OPTICAL SENSOR MODULE AND METHOD FOR MANUFACTURING THE SAME
An optical sensor module includes a lid defining a first chamber and a second chamber isolated from the first chamber, a light emitting component, a light sensing component, and a lid. The light emitting component is disposed within the first chamber and the light sensing component is disposed within the second chamber. The lid includes a first lens with a non-convex upper surface and a convex lower surface facing the light emitting component. The upper surface of the first lens may be substantially planar. The lid may further include a second lens and a capping substrate, wherein the top of the first chamber and a top of the second chamber are demarcated by the capping substrate, and wherein the capping substrate defines a first penetrating hole in which the first lens is formed or disposed and a second penetrating hole in which the second lens is formed or disposed.
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1. Technical Field
The present disclosure relates to an optical sensor module and a method of manufacturing the same. The present disclosure also relates to a portable electronic device including the optical sensor module.
2. Description of the Related Art
An optical sensor module, such as a proximity sensor module, can be used for detecting the presence of an object near the optical sensor module. The optical sensor module includes a light source and an optical sensor. The optical sensor receives or senses light (generally infrared rays) emitted from the light source and reflected by an external object, thereby detecting the presence of the object.
A conventional optical sensor module can suffer from cross-talk. Cross-talk refers to light received by an optical sensor that was not emitted from the light source and reflected from an object to be detected. Cross-talk is a type of interference or noise that can cause reduced performance of an optical module.
SUMMARYIn accordance with an embodiment of the present disclosure, an optical sensor module is provided. The optical sensor module includes a lid defining a first chamber and a second chamber isolated from the first chamber, a light emitting component disposed within the first chamber and a light sensing component disposed within the second chamber. The lid includes a first lens disposed at a top of the first chamber, the first lens including a non-convex upper surface and a convex lower surface facing the light emitting component.
In accordance with another embodiment of the present disclosure, an optical sensor module is provided. The optical sensor module includes a base substrate, a periphery barrier, a separation component and a capping substrate. The base substrate includes a surface with a light emitting area and a light sensing area. The periphery barrier and the separation component are disposed on the surface of the base substrate, wherein the periphery barrier and the separation component together define a first chamber surrounding the light emitting area and a second chamber surrounding the light sensing area, and the first chamber provides light from the light emitting area having a first wavelength. The capping substrate is disposed on the first chamber and the second chamber, and an upper surface of the capping substrate is planar. The capping substrate includes a block portion for blocking light at the first wavelength.
In accordance with another embodiment, a method for manufacturing an optical sensor module is provided. The method includes providing a base substrate, providing a lid, and disposing the lid on the base substrate. The base substrate includes a light emitting component and a light sensing component disposed thereon. The lid defines a first chamber; a second chamber isolated from the first chamber. The lid includes a first lens disposed at a top of the first chamber, the first lens including a convex lower surface and a non-convex upper surface; and a second lens or a light transmissive panel disposed at a top of the second chamber. The lid is disposed on the base substrate such that the lower surface of the first lens faces the light emitting component and a lower surface of the second lens faces the light sensing component.
Common reference numerals are used throughout the drawings and the detailed description to indicate the same or similar components. The present disclosure will be more apparent from the following detailed description taken in conjunction with the accompanying drawings.
DETAILED DESCRIPTIONAlthough a lid 16 is used in the optical sensor module of
Furthermore, the lid 16 can protect the lens 15 from being scratched or damaged; however, the lid 16 may increase the size of the optical module, the complexity of the manufacturing process, the manufacturing cost, and the product cost.
Referring to
The first lens 204 is disposed on the top of a first chamber 203 and has an upper surface 204a and a lower surface 204b. The lower surface 204b of the first lens 204 is a convex surface and faces the light emitting component 207. The upper surface 204a of the first lens 204 is a planar or substantially planar surface, such that the optical sensor module 200 can be attached to another substrate or printed circuit board by a pick-and-place process. Thus, a vacuum nozzle used to pick and place the optical sensor module can directly attach to the planer surface; there is no need to add an additional lid to protect the first lens 204 and provide a planar surface for the pick-and-place process. Therefore, the cost and the thickness of the optical sensor module 200 can be reduced.
The light emitting component 207 is disposed in the first chamber 203 and may emit infrared rays or other wavelengths of light or radiation. In some embodiments, the light emitting component 207 is disposed on the bottom of the first chamber 203. In some embodiments, the position of the light emitting component 207 is adjustable to increase the emitted light passing through the first lens 204. The light emitting component 207 can be, but is not limited to, a light emitting diode or a vertical cavity surface emitting laser (VCSEL). In some embodiments, a VCSEL can reduce the light emission angle (for example, to be within about 20 degrees) and minimize light scattering, thereby reducing cross-talk.
The second lens 206 is disposed on the top of a second chamber 205, and has an upper surface 206a and a lower surface 206b. The second chamber 205 is isolated from the first chamber 203, for example, by a separation component 211 located therebetween. As shown in
The light sensing component 209 is disposed in the second chamber 205 to sense or detect the light reflected by an external object. In some embodiments, the light sensing component 209 is disposed on the bottom of the second chamber 205. In some embodiments, the position of the light sensing component 209 is adjustable to increase the receipt of reflected light passing through the second lens 206. In some embodiments, a center of the light emitting component 207 is offset from an axis of the first lens 204. In some embodiments, a center of the light sensing component 209 is offset from an axis of the second lens 206. The location of the light emitting component 207 and the light sensing component 209 can be adjusted to be close to the separation component 211; the resulting optical sensor module 200 may have better performance than an optical sensor module in which a center of the light emitting component 207 aligns with an axis of the first lens 204 and a center of the light sensing component 209 aligns with an axis of the second lens 206.
Referring to
The upper surface 206a of the second lens 206 is a planar or substantially planar surface. In some embodiments, the upper surface 204a of the first lens 204 and the upper surface 206a of the second lens 206 are substantially coplanar with an upper surface of the capping substrate 202; therefore, no lid is added to protect the lenses, as compared to an embodiment in which a lid is added to protect a portion of one or both of the lenses 204, 206 that protrude beyond the capping substrate 202. Thus, in this embodiment, the size of optical sensor module 200 can be reduced.
In some embodiments, the capping substrate 202 is a metal substrate, such as copper or an alloy thereof. In some embodiments, the capping substrate 202 is a plastic substrate, such as liquid crystal polymer or epoxy resin, or a composite substrate.
In some embodiments, a first light absorbing layer (not shown) is disposed on a lower surface of the capping substrate 202. In some embodiments, the lower surface of the capping substrate 202 (i.e., the lower surface of the capping substrate 202 excluding the first penetrating hole 214 and the second penetrating hole 216) is covered by the first light absorbing layer. In some embodiments, in addition to, or alternatively to, the first light absorbing layer on the lower surface of the capping substrate 202, a second light absorbing layer (not shown) is disposed on an upper surface of the capping substrate 202 (i.e., the upper surface of the capping substrate 202 excluding the first penetrating hole 214 and the second penetrating hole 216). The light absorbing layer or layers absorb at least some emissions (such as infrared or other types of lights or radiations) from the light emitting component 207. Thus, a portion of the capping substrate 202 (a block portion) can block emissions which could result in cross-talk. The area of the block portion is adjustable. The light absorbing layer(s) may be formed, for example, by use of a black oxide treatment, a carbon black coating, a stain, or other suitable light absorbing material. Additionally or alternatively, the capping substrate 202 may include a light absorbing material, such as carbon black or a light absorbing pigment. The use of a light absorbing layer or layers, and/or the use of a light-absorbing material in the capping substrate 202, allows for absorption of emissions from light emitting component 207 not passing through the first lens 204, and the absorption of reflections not passing through the second lens 206; thereby cross-talk can be reduced.
The first chamber 203 and the second chamber 205 are surrounded by a periphery barrier 210 and isolated from each other by the separation component 211, such that the periphery barrier 210 and the separation component 211 define the first chamber 203 and the second chamber 205. In some embodiments, one or more sidewalls of the periphery barrier 210 and the separation component 211 have a light absorbing layer formed thereon, or may be formed of a light absorbing material. The periphery barrier 210 and the separation component 211 connect to the lower surface of the capping substrate 202. The base substrate 201 forms the bottom (in the orientation of
Table 1 illustrates the reduction of cross-talk achieved by an optical sensor module according to this disclosure. Three optical sensor modules A, B and C were tested, and the results are provided in Table 1. Module A was an optical sensor design in accordance with the illustration in
Comparing Module A and Module B, Module A achieves significantly better cross-talk performance than Module B (i.e., 0.40% cross-talk for Module A versus 68.93% cross-talk for Module B) for about the same size package. Comparing Module A and Module C, Module A is a smaller package size than Module C, and Module A further achieves better cross-talk performance than Module C (i.e., 0.40% cross-talk in Module A versus 0.47% cross-talk in Module C).
In an alternative embodiment, the transmissive panel 220 can be attached on the upper surface of the capping substrate 202. In this embodiment, the transmissive panel 220 may cover holes in the optical sensor module 300 (e.g., the first and second penetrating holes 214 and 216 in the absence of lens structures formed in the first and second penetrating holes 214 and 216).
As shown in
The optical sensor module 700 includes a capping substrate 202 disposed on the top of the first chamber 203 and the second chamber 205. The capping substrate 202 may be made of light transmissive material or light blocking material. The upper surface 202a of the capping substrate 202 is planar. The capping substrate 202 in this embodiment includes a block portion 230, which is capable of blocking or absorbing light of about the first wavelength. The block portion 230 is located at the top of the first chamber (e.g., on one or both of the lower surface 202b of the capping substrate 202 and the upper surface 202a of the capping substrate 202). In some embodiments, the block portion 230 may be disposed adjacent to (e.g., directly adjacent to) the separation component 211. With such an arrangement, emissions that could cause cross-talk (e.g., light in the range between C3 and C4 in
In
The block portion 230 may be made of a material that blocks emissions having about a first wavelength but allows emissions having about a second wavelength to pass. Silicon is one example of such a material. In some embodiments, the first wavelength is that of near-infrared or visible light, and the second wavelength is that of mid-wavelength infrared or far infrared light. In other embodiments, the first and the second wavelengths may be close in value. In some embodiments, light having wavelengths between 850 nm and 950 nm is emitted from the first chamber 203, and the second chamber 205 is capped by a block portion 230 that blocks light having wavelengths between 850 nm and 950 nm but allows light of other wavelengths (e.g., micrometer wavelengths) to pass and be detected by the light sensing component 209 or 309 of the second chamber 205.
In the embodiment shown in
The optical sensor module according to some embodiments of the present disclosure (such as illustrated and described for optical sensor modules 200, 300, 400, 500, 600, 700, 800 and 900) is an air-type optical sensor module, which is substantially airtight without applying a molding compound or other encapsulant to encapsulate the light emitting component or the light sensing component. Chambers (e.g., 203, 205) are enclosed by a capping substrate (e.g., 202), a base substrate (e.g., 201), a periphery barrier (e.g., 210) and one or more separation component(s) (e.g., 211) to form a closed space such that influences from the external environment (e.g., humidity) can be reduced. Moreover, as compared to an optical sensor module as illustrated in
In
In
In
In some embodiments, the capping substrate includes a runner (e.g., as described with respect to
In
In
After providing the lid in accordance with
In some embodiments, the optical sensor module according to the present disclosure can be integrated into a portable electronic device with a screen.
As used herein, the terms “substantially,” “substantial,” “approximately,” and “about” are used to describe and account for small variations. When used in conjunction with an event or circumstance, the terms can refer to instances in which the event or circumstance occurs precisely as well as instances in which the event or circumstance occurs to a close approximation. For example, the terms can refer to less than or equal to ±10%, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%.
A surface can be deemed to be planar or substantially planar if a difference between a highest point and a lowest point on the surface is small, such as no greater than 1 μm, no greater than 5 μm, no greater than 10 μm, or no greater than 50 μm. Two surfaces can be deemed to be coplanar or substantially coplanar if a displacement between the two surfaces is small, such as no greater than 1 μm, no greater than 5 μm, no greater than 10 μm, or no greater than 50 μm.
Amounts, ratios, and other numerical values are sometimes presented herein in a range format. It is to be understood that such range format is used for convenience and brevity and should be understood flexibly to include numerical values explicitly specified as limits of a range, but also to include all individual numerical values or sub-ranges encompassed within that range as if each numerical value and sub-range is explicitly specified.
While the present disclosure has been described and illustrated with reference to specific embodiments thereof, these descriptions and illustrations do not limit the present disclosure. It should be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the true spirit and scope of the present disclosure as defined by the appended claims. The illustrations may not be necessarily drawn to scale. There may be distinctions between the artistic renditions in the present disclosure and the actual apparatus due to manufacturing processes and tolerances. There may be other embodiments of the present disclosure which are not specifically illustrated. The specification and drawings are to be regarded as illustrative rather than restrictive. Modifications may be made to adapt a particular situation, material, composition of matter, method, or process to the objective, spirit and scope of the present disclosure. All such modifications are intended to be within the scope of the claims appended hereto. While the methods disclosed herein have been described with reference to particular operations performed in a particular order, it will be understood that these operations may be combined, sub-divided, or re-ordered to form an equivalent method without departing from the teachings of the present disclosure. Accordingly, unless specifically indicated herein, the order and grouping of the operations are not limitations of the present disclosure.
Claims
1. An optical sensor module, comprising:
- a lid defining a first chamber and a second chamber isolated from the first chamber;
- a light emitting component disposed within the first chamber; and
- a light sensing component disposed within the second chamber,
- the lid comprising a first lens disposed at a top of the first chamber, the first lens including a non-convex upper surface and a convex lower surface facing the light emitting component.
2. The optical sensor module of claim 1, wherein the upper surface of the first lens is planar, the lid further comprising a capping substrate and one of a second lens or a transmissive panel disposed at a top of the second chamber.
3. The optical sensor module of claim 2, wherein the capping substrate surrounds the first lens and the second lens or the transmissive panel, and wherein the second lens or the transmissive panel includes a planar upper surface substantially coplanar with the upper surface of the first lens and an upper surface of the capping substrate.
4. The optical sensor module of claim 2, wherein a first line parallel to a reference axis and passing through a center of the first lens is collinear with a second line parallel to the reference axis and passing through a center of the second lens or the transmissive panel.
5. The optical sensor module of claim 2, wherein a first line parallel to a reference axis and passing through a center of the first lens is not collinear with a second line parallel to the reference axis and passing through a center of the second lens or transmissive panel.
6. The optical sensor module of claim 1, the lid further comprising a second lens and a capping substrate, wherein the top of the first chamber and a top of the second chamber are demarcated by the capping substrate, and wherein the capping substrate defines a first penetrating hole in which the first lens is formed or disposed and a second penetrating hole in which the second lens is formed or disposed.
7. The optical sensor module of claim 6, wherein side walls of the first and second penetrating holes define grooves extending to an upper surface of the capping substrate.
8. The optical sensor module of claim 6, wherein side walls of the first and second penetrating holes define protrusions embedded into the first lens and the second lens, respectively.
9. The optical sensor module of claim 6, the capping substrate further defining a runner connecting the side wall of the first penetrating hole or the side wall of the second penetrating hole.
10. The optical sensor module of claim 6, the lid further comprising a light absorbing layer on a lower surface of the capping substrate.
11. The optical sensor module of claim 6, the lid further comprising a light absorbing layer on an upper surface of the capping substrate.
12. The optical sensor module of claim 6, the lid further comprising a periphery barrier and a separation component connected to a lower surface of the capping substrate and defining the first chamber and the second chamber.
13. A method for manufacturing an optical sensor module, comprising:
- providing a base substrate with a light emitting component and a light sensing component disposed thereon;
- providing a lid defining a first chamber and a second chamber isolated from the first chamber, the lid comprising: a first lens disposed at a top of the first chamber, the first lens including a convex lower surface and a non-convex upper surface; and a second lens or a light transmissive panel disposed at a top of the second chamber; and
- disposing the lid on the base substrate such that the lower surface of the first lens faces the light emitting component and a lower surface of the second lens faces the light sensing component.
14. The method of claim 13, wherein the lid further comprises a capping substrate.
15. The method of claim 14, wherein the capping substrate defines a first penetrating hole and a second penetrating hole, wherein side walls of the first and second penetrating holes define respective grooves extending to an upper surface of the capping substrate, and the first and second penetrating holes and the grooves are filled with a resin composition.
16. The method of claim 13, further comprising, prior to providing the lid, forming the lid by:
- providing a molding lens, wherein the molding lens comprises a frame, a first lens connected to the frame by a first runner, and a second lens connected to the frame by a second runner;
- forming a molding compound layer covering the frame and the first and second runners and exposing the first and second lenses; and
- forming a periphery barrier and a separation component on the molding compound layer, wherein the periphery barrier is formed at the periphery of the molding compound layer and, together with the separation component, defines the first chamber and the second chamber.
17. An optical sensor module, comprising:
- a base substrate with a surface including a light emitting area and a light sensing area;
- a periphery barrier and a separation component disposed on the surface of the base substrate, wherein the periphery barrier and the separation component together define a first chamber surrounding the light emitting area and a second chamber surrounding the light sensing area, and the first chamber provides light from the light emitting area having a first wavelength; and
- a capping substrate disposed on the first chamber and the second chamber, wherein an upper surface of the capping substrate is planar, and the capping substrate includes a block portion for blocking light at the first wavelength.
18. The optical sensor module of claim 17, wherein the separation component separates the first and second chambers, and the block portion is located at a top of the first chamber.
19. The optical sensor module of claim 17, wherein the separation component separates the first and second chambers, and the block portion is located at a top of the second chamber.
20. The optical sensor module of claim 17, wherein the block portion allows light at a second wavelength to pass.
Type: Application
Filed: Apr 20, 2015
Publication Date: Oct 20, 2016
Applicant:
Inventor: Hsin-Ying HO (Kaohsiung)
Application Number: 14/691,434