein the base panel comprises a material selected from the group consisting of new high density polyethylene plastic, recycled high density polyethylene plastic, virgin rubber, recycled rubber, and combinations thereof.
4. The sub-floor system of claim 1, wherein the surface panel and the base panel are the same polygonal shape.
5. The sub-floor system of claim 1, wherein the support pads are arranged in a herringbone pattern.
6. The sub-floor system of claim 1, wherein the combined area of the support pads is greater than or equal to 50% of the total area of the bottom side of the base panel.
7. The sub-floor system of claim 1, wherein every path along the vent channels includes at least one bend per a distance increment, wherein the distance increment is less than or equal to 4.25 in.
8. A sub-floor system, comprising:
- a surface panel having a top side and a bottom side opposite the top side; and
- a base panel having a top side and a bottom side opposite the top side;
- wherein the top side of the base panel is coupled to the bottom side of the surface panel, wherein the bottom side of the base panel comprises an arrangement of support pads separated by vent channels, wherein straight line travel along each vent channel is blocked by at least one support pad.
9. The sub-floor system of claim 8, wherein the surface panel comprises a material selected from the group consisting of wood, plastic, rubber, magnesium oxide, magnesium phosphate, and combinations thereof.
10. The sub-floor system of claim 8, wherein the base panel comprises a material selected from the group consisting of new high density polyethylene plastic, recycled high density polyethylene plastic, virgin rubber, recycled rubber, and combinations thereof.
11. The sub-floor system of claim 8, wherein the surface panel and the base panel are the same polygonal shape.
12. The sub-floor system of claim 8, wherein the support pads are arranged in a herringbone pattern.
13. The sub-floor system of claim 8, wherein the combined area of the support pads is greater than or equal to 50% of the total area of the bottom side of the base panel.
14. The sub-floor system of claim 8, wherein straight line travel along each vent channel is blocked by at least one support pad per a distance increment, wherein the distance increment is less than or equal to 4.25 in.
15. A method of manufacturing a panel assembly of a sub-floor system, comprising:
- positioning a surface panel relative to a base panel so that: the surface panel overhangs the base panel along a first edge of the surface panel to form a first overlap joint, the surface panel overhangs the base panel along a second edge of the surface panel to form a second overlap joint, and the base panel overhangs the surface panel along a third edge of the surface panel to form a first shiplap joint, wherein the first edge of the surface panel is adjacent to the second edge of the surface panel, wherein the third edge of the surface panel is adjacent to an edge of the surface panel selected from the group consisting of the first edge of the surface panel and the second edge of the surface panel; and
- coupling the surface panel to the base panel to permanently maintain the first overlap joint, the second overlap joint, and the first shiplap joint;
- wherein the bottom side of the base panel comprises an arrangement of support pads separated by vent channels, wherein straight line travel along each vent channel is blocked by at least one support pad.
16. The method of claim 15, wherein the base panel overhangs the surface panel along a fourth edge of the surface panel to form a second shiplap joint, wherein the fourth edge of the surface panel is adjacent to the third edge of the surface panel.
17. The method of claim 15, wherein the surface panel overhangs the base panel along the first edge of the surface panel, the surface panel overhangs the base panel along a second edge of the surface panel, and the base panel overhangs the surface panel along a third edge of the surface panel by a distance which is greater than or equal to 0.75 in.
18. The method of claim 15, comprising fabricating the surface panel from a material selected from the group consisting of wood, plastic, rubber, magnesium oxide, magnesium phosphate, and combinations thereof.
19. The method of claim 15, comprising fabricating the base panel from a material selected from the group consisting of new high density polyethylene plastic, recycled high density polyethylene plastic, virgin rubber, recycled rubber, and combinations thereof.
20. The method of claim 15, comprising fabricating the base panel by a process selected from the group consisting of molding, extruding, and machining.
Type: Application
Filed: Jun 25, 2014
Publication Date: Dec 25, 2014
Applicant: B-JET Products Inc. (Freelton)
Inventor: Robert Plummer (FREELTON)
Application Number: 14/315,076
International Classification: E04F 15/02 (20060101);