METHOD OF AND AN APPARATUS FOR MAINTAINING CONSTANT PHONE SKIN TEMPERATURE WITH A THERMOELECTRIC COOLER AND INCREASING ALLOWABLE POWER/PERFORMANCE LIMIT FOR DIE IN A MOBILE SEGMENT
A method, an apparatus, and a computer program product for wireless communication are provided. The apparatus determines whether a skin temperature at a skin portion of a mobile device is greater than a threshold temperature. The apparatus provides power to a thermoelectric cooler (TEC) to cool a first side of the TEC while heating a second side of the TEC if the skin temperature is greater than the threshold temperature, wherein the first side of the TEC contacts the skin portion to cool the skin portion and the second side of the TEC faces a core of the mobile device.
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1. Field
The present disclosure relates generally to a mobile device, and more particularly, to optimizing performance and user experience of the mobile device.
2. Background
Devices such as mobile devices and computing devices have components that generate heat. Mobile device components generally generate more heat as the components perform at a higher level. Heat removal is often necessary to ensure optimal user experience with a device. Further, if a user directly contacts the device, then a device portion contacted should be maintained within a certain temperature range to optimize the user's experience with the device. For example, if heat from the device causes the device to become hot, a user that is in contact with the device may find the high temperature in the device unpleasant. Manufacturers design devices to efficiently remove the heat from mobile devices without significantly reducing performance of the mobile devices. Therefore, an approach to maintain a desired temperature while optimizing the performance of the device is desired.
SUMMARYIn an aspect of the disclosure, a method, a computer program product, and an apparatus are provided. The apparatus may determine whether a skin temperature at a skin portion of a mobile device is greater than a threshold temperature. The apparatus may provide power to a thermoelectric cooler (TEC) to cool a first side of the TEC while heating a second side of the TEC if the skin temperature is greater than the threshold temperature, wherein the first side of the TEC contacts the skin portion to cool the skin portion and the second side of the TEC faces a core of the mobile device. The skin temperature may be determined based on at least one of a die temperature, a power management integrated circuit (PMIC) power output, or a PMIC temperature.
The apparatus may further generate power via a temperature difference between the first side and the second side of the TEC if the determined skin temperature is equal to or less than the threshold temperature. The generated power may be stored in a battery of the mobile device or is provided directly to components of the mobile device.
The apparatus may further refrain from providing power to the TEC when the skin temperature is determined to be equal to or less than the threshold temperature.
The second side of the TEC may contact a thermal solution to cool heat generated from the second side of the TEC. The thermal solution may comprise at least one of a copper heat spreader, an aluminum heat spreader, a carbon heat spreader, or phase change material (PCM). The skin portion of the mobile device at which the skin temperature is measured may be at a display side of the mobile device. Alternatively, the skin portion of the mobile device at which the skin temperature is measured may be at a non-display side of the mobile device.
The apparatus may further determine whether a second skin temperature at a second skin portion of the mobile device is greater than the threshold temperature. The apparatus may further provide power to a second TEC to cool a first side of the second TEC while heating a second side of the second TEC if the second skin temperature is greater than the threshold temperature, wherein the first side of the second TEC contacts the second skin portion to cool the second skin portion and the second side of the second TEC faces the core of the mobile device.
The apparatus may further generate power via a temperature difference between a first side of a second TEC and a second side of the second TEC, the second TEC being located at an opposing side from the TEC within the apparatus. The first side of the second TEC may contact a second skin portion of the mobile device and the second side of the second TEC faces the core of the mobile device. Alternatively, the first side of the second TEC may face the core of the mobile device and the second side of the second TEC may contact a second skin portion of the mobile device. At least one of the first side and the second side of the second TEC may contact a thermal solution.
The detailed description set forth below in connection with the appended drawings is intended as a description of various configurations and is not intended to represent the only configurations in which the concepts described herein may be practiced. The detailed description includes specific details for the purpose of providing a thorough understanding of various concepts. However, it will be apparent to those skilled in the art that these concepts may be practiced without these specific details. In some instances, well known structures and components are shown in block diagram form in order to avoid obscuring such concepts.
Several aspects of the present disclosure will now be presented with reference to various apparatus and methods. These apparatus and methods will be described in the following detailed description and illustrated in the accompanying drawings by various blocks, modules, components, circuits, steps, processes, algorithms, etc. (collectively referred to as “elements”). These elements may be implemented using electronic hardware, computer software, or any combination thereof Whether such elements are implemented as hardware or software depends upon the particular application and design constraints imposed on the overall system.
By way of example, an element, or any portion of an element, or any combination of elements may be implemented with a “processing system” that includes one or more processors. Examples of processors include microprocessors, microcontrollers, digital signal processors (DSPs), field programmable gate arrays (FPGAs), programmable logic devices (PLDs), state machines, gated logic, discrete hardware circuits, and other suitable hardware configured to perform the various functionality described throughout this disclosure. One or more processors in the processing system may execute software. Software shall be construed broadly to mean instructions, instruction sets, code, code segments, program code, programs, subprograms, software modules, applications, software applications, software packages, routines, subroutines, objects, executables, threads of execution, procedures, functions, etc., whether referred to as software, firmware, middleware, microcode, hardware description language, or otherwise.
Accordingly, in one or more exemplary embodiments, the functions described may be implemented in hardware, software, firmware, or any combination thereof. If implemented in software, the functions may be stored on or encoded as one or more instructions or code on a computer-readable medium. Computer-readable media includes computer storage media. Storage media may be any available media that can be accessed by a computer. By way of example, and not limitation, such computer-readable media can comprise a random-access memory (RAM), a read-only memory (ROM), an electrically erasable programmable ROM (EEPROM), compact disk ROM (CD-ROM) or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer. Disk and disc, as used herein, includes CD, laser disc, optical disc, digital versatile disc (DVD), and floppy disk where disks usually reproduce data magnetically, while discs reproduce data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.
The inside portion 240 includes a printed circuit board (PCB) 242 having one or more electrical components located thereon. A die or a processor 244 to perform tasks of the mobile device 100 is located on the PCB 242. Communication components such as a wireless communication device (WCD) 246, a wireless modem 248, and a radio transceiver 250 may be located on the PCB 242. The wireless communication device 246 may be used to communicate with a core network of a cellular network. The wireless modem 248 may be used for local area network communication. Storage-related components such as an embedded multimedia card (EMMC) 252, micro subscriber identification module (micro-SIM) card connector 254, and micro secure digital (micro-SD) card connecter 256 may be located on the PCB 242. PCB 242 may include one or more power management integrated circuits (PMIC) 258, 260 to manage power to various components of the mobile device 100, and one or more power amplifiers 262, 264, 266 located thereon. An audio codec chip 268 may be located on the PCB 242. A first die thermal interface material portion (TIM-I) 270 may be provided on the die 244 and a second die thermal interface material portion (TIM-II) 272 may be provided on the TIM-I 270 and may contact the heat spreader 222. Other thermal interface material portions (TIM) 274, 276, 278 may be implemented on and around the electrical components located on the PCB 242. It is noted that the layout of the PCB components illustrated in
In a mobile device (e.g., the mobile device 100) heat within the mobile device may be removed via conduction inside the mobile device and via natural convection and radiation on the surface of a skin of the mobile device. In the present disclosure, the mobile device skin may be the portion of the mobile device 100 that faces an exterior of the mobile device, such as the touch screen display 212 and the back cover 232. For example, heat from the mobile device components (e.g., the die 244) in the inside portion 240 of the mobile device 100 may be conducted within the mobile device 100. The heat may reach the device skin through conduction. The heat may then be removed through natural convection and radiation on the surface of the device skin. Inside the mobile device 100, there is little space that can be utilized to remove the heat from the die 244. Thus, heat generated from the die 244 is removed mainly through the device skin. As the die power consumption increases, the die 244 generates heat that causes an increase in the die temperature. The device skin temperature increases as well due to the heat from the die 244. The increased die temperature may cause the device skin temperature to exceed a maximum allowable device skin temperature for human interaction (e.g., approximately 40˜45° C.). The increased die temperature may also generate a hot spot on a portion of a mobile device surface corresponding to a location of the die, where the hot spot on the mobile device surface is hotter than the rest of the mobile device surface. Notably, a maximum allowable temperature limit for a die 244 to maintain reliability generally ranges from 105˜125° C., which is much higher than the maximum allowable device skin temperature.
Conventionally, temperature mitigation is used to maintain the device skin temperature below the maximum allowable device skin temperature. For example, the device skin temperature is maintained below the maximum allowable device skin temperature of 45° C. when the die temperature reaches approximately 70˜85° C. Temperature mitigation refers to reducing the power and performance at the die to reduce the die temperature, thereby reducing the skin temperature. Because the die temperature above 70˜85° C. causes the skin temperature to rise above the allowable temperature of 45° C., the temperature mitigation ensures that the die temperature does not exceed 70˜85° C. In a mobile device, a maximum allowable skin temperature (e.g., 40˜45° C.) is the critical temperature that limits the die temperature to a certain mitigation temperature level (e.g., 70˜85° C.). For example, conventional mobile phones may be configured such that the die temperature of a most intensive central processing unit/graphics processing unit (CPU/GPU) is approximately 70˜85° C., with the skin temperature of 45° C. However, higher die performance can be achieved if the die temperature is allowed to reach a higher temperature since the die generates more heat as the die provides higher performance at higher power. For example, higher die performance can be achieved if the die temperature is allowed to reach 105˜125° C., compared to the die performance at 70˜85° C., assuming that the same components (e.g., the same thermal solution) are used for the die. In a conventional mobile phone, the skin temperature reaches the allowable skin temperature of (e.g., 40˜45° C.) before the die temperature reaches its allowable limit of 105˜125° C. Thus, when temperature mitigation with respect to the skin temperature is implemented, the die temperature is not allowed to reach the maximum allowable limit of 105˜125° C. to maintain the allowable skin temperature of 45° C. or below, and therefore die performance is limited by a mobile device skin temperature and the hot spot on the mobile device surface.
For at least the reasons discussed supra, an effective approach to maintain a suitable mobile device skin temperature with improved die performance is desired to achieve an optimal mobile device experience.
In particular, a TEC 310 utilizing the Peltier effect includes an N-semiconductor 312 and a P-semiconductor 314. The TEC 310 also includes a P-N junction conductor 316 contacting a first side of the N-semiconductor 312 and a first side of the P-semiconductor 314 that are in a first junction 318. In the TEC 310, a second side of the N-semiconductor 312 contacts an N-side junction conductor 320 and a second side of the P-semiconductor 314 contacts a P-side junction conductor 322, where the N-side junction conductor 320 and the P-side junction conductor 322 are in a second junction 324. For the TEC 310 utilizing the Peltier effect, a voltage source 326 is connected to the N-side junction conductor 320 and a ground 328 is connected to the P-side junction conductor 322. When the voltage source 326 supplies an input voltage (Vin) to the TEC 310, the input voltage (Vin) causes electrons to flow from the P-semiconductor 314 to the N-semiconductor 312 through the P-N junction conductor 316, as shown by arrow 330. With the electrons flowing in the direction of the arrow 330, heat from a cooling side 332 and the first junction 318 is transferred to the second junction 324 and a heating side 334, thereby cooling the cooling side 332 and heating the heating side 334. In summary, the TEC 310 utilizing the Peltier effect cools the cooling side 332 and heats the heating side 334 when the input voltage (Vin) is supplied by the voltage source 326.
In particular, the TEC 410 utilizing the Seebeck effect includes an N-semiconductor 412 and a P-semiconductor 414. The TEC 410 further includes a P-N junction conductor 416 that contacts a first side of the N-semiconductor 412 and a first side of the P-semiconductor 414 that are in a first junction 418. In the TEC 410, a second side of the N-semiconductor 412 contacts an N-side junction conductor 420 and a second side of the P-semiconductor contacts a P-side junction conductor 422, where the N-side junction conductor 420 and the P-side junction conductor 422 are in the second junction 424. When using the Seebeck effect, a power output destination 426 is connected to the N-side junction conductor 420 and the P-side junction conductor 422. When a heat input side 430 of the TEC 410 is hotter than a heat removal side 432 of the TEC 410, the temperature difference between the heat input side 430 and the heat removal side 432 causes electrons to flow from the P-semiconductor 414 to the N-semiconductor 412 through the P-N junction conductor 416, as shown by arrow 428. With the electrons flowing in the direction of the arrow 428, power with positive voltage is generated and is output to the power output destination 426. Further, when the heat removal side 432 of the TEC 410 is hotter than the heat input side 430 of the TEC 410, power with negative voltage is generated and is output to the power output destination 426. In summary, the TEC 410 utilizing the Seebeck effect generates power when there is a temperature difference between the heat input side 430 and the heat removal side 432.
As discussed supra, when power is supplied to the TEC utilizing the Peltier effect, one junction of the TEC is cooled while another junction of the TEC is heated as heat is pumped from one side to another side of TEC by electron transport, depending on a direction of the current applied. Thus, in one configuration where Junction A 614 corresponds with the first junction 318 of
As the die 632 performs mobile device tasks, die temperature rises, causing temperatures of various portions of the mobile device 800 to increase. For example, the increase in the die temperature may cause the skin temperature sensed via the temperature sensor 618 to increase. When the skin temperature sensed via the temperature sensor 618 rises above the threshold temperature (e.g., 40˜45° C.), the TEC 612 utilizing the Peltier effect can be powered (e.g., via the battery 632) to cool one side of the TEC 612 corresponding to Junction A 614 that contacts the skin layer 618 to lower the skin temperature of the skin layer 618, thereby maintaining the skin temperature at the threshold temperature (e.g., 40˜45° C.) or below. While the TEC 612 is powered, the other side of the TEC 612 corresponding to Junction B 616 is heated. The heat from the temperature increase at Junction B 616 may also be cooled with the thermal solution included in the core layer 620. The die temperature may reach the maximum allowable die temperature limit of the die 632 while maintaining a desired skin temperature at the skin layer 618. That is, the die temperature is allowed to reach maximum allowable temperature while the skin temperature is maintained at 45° C.
As discussed supra, the allowable die temperature limit in conventional mobile devices is 105˜125° C. Therefore, the TEC 612 is powered to cool the skin layer 618 and to maintain the skin temperature of the skin layer 618 at the threshold temperature (e.g., 40˜45° C.) or below, while the temperature at Junction B 616 and the inner portion 630 increases due to the heat from Junction B 616 and an increase in the die temperature. That is, because the TEC 612 is used to maintain the skin temperature of the skin layer 618 at the threshold temperature (e.g., 40˜45° C.) or below, the die 632 can perform at a high level that causes the die temperature to rise above a conventional mitigation temperature of 70˜85° C. Further, the die 632 may have its own independent cooling component such as a die thermal solution 636 to cool the die 632. The die thermal solution 632 may include at least one of a vapor chamber, a heat pipe or PCM.
In an aspect, when the temperature of the inner portion of the mobile device is higher than the skin temperature when the die is performing, the TEC utilizing the Seebeck effect can be used to generate power with the temperature difference between the inner portion and the skin portion of the mobile device. In another aspect, when the display device operates at a high resolution, the display generates heat, and thus the skin side may have a higher temperature than the die portion of the mobile device. The TEC utilizing the Seebeck effect can then be used to generate power using the temperature difference. The generated power may be used to supply power to components or a battery, which can contribute to longer battery life.
When the skin temperature sensed via the temperature sensor 692 is equal to or less than the threshold temperature, the TEC 682 is used for the Seebeck effect to generate power via a temperature difference between Junction A 684 and Junction B 686. The generated power may be stored in the battery 634 via the power storage connection 696 or may be supplied directly to other components of the mobile device. More specifically, in a configuration where Junction A 684 corresponds with the first junction 418 of
In another configuration of the exemplary implementation 670 of
It is noted that any combinations of
Hence, the TEC utilizing the Peltier effect can be used at a mobile device skin near a display (e.g., touch screen) side and/or back cover side to cool the skin and maintain the skin temperature at the threshold temperature (e.g., 40˜45° C.) by using the temperature control loop discussed supra. That is, when the sensor 702 determines that the skin temperature is above the threshold temperature, the controller 708 powers the TEC 704 utilizing the Peltier effect to cool the skin. When the skin temperature is not greater than the threshold temperature, the controller 708 deactivates the TEC 704 utilizing the Peltier effect. Because the skin temperature can be maintained at the threshold temperature (e.g., 40˜45° C.) via the cooling effect of the TEC 704, the die temperature may be allowed to increase above a conventional mitigation temperature (e.g., 70˜85° C.) and reach the allowable limit (e.g., 105˜125° C.) of the die temperature, which enables the die to perform at a higher level than a conventional mobile device.
In addition, at least one of a die temperature, PMIC power output, or a PMIC temperature may be considered in determining whether to power the TEC 704. For example, a die temperature sensor may be embedded in the die to sense the die temperature, and a PMIC temperature sensor may be embedded in the PMIC to measure the PMIC temperature. The correlation between the skin temperature and at least one of the die temperature, the PMIC power output, or the PMIC temperature may be determined during a development stage of the mobile device. In particular, during the development stage, for each of various use cases (e.g., a CPU intensive case, a graphic intensive case, etc.), at least one of the die temperature, the PMIC power output, or the PMIC temperature may be determined and correlated with a corresponding skin temperature measured by a sensor.
Therefore, a database including information about relationship between a device skin temperature and its corresponding die temperature, PMIC power output, and PMIC temperature may be built and stored in the mobile device. Then, the mobile device being used by a user may measure at least one of the measured die temperature, PMIC power output, or PMIC temperature, and then estimate the skin temperature based on the measured values and the correlation in the database, without using the skin temperature sensor.
As the mobile device 800 utilizes the die 854 to perform various tasks of the mobile device 800, the die temperature rises, which causes temperatures of various portions of the mobile device 800 to increase. Thus, with the increase in the die temperature, the front skin temperature sensed by the front temperature sensor 820 rises. The touch screen display 814 providing a high resolution may also generate heat that additionally contributes to the rise in the front skin temperature. When the front skin temperature is greater than a threshold temperature (e.g., 40˜45° C.), the mobile device 800 supplies power from the battery 860 to the front TEC 812 through a power connection 826 in order to cool Junction A 822 of the front TEC 812 facing toward the touch screen display 814. While Junction A 822 is cooled, Junction B 824 of the front TEC 812 facing toward the front thermal solution layer 818 and the die 854 is heated. Thus, the front skin portion including the touch screen display 814 is cooled via Junction A 822 of the front TEC 812 until the mobile device 800 determines that the front temperature sensed by the front temperature sensor 820 is less than or equal to the threshold temperature. The cooling of the front skin portion via the front TEC 812 allows the front temperature at the touch screen display 814 to be maintained at the threshold temperature or below. An inside temperature of the inside portion 850 increases due to an increased die temperature and the heating of Junction B 824 while the front TEC 812 is activated. However, the increase in the inside temperature does not affect the die performance since the allowable die temperature limit for reliable performance is much higher (e.g., 105˜125° C.) than the threshold temperature (e.g., 40˜45° C.). While power is supplied to the front TEC 812, the heat from the heated Junction B 824 may be dissipated via the front thermal solution layer 818. The heat from the inside portion 850 may further be dissipated via the die thermal solution 862.
When the die temperature of the die 854 increases while the die 854 performs various tasks of the mobile device 900, the back side skin temperature sensed by the back side temperature sensor 934 rises. When the back side skin temperature is greater than a threshold temperature (e.g., 40˜45° C.), the mobile device 900 supplies power from the battery 860 to the back TEC 932 through a power connection 940 in order to cool Junction A 936 of the back TEC 932 facing toward the back cover 832 while heating Junction B 938 of the back TEC 932 facing toward the back thermal solution layer 935 and the die 854. Thus, the back side skin portion including the back cover 832 is cooled via Junction A 936 of the back TEC 932 until the mobile device 900 determines that the back side skin temperature sensed by the back side temperature sensor 934 is less than or equal to the threshold temperature. The cooling of the back side skin portion via the back TEC 932 allows the temperature at the back cover 934 to be maintained at the threshold temperature or below. An inside temperature of the inside portion 950 increases due to a increased die temperature and the heating of Junction B 938 while the back TEC 932 is activated. However, the increase in the inside temperature does not affect the die performance since the allowable die temperature limit for reliable performance is much higher (e.g., 105˜125° C.) than the threshold temperature. While power is supplied to the back TEC 932, the heat from the heated Junction B 938 is cooled via the back thermal solution layer 935. The heat from the inside portion 950 may further be dissipated via the independent thermal solution on top of the die 862 and the front graphite 916.
It is noted that the mobile device 1000 is a combination of the TEC implementation at the front portion 810 of the mobile device 800 of
An alternative approach may be utilized to maintain the skin temperature in the mobile device 1000. The alternative approach implements the back TEC 932 such that the back TEC 932 may be powered to cool Junction B 938 and to heat Junction A 936. Further, the alternative approach implements the front TEC 812 such that the front TEC 812 may be powered to cool Junction B 824 and to heat Junction A 822. In particular, when the front skin temperature sensed by the front temperature sensor 820 is greater than the threshold temperature, the back TEC 932 may be powered to cool Junction B 938 of the back TEC 932. In a mobile device structure where mobile device components are connected from the front side 1010 to the back side 1030, as Junction B 938 of the back TEC 932 is cooled, heat from the front portion 1010 and the inside portion 950 flows toward the back portion 1030 through the mobile device components, thereby lowering the front skin temperature. When the front side skin temperature decreases to the threshold temperature or below, power is no longer supplied to the back TEC 932 in order to stop cooling Junction B 938 of the back TEC 932. Similarly, when the back side skin temperature is greater than the threshold temperature, the front TEC 812 may be powered to cool Junction B 824 of the front TEC 812. As Junction B 824 of the front TEC 812 is cooled, heat from the back portion 1030 flows toward the front portion 1010 through the mobile device components, thereby lowering the back side skin temperature. When the back side skin temperature decreases to the threshold temperature or below, power is cut off from the front TEC 812 to stop cooling Junction B 824 of the front TEC 812. In the alternative approach, one of the front TEC 812 and the back TEC 932 may be powered at a time until a desired temperature (e.g., a temperature equal to or less than the threshold temperature) is achieved for the front skin temperature and the back side skin temperature.
TECs according to another embodiment. According to
It is noted that the TEC operation utilizing the Peltier effect and the structure of the front portion 1110 of the mobile device 1100 is the same as the TEC operation and the structure of the front portion 810 of the mobile device 800 of
At the back portion 1130, the back TEC 1132 uses the Seebeck effect to generate power when there is a temperature difference between Junction A 1134 and Junction B 1136. In a first configuration, Junction A 1134 and Junction B 1136 may be equivalent to the first junction 418 and the second junction 424, respectively, as illustrated in
In the mobile device 1200, the front TEC 1212 utilizes the Peltier effect when the front skin temperature sensed by the front temperature sensor 820 is greater than a threshold temperature. The front TEC 1212 utilizes the Seebeck effect when the front skin temperature sensed by the front temperature sensor 820 is equal to or less than the threshold temperature (e.g., 40˜45° C.). In particular, when the front skin temperature is equal to or less than the threshold temperature, the front TEC 1212 utilizes the Seebeck effect to generate power via a temperature difference between Junction A 1214 and Junction B 1216. In one configuration, Junction A 1214 and Junction B 1216 may be equivalent to the first junction 418 and the second junction 424 of
When the die temperature of the die 854 increases as the die 854 is used for various tasks of the mobile device 1200, temperatures of various portions of the mobile device 1200 also increase. Thus, with the increase in the die temperature, the front skin temperature sensed by the front temperature sensor 820 rises. When the front skin temperature is greater than the threshold temperature (e.g., 40˜45° C.), the mobile device 1200 supplies power from the battery 860 to the front TEC 1212 through a power connection 826 in order to cool Junction A 1214 of the front TEC 1212 facing toward the touch screen display 814 while heating Junction B 1216 of the front TEC 1212 facing toward the front thermal solution layer 818 and the die 854. The front skin portion including the touch screen display 814 is cooled via Junction A 1214 of the front TEC 1212 until the mobile device 1200 determines that the front temperature sensed by the front temperature sensor 820 is less than or equal to the threshold temperature. The cooling of the front skin portion via the front TEC 1212 allows the front temperature at the touch screen display 814 to be maintained at the threshold temperature or below. An inside temperature of the inside portion 850 increases due to a increased die temperature and the heating of Junction B 1216 while the front TEC 1212 is activated. However, the increase in the inside temperature does not affect the die performance because the allowable die temperature limit for reliable performance is much higher (e.g., 105˜125° C.) than the device skin threshold temperature limit. While power is supplied to the TEC, the heat from the heated Junction B 1216 may be dissipated via the front thermal solution layer 818. The heat from the inside portion 850 may further be dissipated via the graphite layer 834 and the die thermal solution 862 on top of the die.
In another configuration, the TEC 1212 may include two or more separate TECs. The TEC 1212 may include a first TEC on the left side of the TEC 1212 corresponding to the location of the die 854, and a second TEC on the right side of the TEC 1212 corresponding to the location of the battery 860. In one example, the first TEC on the left side may utilize both the Peltier effect and the Seebeck effect and thus may be connected to the power connection 826 and the power storage connection 828. In the first example, the second TEC on the right side of the TEC 1212 may utilize only the Seebeck effect, and thus may be connected only with the power storage connection 828. In a second example, the first TEC on the left side may utilize only the Seebeck effect, and thus may be connected only with the power storage connection 828. In the second example, the second TEC on the right side may utilize both the Peltier effect and the Seebeck effect and thus may be connected to the power connection 826 and the power storage connection 828.
It is noted that the TEC operation utilizing the Peltier effect and the Seebeck effect and the structure of the front portion 1310 of the mobile device 1300 is the same as the TEC operation and the structure of the front portion 1210 of the mobile device 1200 of
At step 1404, the mobile device determines whether the skin temperature is greater than a threshold temperature. For example, referring back to
At step 1406, if the skin temperature is greater than the threshold temperature, the mobile device provides power to a thermoelectric cooler (TEC) to cool a first side of the TEC while heating a second side of the TEC. For example, referring back to
The second side of the TEC may contact a thermal solution to cool heat from the second side of the TEC. For example, referring back to FIGS. 8 and 10-11, the front TEC 816 contacts the first thermal solution layer 818 to cool heat generated from Junction B 824 of the front TEC 816. As another example, referring back to
At step 1408, if the skin temperature is not greater than the threshold temperature, the mobile device refrains from providing power to the TEC. Further, at step 1410, if the skin temperature is not greater than the threshold temperature (e.g., if the determined skin temperature is equal to or less than the threshold temperature), the mobile device may generate power via a temperature difference between the first side and the second side of the thermoelectric cooler. For example, referring to
Referring to
At step 1454, the mobile device obtains a second skin temperature at a second skin portion of the mobile device. For example, referring back to
The temperature module 1504 may determine whether a second skin temperature at a second skin portion of the mobile device is greater than the threshold temperature. The second temperature sensor 1580 measures second skin temperature at the second skin portion of the mobile device. Then, the power supply control module 1506 may provide power to a second TEC 1570 to cool a first side of the second TEC 1570 while heating a second side of the second TEC 1570 if the second skin temperature is greater than the threshold temperature. The first side of the second TEC 1570 contacts the second skin portion to cool the second skin portion. The second side of the second TEC 1570 faces the core of the mobile device.
The apparatus may include additional modules that perform each of the steps of the algorithm in the aforementioned flow charts of
The processing system 1614 may be coupled to a transceiver 1610. The transceiver 1610 is coupled to one or more antennas 1620. The transceiver 1610 provides a means for communicating with various other apparatus over a transmission medium. The transceiver 1610 receives a signal from the one or more antennas 1620, extracts information from the received signal, and provides the extracted information to the processing system 1614. In addition, the transceiver 1610 receives information from the processing system 1614, and based on the received information, generates a signal to be applied to the one or more antennas 1620. The processing system 1614 includes a processor 1604 coupled to a computer-readable medium 1606. The processor 1604 is responsible for general processing, including the execution of software stored on the computer-readable medium 1606. The software, when executed by the processor 1604, causes the processing system 1614 to perform the various functions described supra for any particular apparatus. The computer-readable medium 1606 may also be used for storing data that is manipulated by the processor 1604 when executing software. The processing system further includes at least one of the modules 1504, 1506, 1508, 1550, 1560, 1570, and 1580. The modules may be software modules running in the processor 1604, resident/stored in the computer readable medium 1606, one or more hardware modules coupled to the processor 1604, or some combination thereof.
In one configuration, the apparatus 1502/1502′ for wireless communication includes means for determining whether a skin temperature at a skin portion of a mobile device is greater than a threshold temperature, and means for providing power to a TEC to cool a first side of a TEC while heating a second side of the TEC if the skin temperature is greater than the threshold temperature, wherein the first side of the TEC contacts the skin portion to cool the skin portion and the second side of the TEC faces a core of the mobile device. The apparatus 1502/1502′ may further include means for generating power via a temperature difference between the first side and the second side of the TEC if the determined skin temperature is equal to or less than the threshold temperature. The apparatus 1502/1502′ may further include means for refraining from providing power to the TEC when the skin temperature is determined to be equal to or less than the threshold temperature. The apparatus 1502/1502′ may further include means for determining whether a second skin temperature at a second skin portion of the mobile device is greater than the threshold temperature, and means for providing power to a second TEC to cool a first side of the second TEC while heating a second side of the second TEC if the second skin temperature is greater than the threshold temperature, wherein the first side of the second TEC contacts the second skin portion to cool the second skin portion and the second side of the second TEC faces the core of the mobile device. The apparatus 1502/1502′ may further include means for generating power via a temperature difference between a first side of a second TEC and a second side of the second TEC, the second TEC being located at an opposing side from the TEC.
It is understood that the specific order or hierarchy of steps in the processes disclosed is an illustration of exemplary approaches. Based upon design preferences, it is understood that the specific order or hierarchy of steps in the processes may be rearranged. Further, some steps may be combined or omitted. The accompanying method claims present elements of the various steps in a sample order, and are not meant to be limited to the specific order or hierarchy presented.
The previous description is provided to enable any person skilled in the art to practice the various aspects described herein. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects. Thus, the claims are not intended to be limited to the aspects shown herein, but is to be accorded the full scope consistent with the language claims, wherein reference to an element in the singular is not intended to mean “one and only one” unless specifically so stated, but rather “one or more.” The word “exemplary” is used herein to mean “serving as an example, instance, or illustration.” Any aspect described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other aspects.” Unless specifically stated otherwise, the term “some” refers to one or more. Combinations such as “at least one of A, B, or C,” “at least one of A, B, and C,” and “A, B, C, or any combination thereof” include any combination of A, B, and/or C, and may include multiples of A, multiples of B, or multiples of C. Specifically, combinations such as “at least one of A, B, or C,” “at least one of A, B, and C,” and “A, B, C, or any combination thereof” may be A only, B only, C only, A and B, A and C, B and C, or A and B and C, where any such combinations may contain one or more member or members of A, B, or C. All structural and functional equivalents to the elements of the various aspects described throughout this disclosure that are known or later come to be known to those of ordinary skill in the art are expressly incorporated herein by reference and are intended to be encompassed by the claims. Moreover, nothing disclosed herein is intended to be dedicated to the public regardless of whether such disclosure is explicitly recited in the claims. No claim element is to be construed as a means plus function unless the element is expressly recited using the phrase “means for.”
Claims
1. A method comprising:
- determining whether a skin temperature at a skin portion of a mobile device is greater than a threshold temperature; and
- providing power to a thermoelectric cooler (TEC) to cool a first side of the TEC while heating a second side of the TEC if the skin temperature is greater than the threshold temperature, wherein the first side of the TEC contacts the skin portion to cool the skin portion and the second side of the TEC faces a core of the mobile device.
2. The method of claim 1, further comprising:
- generating power via a temperature difference between the first side and the second side of the TEC if the determined skin temperature is equal to or less than the threshold temperature.
3. The method of claim 2, wherein the generated power is stored in a battery of the mobile device or is provided directly to components of the mobile device.
4. The method of claim 1, further comprising:
- refraining from providing power to the TEC when the skin temperature is determined to be equal to or less than the threshold temperature.
5. The method of claim 1, wherein the second side of the TEC contacts a thermal solution to cool heat generated from the second side of the TEC.
6. The method of claim 5, wherein the thermal solution comprises at least one of a copper heat spreader, an aluminum heat spreader, a carbon heat spreader, or phase change material (PCM).
7. The method of claim 1, wherein the skin portion of the mobile device at which the skin temperature is measured is at a display side of the mobile device.
8. The method of claim 1, wherein the skin portion of the mobile device at which the skin temperature is measured is at a non-display side of the mobile device.
9. The method of claim 1, further comprising:
- determining whether a second skin temperature at a second skin portion of the mobile device is greater than the threshold temperature;
- providing power to a second TEC to cool a first side of the second TEC while heating a second side of the second TEC if the second skin temperature is greater than the threshold temperature, wherein the first side of the second TEC contacts the second skin portion to cool the second skin portion and the second side of the second TEC faces the core of the mobile device.
10. The method of claim 1, further comprising:
- generating power via a temperature difference between a first side of a second TEC and a second side of the second TEC, the second TEC being located at an opposing side from the TEC.
11. The method of claim 10, wherein the first side of the second TEC contacts a second skin portion of the mobile device and the second side of the second TEC faces the core of the mobile device.
12. The method of claim 10, wherein the first side of the second TEC faces the core of the mobile device and the second side of the second TEC contacts a second skin portion of the mobile device.
13. The method of claim 10, wherein at least one of the first side and the second side of the second TEC contacts a thermal solution.
14. The method of claim 1, wherein the skin temperature is determined based on at least one of a die temperature, a power management integrated circuit (PMIC) power output, or a PMIC temperature.
15. An apparatus comprising:
- means for determining whether a skin temperature at a skin portion of a mobile device is greater than a threshold temperature; and
- means for providing power to a thermoelectric cooler (TEC) to cool a first side of the TEC while heating a second side of the TEC if the skin temperature is greater than the threshold temperature, wherein the first side of the TEC contacts the skin portion to cool the skin portion and the second side of the TEC faces a core of the mobile device.
16. The apparatus of claim 15, further comprising:
- means for generating power via a temperature difference between the first side and the second side of the TEC if the determined skin temperature is equal to or less than the threshold temperature.
17. The apparatus of claim 16, wherein the generated power is stored in a battery of the mobile device or is provided directly to components of the mobile device.
18. The apparatus of claim 15, further comprising:
- means for refraining from providing power to the TEC when the skin temperature is determined to be equal to or less than the threshold temperature.
19. The apparatus of claim 15, wherein the second side of the TEC contacts a thermal solution to cool heat generated from the second side of the TEC.
20. The apparatus of claim 19, wherein the thermal solution comprises at least one of a copper heat spreader, an aluminum heat spreader, a carbon heat spreader, or phase change material (PCM).
21. The apparatus of claim 15, wherein the skin portion of the mobile device at which the skin temperature is measured is at a display side of the mobile device.
22. The apparatus of claim 15, wherein the skin portion of the mobile device at which the skin temperature is measured is at a non-display side of the mobile device.
23. The apparatus of claim 15, further comprising:
- means for determining whether a second skin temperature at a second skin portion of the mobile device is greater than the threshold temperature;
- means for providing power to a second TEC to cool a first side of the second TEC while heating a second side of the second TEC if the second skin temperature is greater than the threshold temperature, wherein the first side of the second TEC contacts the second skin portion to cool the second skin portion and the second side of the second TEC faces the core of the mobile device.
24. The apparatus of claim 15, further comprising:
- means for generating power via a temperature difference between a first side of a second TEC and a second side of the second TEC, the second TEC being located at an opposing side from the TEC.
25. The apparatus of claim 24, wherein the first side of the second TEC contacts a second skin portion of the mobile device and the second side of the second TEC faces the core of the mobile device.
26. The apparatus of claim 24, wherein the first side of the second TEC faces the core of the mobile device and the second side of the second TEC contacts a second skin portion of the mobile device.
27. The apparatus of claim 24, wherein at least one of the first side and the second side of the second TEC contacts a thermal solution.
28. The apparatus of claim 15, wherein the skin temperature is determined based on at least one of a die temperature, a power management integrated circuit (PMIC) power output, or a PMIC temperature.
29. An apparatus for wireless communication, comprising:
- a processing system configured to:
- determine whether a skin temperature at a skin portion of a mobile device is greater than a threshold temperature; and
- provide power to a thermoelectric cooler (TEC) to cool a first side of the TEC while heating a second side of the TEC if the skin temperature is greater than the threshold temperature, wherein the first side of the TEC contacts the skin portion to cool the skin portion and the second side of the TEC faces a core of the mobile device.
30. The apparatus of claim 29, wherein the processing system is further configured to:
- generate power via a temperature difference between the first side and the second side of the TEC if the determined skin temperature is equal to or less than the threshold temperature.
31. The apparatus of claim 30, wherein the generated power is stored in a battery of the mobile device or is provided directly to components of the mobile device.
32. The apparatus of claim 29, wherein the processing system is further configured to:
- refrain from providing power to the TEC when the skin temperature is determined to be equal to or less than the threshold temperature.
33. The apparatus of claim 29, wherein the second side of the TEC contacts a thermal solution to cool heat generated from the second side of the TEC.
34. The apparatus of claim 33, wherein the thermal solution comprises at least one of a copper heat spreader, an aluminum heat spreader, a carbon heat spreader, or phase change material (PCM).
35. The apparatus of claim 29, wherein the skin portion of the mobile device at which the skin temperature is measured is at a display side of the mobile device.
36. The apparatus of claim 29, wherein the skin portion of the mobile device at which the skin temperature is measured is at a non-display side of the mobile device.
37. The apparatus of claim 29, wherein the processing system is further configured to:
- determine whether a second skin temperature at a second skin portion of the mobile device is greater than the threshold temperature;
- provide power to a second TEC to cool a first side of the second TEC while heating a second side of the second TEC if the second skin temperature is greater than the threshold temperature, wherein the first side of the second TEC contacts the second skin portion to cool the second skin portion and the second side of the second TEC faces the core of the mobile device.
38. The apparatus of claim 29, wherein the processing system is further configured to:
- generate power via a temperature difference between a first side of a second TEC and a second side of the second TEC, the second TEC being located at an opposing side from the TEC.
39. The apparatus of claim 38, wherein the first side of the second TEC contacts a second skin portion of the mobile device and the second side of the second TEC faces the core of the mobile device.
40. The apparatus of claim 38, wherein the first side of the second TEC faces the core of the mobile device and the second side of the second TEC contacts a second skin portion of the mobile device.
41. The apparatus of claim 38, wherein at least one of the first side and the second side of the second TEC contacts a thermal solution.
42. The apparatus of claim 29, wherein the skin temperature is determined based on at least one of a die temperature, a power management integrated circuit (PMIC) power output, or a PMIC temperature.
43. A computer program product, comprising:
- a computer-readable medium comprising code for:
- determining whether a skin temperature at a skin portion of a mobile device is greater than a threshold temperature; and
- providing power to a thermoelectric cooler (TEC) to cool a first side of the TEC while heating a second side of the TEC if the skin temperature is greater than the threshold temperature, wherein the first side of the TEC contacts the skin portion to cool the skin portion and the second side of the TEC faces a core of the mobile device.
44. The computer program product of claim 43, wherein the computer-readable medium further comprises code for:
- generating power via a temperature difference between the first side and the second side of the TEC if the determined skin temperature is equal to or less than the threshold temperature.
45. The computer program product of claim 44, wherein the generated power is stored in a battery of the mobile device or is provided directly to components of the mobile device.
46. The computer program product of claim 43, wherein the computer-readable medium further comprises code for:
- refraining from providing power to the TEC when the skin temperature is determined to be equal to or less than the threshold temperature.
47. The computer program product of claim 43, wherein the second side of the TEC contacts a thermal solution to cool heat generated from the second side of the TEC.
48. The computer program product of claim 47, wherein the thermal solution comprises at least one of a copper heat spreader, an aluminum heat spreader, a carbon heat spreader, or phase change material (PCM).
49. The computer program product of claim 43, wherein the skin portion of the mobile device at which the skin temperature is measured is at a display side of the mobile device.
50. The computer program product of claim 43, wherein the skin portion of the mobile device at which the skin temperature is measured is at a non-display side of the mobile device.
51. The computer program product of claim 43, wherein the computer-readable medium further comprises code for:
- determining whether a second skin temperature at a second skin portion of the mobile device is greater than the threshold temperature;
- providing power to a second TEC to cool a first side of the second TEC while heating a second side of the second TEC if the second skin temperature is greater than the threshold temperature, wherein the first side of the second TEC contacts the second skin portion to cool the second skin portion and the second side of the second TEC faces the core of the mobile device.
52. The computer program product of claim 43, wherein the computer-readable medium further comprises code for:
- generating power via a temperature difference between a first side of a second TEC and a second side of the second TEC, the second TEC being located at an opposing side from the TEC.
53. The computer program product of claim 52, wherein the first side of the second TEC contacts a second skin portion of the mobile device and the second side of the second TEC faces the core of the mobile device.
54. The computer program product of claim 52, wherein the first side of the second TEC faces the core of the mobile device and the second side of the second TEC contacts a second skin portion of the mobile device.
55. The computer program product of claim 52, wherein at least one of the first side and the second side of the second TEC contacts a thermal solution.
56. The computer program product of claim 43, wherein the skin temperature is determined based on at least one of a die temperature, a power management integrated circuit (PMIC) power output, or a PMIC temperature.
Type: Application
Filed: Sep 18, 2013
Publication Date: Mar 19, 2015
Applicant: QUALCOMM Incorporated (San Diego, CA)
Inventor: Rupal Govindbhai PRAJAPATI (San Diego, CA)
Application Number: 14/030,901
International Classification: F25B 21/02 (20060101);
