BONDING PLASTIC FLOOR PIECES TOGETHER
A method of bonding plastic floor pieces together includes several steps. One step involves laying plastic floor pieces near each other in order to produce a seam between neighboring plastic floor pieces. Another step involves cutting a groove into and along a part or more of the seam. Yet another step involves filling the groove with a bonding compound that can be composed of, among other constituents, methyl methacrylate.
This application claims the benefit of U.S. Provisional Patent Application No. 61/915,131, the entire contents of which are hereby incorporated by reference.
TECHNICAL FIELDThe present disclosure generally relates to floor constructions, and more particularly relates to ways of joining plastic floor pieces together.
BACKGROUNDBecause of their general durability, plastic floor pieces are commonly used in areas and rooms that undergo an unusually high degree of wear and tear such as in building entrances, gymnasium weight rooms, locker rooms, commercial kitchens, basements, livestock trailers, and patios. Plastic floor pieces are also used because they present softer walking and running surfaces, and hence are easier on a person's joints. When laid down side-by-side on a sub-floor or underlayment during installation, a seam is produced at edges between neighboring and touching floor pieces. To join the plastic floor pieces together, in the past an installer performed a heat welding procedure. First, a groove was formed at the seam and then a heat gun melted a plastic rod to put the rod's material in the groove. Additional finishing steps may have also been performed.
While this procedure made an acceptable joint between plastic floor pieces, the strength and quality of the joint oftentimes depended largely on the skill of the installer performing the heat weld. For instance, a poorly skilled installer could make a poor quality and weak joint. Also, the heat welding procedure normally took more time than installers would have liked—typically one-and-a-half to two linear feet along the seam per minute.
SUMMARYIn one embodiment, a method of bonding plastic floor pieces together includes the step of laying plastic floor pieces adjacent each other to produce a seam between the plastic floor pieces. Another step involves cutting a groove into and along a part or more of the seam. And yet another step involves filling the groove with a bonding compound that comprises methyl methacrylate.
In another embodiment, a method of bonding plastic floor pieces together includes several steps. One step involves laying plastic floor pieces near each other in order to produce a seam between neighboring plastic floor pieces. Another step involves cutting a groove into and along part or more of the seam. The groove is cut part way into the seam in a direction generally orthogonal with top surface planes of the plastic floor pieces. An extent of the seam remains uncut. Yet another step involves dispensing a bonding compound into the groove. The bonding compound is composed of, among other constituents, a resin part with methyl methacrylate and an activator part. The resin and activator parts mix together as the bonding compound is in the midst of being dispensed into the groove. The bonding compound is also dispensed into the uncut extent of the seam.
In yet another embodiment, a method of bonding plastic floor pieces together includes several steps. One step involves laying plastic floor pieces near each other in order to produce a seam between neighboring plastic floor pieces. Another step involves providing a groove along part or more of the seam. The groove is provided part way into the seam in a direction generally orthogonal with top surface planes of the plastic floor pieces. An extent of the seam remains without a groove. Yet another step involves using a dispenser gun to dispense a bonding compound into the groove and into the extent of the seam that remains without a groove. The dispenser gun has a first cartridge and a second cartridge. The bonding compound is composed of a resin part and an activator part. The resin part is held in the first cartridge and the activator part is held in the second cartridge. The resin and activator parts mix together as the bonding compound is in the midst of being dispensed into the groove and into the extent of the seam that remains without a groove. And yet another step involves allowing the bonding compound to cure in the groove and in the extent of the seam that remains without a groove.
The figures depict steps performed in one example of a method of bonding plastic floor pieces together. The method uses a bonding compound that can be applied by a dispenser gun, instead of the heat gun and heat welding procedure previously known. The bonding method can be easier to perform in many ways compared to the heat welding procedure, and makes a more consistently strong and high quality joint between plastic floor pieces than the previous procedure. Because it can be more readily performed, the bonding method depends less on the skill of the installer doing the work. Also, compared to the heat welding procedure, installers can make a joint using the bonding method much quicker—for example, typically about twenty-one linear feet per minute.
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As mentioned, the method of bonding the plastic floor pieces 12, 14 together detailed in this description makes a strong and high quality joint more consistently than previously known, and at a quicker pace. The method can include different steps in different examples. Indeed, the exact steps performed in a particular example may depend upon—among other considerations—the material used for the floor pieces, the size and thickness of the floor pieces, and the composition of the bonding compound used. Moreover, though described below with certain steps in a certain order, other examples of the bonding method could include more, less, and different steps, and the steps described could be performed in a different order.
In the example of the figures, the method of bonding the plastic floor pieces 12, 14 together includes several steps: laying the plastic floor pieces down, cutting a groove at a seam of the floor pieces, masking the sides of the groove, filling the groove with a bonding compound, smoothing out the bonding compound, pulling the masking off, allowing the bonding compound to cure, and removing any protruding portion of the cured bonding compound. Again, not all of these steps need to be carried out. For instance, the masking can be omitted in some examples.
Referring to
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After masking (if indeed carried out), the groove 32 is filled with a bonding compound 38. The bonding compound 38, after it is completely cured, produces a bonded joint between the first and second plastic floor pieces 12, 14. In this example the bonding compound 38 is a methyl methacrylate-based composition. Initially, and before the bonding compound 38 is set into the groove 32, the bonding compound includes two discrete and separate parts that are mixed together as the groove is filled. The parts then chemically react and cure in the groove 32 to ultimately produce the bonded joint. In
In one specific example, the resin part 40 is composed of approximately 40-85 concentration percentage of methyl methacrylate, 1-10 concentration percentage of methacrylic acid, and 5-15 concentration percentage of 2-chloro-1,3 butadiene. And the activator part 46 is composed of approximately 10-40 concentration percentage of benzoyl peroxide, 10-30 concentration percentage of bisphenol A diglycidyl ether resin, 10-30 concentration percentage of dibutyl phthalate, and 1-10 concentration percentage of other non-hazardous ingredients. Resin and activator parts like these can be supplied by ASI Adhesive Systems, Inc. with an office at 9411 Corsair Road, Frankfort, Ill. 60423, U.S.A. In addition to the groove 32, the bonding compound 38 can also be filled and inserted into the uncut extent 34 of the seam 20 if a space is defined at the uncut extent by confronting side edges 16, 18. When the uncut extent 34 is filled, the bonded joint between the plastic floor pieces 12, 14 can be enhanced compared to a joint with only its groove filled with bonding compound.
In the specific example set forth above, the bonded joint is held together by more than a mere adhesion via adhesive, and instead is held together via a chemical weld. The chemical weld intermixes the materials of the first and second plastic floor pieces 12, 14 with the composition of the bonding compound 38, and chemically fuses the plastic floor pieces together at the seam 20.
As described, the bonded joint has a more consistently strong and high quality hold between the plastic floor pieces 12, 14 because the bonding compound 38 can be more readily filled in the groove 32 than the previous heat welding procedure. That is, comparatively less skill is needed to fill the groove 32 with the bonding compound 38 than that needed for a proper heat weld. This can be by way of the dispenser gun 44, or by another technique. Previous heat welds can also exhibit strength and quality discrepancies among different welds as a result of the needed skills and different installer abilities, whereas it has been observed that the bonded joints of bonding compound 38 exhibit little or no discrepancies among different welds and among different installers. Indeed, in one specific observation, different bonded joints endured pull test forces of up to approximately 1,150 pounds. This result is considered acceptable according to industry standards.
Shortly after the groove 32 is filled with the bonding compound 38, and before the bonding compound is completely cured, the installer may flatten and smooth out an exposed surface 54 (
If the masking was carried out in an earlier step, the masking could now be taken away by the installer or at a later time such as when the bonding compound 38 is allowed to completely cure and harden. In the case of the adhesive tape 36, the adhesive tape could be pulled off of the top surfaces 26, 28. The curing may occur at room temperature and without external accelerants or facilitators like heat. The exact curing duration will depend on the exact composition of the bonding compound 38. In the specific example set forth above with the resin and activator parts 40, 46, for instance, an initial and non-final cure time is up to approximately three to five minutes and a final cure time is approximately thirty minutes. Still, some typical cure times have been shown to be approximately ten minutes.
And as a possible last step, and referring now to
The foregoing description is considered illustrative only. The terminology that is used is intended to be in the nature of words of description rather than of limitation. Many modifications and variations will readily occur to those skilled in the art in view of the description. Thus, the foregoing description is not intended to limit the invention to the embodiments described above. Accordingly the scope of the invention as defined by the appended claims.
Claims
1. A method of bonding plastic floor pieces together, comprising:
- laying plastic floor pieces adjacent each other to produce a seam between the plastic floor pieces;
- cutting a groove into and along at least a part of the seam; and
- filling the groove with a bonding compound comprising methyl methacrylate.
2. The method of claim 1, further comprising applying tape on top surfaces of the plastic floor pieces and at both sides of the groove before filling the groove with the bonding compound.
3. The method of claim 1, further comprising smoothing out an exposed surface of the bonding compound once the bonding compound is filled in the groove and before the bonding compound is cured.
4. The method of claim 1, further comprising removing a portion of the bonding compound protruding above top surfaces of the plastic floor pieces once the bonding compound is at least partly cured, wherein an exposed surface of the bonding compound after removal is substantially flush with the top surfaces of the plastic floor pieces.
5. The method of claim 1, further comprising allowing the bonding compound to cure in the groove.
6. The method of claim 1, wherein cutting the groove comprises cutting the groove via a power groover.
7. The method of claim 1, wherein the groove is cut part way into the seam in a direction generally orthogonal with top surface planes of the plastic floor pieces, leaving an extent of the seam uncut, and the bonding compound is filled in the uncut extent of the seam before the bonding compound is cured.
8. The method of claim 7, wherein the groove has a depth that measures approximately three-fourths of the overall thickness of the plastic floor pieces at the seam, and the uncut extent of the seam constitutes the remaining extent of the groove.
9. The method of claim 1, wherein the groove cut into and along at least part of the seam is a U-shaped groove.
10. The method of claim 1, wherein filling the groove comprises dispensing the bonding compound in the groove via a dispenser gun.
11. The method of claim 10, wherein the dispenser gun has a pair of cartridges and the bonding compound comprises a resin part with the methyl methacrylate and an activator part, the resin part being held in one of the pair of cartridges and the activator part being held in the other of the cartridges, the resin part and the activator part mixing together as the bonding compound is being dispensed in the groove.
12. The method of claim 1, wherein the plastic floor pieces are polyvinyl chloride (PVC) sheets.
13. The method of claim 1, wherein the bonding compound forms a chemical weld comprising intermixed materials of the plastic floor pieces.
14. A method of bonding plastic floor pieces together, comprising:
- laying plastic floor pieces adjacent each other to produce a seam between the plastic floor pieces;
- cutting a groove into and along at least part of the seam, wherein the groove is cut part way into the seam in a direction generally orthogonal with top surface planes of the plastic floor pieces, leaving an extent of the seam uncut; and
- dispensing a bonding compound into the groove, the bonding compound comprising a resin part with methyl methacrylate and an activator part, the resin and activator parts mixing together as the bonding compound is being dispensed into the groove, the bonding compound dispensed into the uncut extent of the seam.
15. The method of claim 14, wherein dispensing the bonding compound is performed via a dispenser gun, the dispenser gun having a first cartridge and a second cartridge, the resin part held in the first cartridge and the activator part held in the second cartridge.
16. A method of bonding plastic floor pieces together, comprising:
- laying plastic floor pieces adjacent each other to produce a seam between the plastic floor pieces;
- providing a groove along at least a part of the seam, wherein the groove is provided part way into the seam in a direction generally orthogonal with top surface planes of the plastic floor pieces, leaving an extent of the seam without a groove;
- using a dispenser gun to dispense a bonding compound into the groove and into the extent of the seam without a groove, the dispenser gun having a first cartridge and a second cartridge, the bonding compound comprising a resin part and an activator part, the resin part held in the first cartridge and the activator part held in the second cartridge, the resin and activator parts mixing together as the bonding compound is being dispensed into the groove and into the extent of the seam without a groove; and
- allowing the bonding compound to cure in the groove and in the extent of the seam without a groove.
Type: Application
Filed: Dec 12, 2014
Publication Date: Jun 18, 2015
Inventor: Jeremy R. Lee (Oscoda, MI)
Application Number: 14/568,365