Electroplating Assembly And Related Components
An electroplating system including an electroplating rack including at least one electrically conductive frame member and at least one electrically conductive rack connecting member for connecting a pieces assembly to the rack; the pieces assembly having an electrically conductive elongate rod having a central axis and at least one receiving terminal; the elongate rod connected to the rack connecting member at first and second ends thereof and a plurality of pieces, each piece having a final-shape portion and a means for attaching connected to the final-shape portion. The means for attaching is sized and otherwise dimensioned to be fixedly received in the at least one receiving terminal.
The invention relates to the field of electroplating, and more particularly to electroplating components configured for mounting on racks.
BACKGROUND OF THE INVENTIONElectroplating is well established process that uses electrical current to reduce cations of a desired material from a solution and coat a conductive object with a thin layer of the material, typically such as a metal. Electroplating is primarily used in practice for depositing a layer of material to bestow a desired property (for example, abrasion and wear resistance, corrosion protection, lubricity, aesthetic qualities, etc.) to a surface that otherwise lacks that property.
The process used in electroplating is called electro deposition. The part to be plated is typically but not always made the cathode (negative electrode) of the circuit. In one typical but not exclusive technique, the anode is made of the actual metal to be plated on the (cathode) part. Both components are immersed in a solution called an electrolyte containing one or more dissolved metal salts as well as other ions that facilitate the deposition process. A power supply provides current to the anode-electrolyte-cathode circuit. At the anode, metal atoms that comprise it are oxidized allowing them to dissolve in the electrolyte solution. This is just one type of electroplating. Other electroplating examples include an inert anode (like platinum) and dissolved metal salt in the electrolyte.
At the electrolyte-cathode interface, the dissolved metal ions in the electrolyte solution are reduced, such that they “plate out” onto the cathode. Thus under these conditions the rate at which the anode is dissolved into the solution is equal to the rate at which the cathode is plated, by the current flowing through the circuit. In this manner, the ions in the electrolyte bath are continuously replenished by the anode.
Plastic parts may be plated with many finishes such as nickel, chrome, copper or a plethora of other metal. The raw plastic part is typically attached to a metal/conducting rack that is successively immersed into various tanks. In some of these tanks, the racks are supplied with electric current. The rack with the plastic parts on it may be immersed, for example, into an acid bath that chemically etches and cleans the surface of the part. By way of summary, the parts on the rack undergo various etching/cleaning stages. The next step involves a deposition process/routine of copper metal. That step makes the plastic part nearly but not completely conducting. To make the parts conducting, in preparation for the electrodeposition process an additional step is usually required. That step is known in the art as a copper strike. In addition once the rack clips are in electrical connection with the part surfaces, the part is electrically conductive and the rack can go into the electrodeposition tanks and receive the final metallic coating or coatings of typically but not exclusively, nickel, chrome or other metals.
Prior art electroplating systems generally include a large number of clips for a given rack relative to the number of pieces which are being electroplated while being carried on a given rack. Often, this results in low throughput, and increased man-hours required in preparing—that is loading—the rack for the electroplating process, and subsequent unloading. In addition, rack throughput and control of current to different parts of the rack is problematic, often resulting in less than optimal coating of pieces that have not been fully electroplated.
One solution to these prior art problem has been disclosed in applicant's PCT International Application No. PCT/CA2012/050657 filed Sep. 20, 2012. In this application, an electroplating assembly is disclosed having a pieces assembly and individual pieces which substantially reduce the number of clips for a given rack relative to the number of pieces which are electroplated while being carried on a given rack. This is accomplished by concatenating pieces such that current flows between adjacent pieces arranged on the rack in a novel way.
However, there is still room for improvement on these prior art methods. For example, when concatenating parts as described above, restrictions on particular part geometries that may be used have been observed.
Accordingly, there is a need in the art for an improved electroplating assembly.
SUMMARY OF THE INVENTIONAccording to one embodiment of the invention, there is provided an electroplating system including an electroplating rack including at least one electrically conductive frame member and at least one electrically conductive rack connecting member for connecting a pieces assembly to the rack. The pieces assembly includes an electrically conductive elongate rod having a central axis and at least one receiving terminal. The elongate rod is connected to the rack connecting member at first and second ends thereof. The pieces assembly also including a plurality of pieces, each piece having a final-shape portion and a means for attaching connected to the final-shape portion, with the means for attaching is sized and otherwise dimensioned to be fixedly received in the at least one receiving terminal.
According to one aspect of this embodiment, the at least one receiving terminal comprises a recess depressed from an outer surface of the elongate rod.
According to another aspect of this embodiment, each piece further includes a joining portion connecting the final-shape portion and the means for attaching; the final-shape portion adapted to be disconnected from the joining portion following an electroplating process.
According to another aspect of this embodiment, the means for attaching comprises a tubular portion adapted to slidingly engage the outer surface of the rod, at least one projecting clip attached to the tubular portion, and an engaging element at an end of the at least one projecting clip.
According to another aspect of this embodiment, the engaging element is sized and otherwise dimensioned to be friction fit into the at least one receiving terminal.
According to another aspect of this embodiment, the at least one projecting clip is tapered towards a central axis of the tubular portion.
According to another aspect of this embodiment, the at least one projecting clip is spring loaded with a bias towards the central axis.
According to another aspect of this embodiment, the at least one receiving terminal comprises at least one pair of receiving terminals arranged on opposite sides of the rod, and the at least one projecting clip comprises two projecting clips.
According to another aspect of this embodiment, the recess comprises a generally rectangular slot.
According to a second embodiment of the invention, there is provided a rod for use in an electroplating system in which a plurality of pieces to be electroplated are mounted on the rod; the rod including an electrically conductive elongate portion having a central axis and at least one receiving terminal for receiving at least one of the plurality of pieces and means for connecting first and second ends of the rod to an electroplating rack.
According to one aspect of the second embodiment, the at least one receiving terminal comprises a recess depressed from an outer surface of the elongate rod.
According to another aspect of the second embodiment, the at least one receiving terminal comprises at least one pair of receiving terminals arranged on opposite sides of the rod.
According to another aspect of the second embodiment the recess comprises a generally rectangular slot.
According to a third embodiment of the invention, there is provided a method for electroplating including providing an electroplating rack including at least one electrically conductive frame member and at least one electrically conductive rack connecting member for connecting a pieces assembly to the rack; mounting a plurality of pieces on an electrically conductive elongate rod; the elongate rod having a central axis and at least one receiving terminal; the plurality of pieces having a final-shape portion and a means for attaching connected to the final-shape portion; wherein the means for attaching is sized and otherwise dimensioned to be fixedly received in the at least one receiving terminal; attaching the rod with the mounted plurality of pieces onto the electroplating rack; and, carrying out an electroplating reaction.
According to various aspects of the third embodiment, the rack, pieces assembly, rod and pieces are as herein described.
Accordingly, it is an object of the invention to mitigate one or more of the deficiencies of the prior art as herein identified.
The novel features which are characteristic of the present invention, as to its structure, organization, use and method of operation, together with further objectives and advantages thereof, will be better understood from the following drawings in which a presently preferred embodiment of the invention will now be illustrated by way of example. It is expressly understood, however, that the drawings are for the purpose of illustration and description only, and are not intended as a definition of the limits of the invention. In the accompanying drawings:
Referring now to
Referring to
By virtue of being attachable to the rod 10, and the rod 10 being attached to the electroplating rack, plastic pieces 5B may be arranged to fit outwardly from the rack frame 2B. One example of a rack 2B is shown in
The pieces 5B according to the invention are provided in a manner that permits each piece to be independently attached to the rod 10 along the central axis thereof. Each of the pieces 5B are preferably molded plastic pieces-and are identical to each other such that large volumes of pieces may be electroplated at a time. This arrangement provides significant advantages over the prior art, where typically electroplating only occurs between a single piece and the rack itself.
Generally, each plastic piece 5A preferably includes a joining portion 45 and a final-shape portion 50, where the joining portion 45 permits attachment with the rod 10, and the final-shape portion represents the desired end-use piece that is to be electroplated. These elements are typically formed from a molded plastic, and are of a material capable of being electroplated. In practice, both the joining portion 45 and the final-shape portion 50 will be electroplated, but the final-shape portion 50 is detached from the joining portion 45 prior to use. This detachment may occur, for example, by providing a break point between the joining portion 45 and the final-shape portion 50, such that detachment can occur manually. The joining portion 45 is then discarded, or recycled.
Referring now to
Joining portion 45 preferably includes an elongate member 60 leading to the means for attaching 30, which provides an interface between the piece being electroplated, and the terminal 20 of the rod 10.
The terminal 20 preferably includes a generally rectangular shaped, or other non-circular shaped, recess or cavity 65 depressed from an outer surface 70 of the rod 10. Shown more clearly in
Pieces 5A are joined to the rod 10 by an interference fit connection or a snap fit connection, along the central axis 15 of the rod 10. The final shape portion 50 is the portion of the piece 5A that is intended to be used as an end-product. As shown in
In use, a plurality of rods 10 are each donned with a plurality of pieces 5N before mounting on an electroplating rack. Any means for mounting on the rack may be used, provided that current is able to flow from the rack to the rods 10. In fixedly mounting the plurality of pieces 5N onto each rod 10, the pieces may be slid from an end of the rod until engagement of the engaging elements 80 with the terminals 65 (as shown in
Various advantages of the invention as herein described will be evident to those skilled in the art. For example, the volume of pieces that may be simultaneously electroplated on a rack of a given footprint is dramatically increased over prior art systems. Furthermore, the removable rod 10 allows for pieces to be mounted on the rod at a location distal from the electroplating facility. In this regard, mounting on the rod facilitates shipping and transport of the pieces as well. For example, at an injection molding facility, the pieces may be mounted onto the rod, packaged and shipped to an electroplating facility. Here, the electroplating process can be completed, and the rod with pieces intact can be shipped to another facility for further processing, where the final shape portion can be removed, and processed further as needed. This arrangement is not possible in the majority of prior art systems where pieces have to be removed from the electroplating rack individually.
Moreover, the description and illustration of the invention is an example and the invention is not limited to the exact details shown or described.
Variations and adaptations to the methods herein described are contemplated by the invention and accordingly, the above-described embodiments are intended to be examples of the present invention and alterations and modifications may be effected thereto, by those of skill in the art, without departing from the scope of the invention that is defined solely by the claims appended hereto.
Claims
1. An electroplating system comprising:
- an electroplating rack including at least one electrically conductive frame member and at least one electrically conductive rack connecting member for connecting a pieces assembly to said rack; said pieces assembly comprising
- an electrically conductive elongate rod having a central axis and at least one receiving terminal; said elongate rod connected to said rack connecting member at first and second ends thereof;
- a plurality of pieces, each piece having a final-shape portion and a means for attaching connected to said final-shape portion;
- wherein said means for attaching is sized and otherwise dimensioned to be fixedly received in said at least one receiving terminal.
2. An electroplating system according to claim 1, wherein said at least one receiving terminal comprises a recess depressed from an outer surface of said elongate rod.
3. An electroplating system according to 1, wherein each piece further includes a joining portion connecting said final-shape portion and said means for attaching; said final-shape portion adapted to be disconnected from said joining portion following an electroplating process.
4. An electroplating system according to claim 2, wherein said means for attaching comprises a tubular portion adapted to slidingly engage said outer surface of said rod, at least one projecting clip attached to said tubular portion, and an engaging element at an end of said at least one projecting clip.
5. An electroplating system according to claim 4, wherein said engaging element is sized and otherwise dimensioned to be friction fit into said at least one receiving terminal.
6. An electroplating system according to claim 4, wherein said at least one projecting clip is tapered towards a central axis of said tubular portion.
7. An electroplating system according to claim 6, wherein said at least one projecting clip is spring loaded with a bias towards said central axis.
8. An electroplating system according to claim 4, wherein said at least one receiving terminal comprises at least one pair of receiving terminals arranged on opposite sides of said rod, and said at least one projecting clip comprises two projecting clips.
9. An electroplating system according to claim 2, wherein said recess comprises a generally rectangular slot.
10. A rod for use in an electroplating system in which a plurality of pieces to be electroplated are mounted on the rod; the rod comprising
- an electrically conductive elongate portion having a central axis and at least one receiving terminal for receiving at least one of the plurality of pieces; and,
- means for connecting first and second ends of the rod to an electroplating rack.
11. A rod according to claim 10, wherein said at least one receiving terminal comprises a recess depressed from an outer surface of said elongate rod.
12. A rod according to claim 10, wherein said at least one receiving terminal comprises at least one pair of receiving terminals arranged on opposite sides of the rod.
13. An rod according to claim 11, wherein said recess comprises a generally rectangular slot.
14. A method for electroplating comprising:
- providing an electroplating rack including at least one electrically conductive frame member and at least one electrically conductive rack connecting member for connecting a pieces assembly to said rack;
- mounting a plurality of pieces on an electrically conductive elongate rod; said elongate rod having a central axis and at least one receiving terminal; said plurality of pieces having a final-shape portion and a means for attaching connected to said final-shape portion; wherein said means for attaching is sized and otherwise dimensioned to be fixedly received in said at least one receiving terminal;
- attaching said rod with said mounted plurality of pieces onto said electroplating rack; and,
- carrying out an electroplating reaction.
15. A method according to claim 14, wherein said at least one receiving terminal comprises a recess depressed from an outer surface of said elongate rod.
16. A method according to claim 14, wherein each piece further includes a joining portion connecting said final-shape portion and said means for attaching; said final-shape portion adapted to be disconnected from said joining portion following an electroplating process.
17. A method according to claim 15, wherein said means for attaching comprises a tubular portion adapted to slidingly engage said outer surface of said rod, at least one projecting clip attached to said tubular portion, and an engaging element at an end of said at least one projecting clip.
18. A method according to claim 17, wherein said engaging element is sized and otherwise dimensioned to be friction fit into said at least one receiving terminal.
19. A method according to claim 17, wherein said at least one projecting clip is tapered towards a central axis of said tubular portion.
20. A method according to claim 19, wherein said at least one projecting clip is spring loaded with a bias towards said central axis.
21. A method according to claim 17, wherein said at least one receiving terminal comprises at least one pair of receiving terminals arranged on opposite sides of said rod, and said at least one projecting clip comprises two projecting clips.
22. A method according to claim 15, wherein said recess comprises a generally rectangular slot.
Type: Application
Filed: Mar 14, 2013
Publication Date: Jan 28, 2016
Inventors: Bradley WRIGHT , Rudy KOEHLER
Application Number: 14/775,845