WIRE WINDER

Abstract

Embodiments of the present disclosure disclose a wire winder including a wire winder top shell and a wire winder bottom shell; the wire winder top shell includes a first pillar, a top substrate, and a first wire head placement groove; one end of the first pillar is connected with the top substrate; a groove of the top substrate is connected with a groove of the first pillar to form the first wire head placement groove; the wire winder bottom shell comprises a second pillar, a bottom substrate, and a second wire head placement groove; one end of the second pillar is connected with the bottom substrate; the second pillar is connected with a groove on one side of the bottom substrate to form the second wire head placement groove; the first pillar of the wire winder top shell is engaged with the second pillar of the wire winder bottom shell.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of International Application No. PCT/CN2016/088540, filed on Jul. 5, 2016, which is based upon and claims priority to Chinese Patent Application No. 201510757792.1, filed on Nov. 6, 2015, the entire contents of all of which are incorporated herein by reference.

TECHNICAL FIELD

The disclosure generally relates to the technical field of electronic accessories, and in particular relates to a wire winder.

BACKGROUND

A data wire is a component for a mobile device charger and for connecting with devices such as a computer and the like, and belongs to necessary accessories in a mobile device packaging box. At present, in most cases, the data wire is folded and then bundled by using a ribbon; subsequently, the data wire bundled with the ribbon is placed in the mobile device packaging box; in this way, the data wire is possibly damaged due to folding and bundling.

Hence, a technical problem needing to be solved urgently by a person skilled in the art is to provide a wire winder to receive a data wire, thereby preventing the data wire from being damaged due to folding.

SUMMARY

The technical problem to be solved by embodiments of the present disclosure is to provide a wire winder to prevent a data wire from being damaged due to folding.

According to one aspect of the present disclosure, the present disclosure discloses a wire winder, which include a wire winder top shell and a wire winder bottom shell; the wire winder top shell includes a first pillar, a top substrate, and a first wire head placement groove; one end of the first pillar is connected with the top substrate; a groove of the top substrate is connected with a groove of the first pillar to form the first wire head placement groove; the wire winder bottom shell includes a second pillar, a bottom substrate, and a second wire head placement groove; one end of the second pillar is connected with the bottom substrate; the second pillar is connected with a groove on one side of the bottom substrate to form the second wire head placement groove; the first pillar of the wire winder top shell is engaged with the second pillar of the wire winder bottom shell.

Compared with the prior art, the embodiments of the present disclosure have the following advantages:

• • the wire winder is provided, which includes the wire winder top shell and the wire winder bottom shell, wherein the wire winder top shell includes the first pillar, the top substrate, and the first wire head placement groove; one end of the first pillar is connected with the top substrate, and the groove of the top substrate is connected with the groove of the first pillar to form the first wire head placement groove; the wire winder bottom shell includes the second pillar, the bottom substrate, and the second wire head placement groove; one end of the second pillar is connected with the bottom substrate, and the second pillar is connected with the groove on one side of the bottom substrate to form the second wire head placement groove; the first pillar of the wire winder top shell is engaged with the second pillar of the wire winder bottom shell. As a result, a data wire can be evenly wound in the wire winder; the data wire is gathered effectively and tidy wire winding is guaranteed, and therefore, the data wire is prevented from damage due to folding.

The above descriptions are merely the summary of the technical solution of the present disclosure. In order to know the technical means of the present disclosure more clearly, implementation can be carried out according to the contents of the description. Additionally, in order to make the above and other objectives, features and advantages of the present disclosure more obvious and understandable, specific embodiments of the present disclosure are described below.

BRIEF DESCRIPTION OF THE DRAWINGS

One or more embodiments are illustrated by way of example, and not by limitation, in the figures of the accompanying drawings, wherein elements having the same reference numeral designations represent like elements throughout. The drawings are not to scale, unless otherwise disclosed.

FIG. 1 is a structural block diagram of a wire winder embodiment of the present disclosure.

FIG. 2 is a structure diagram of a wire winder top shell in another wire winder embodiment of the present disclosure.

FIG. 3 is a structure diagram of a wire winder bottom shell in another wire winder embodiment of the present disclosure.

FIG. 4 is a structure diagram of a wire winder cover in another wire winder embodiment of the present disclosure.

DETAILED DESCRIPTION

In order to make the objectives, technical solutions and advantages of the embodiments of the present disclosure more clear, the technical solutions in the embodiments of the present disclosure will be described below clearly and completely in conjunction with the accompanying drawings in the embodiments of the present disclosure. Obviously, the described embodiments are part of embodiments of the present disclosure, not all embodiments. On the basis of the embodiments in the present disclosure, all the other embodiments obtained by people ordinarily skilled in the art without creative labor fall into the scope of protection of the present disclosure.

One of the core ideas of the embodiments of the present disclosure is to provide a wire winder to receive a data wire and to prevent the data wire from being damaged due to folding. The wire winder includes a wire winder top shell and a wire winder bottom shell; the wire winder top shell includes a first pillar, a top substrate, and a first wire head placement groove; one end of the first pillar is connected with the top substrate; a groove of the top substrate is connected with a groove of the first pillar to form the first wire head placement groove; the wire winder bottom shell includes a second pillar, a bottom substrate, and a second wire head placement groove; one end of the second pillar is connected with the bottom substrate; the second pillar is connected with a groove on one side of the bottom substrate to form the second wire head placement groove; the first pillar of the wire winder top shell is engaged with the second pillar of the wire winder bottom shell. As a result, the data wire can be evenly wound in the wire winder; the data wire is gathered effectively and tidy wire winding is guaranteed, and therefore, the data wire is prevented from damage due to folding.

A First Embodiment

By referring to FIG. 1, illustrated is a structure diagram of a wire winder embodiment of the present disclosure.

The wire winder of the present embodiment includes a wire winder top shell 11 and a wire winder bottom shell 12.

At present, most data wires are bundled by using ribbons and then placed in packaging boxes of mobile phones, and thus may be damaged due to folding and bundling. This embodiment of the present disclosure provides the wire winder that is capable of evenly winding one part of a data wire in the wire winder top shell and the other part of the data wire in the wire winder bottom shell, thereby solving the problem.

Wherein, the wire winder top shell 11 includes a first pillar 1101, a top substrate 1102, and a first wire head placement groove 1103; one end of the first pillar 1101 is connected with the top substrate 1102; a groove of the top substrate 1102 is connected with a groove of the first pillar 1101 to form the first wire head placement groove 1103.

The wire winder bottom shell 12 includes a second pillar 1201, a bottom substrate 1202, and a second wire head placement groove 1203; one end of the second pillar 1201 is connected with the bottom substrate 1202; the second pillar is connected with a groove on one side of the bottom substrate 1202 to form the second wire head placement groove 1203.

The first pillar 1101 of the wire winder top shell 11 is engaged with the second pillar 1201 of the wire winder bottom shell 12.

Wherein, the first pillar may be a cylinder or a prism; accordingly, shapes of the top substrate and the bottom substrate are the same as a shape of a bottom surface of the cylinder; for example, if the first pillar is the cylinder, the top and bottom substrates are circular.

When the wire winder is used for receiving a data wire, a data wire head of the data wire, for example, a USB type data wire head inserted into a USB jack, is placed into the second wire head placement groove 1203; next, one part of the data wire is wound in the second cylinder 1201, while the other part of the data wire is wound in the first cylinder 1101, and the other data wire head of the data wire, for example, a data wire head connected to a mobile device, is placed in the first wire head placement groove 1103. The whole data wire can be wound in the first cylinder 1101 and the second cylinder 1201, and the two heads of the data wire are fixed in the first wire head placement groove 1103 and the second wire head placement groove 1203; in this way, the data wire is gathered effectively and tidy wire winding is guaranteed, and therefore, the data wire is prevented from damage due to folding.

A Second Embodiment

By referring to FIG. 2, illustrated is a structure diagram of a wire winder top shell in another wire winder embodiment of the present disclosure; FIG. 3 shows a structure diagram of a wire winder bottom shell in another wire winder embodiment of the present disclosure; FIG. 4 shows a structure diagram of a wire winder cover in another wire winder embodiment of the present disclosure.

The wire winder of the present embodiment includes a wire winder top shell 11 and a wire winder bottom shell 12.

Wherein, the wire winder top shell 11 includes a first pillar 1101, a top substrate 1102, and a first wire head placement groove 1103; one end of the first pillar 1101 is connected with the top substrate 1102; a groove of the top substrate is connected with a groove of the first pillar to form the first wire head placement groove 1103. The wire winder top shell also includes at least one limiting clip 1104 that is connected with an inner wall of the other end of the first pillar 1101.

The wire winder bottom shell 12 includes a second pillar 1201, a bottom substrate 1202, and a second wire head placement groove 1203; one end of the second pillar 1201 is connected with the bottom substrate 1202; the second pillar is connected with a groove on one side of the bottom substrate 1202 to form the second wire head placement groove 1203. The wire winder bottom shell also includes a limiting groove 1204 that is connected with an inner wall of the other end of the second pillar 1201. The limiting clip 1104 of the first pillar 1101 is engaged with the limiting groove 1204 of the second pillar. The limiting groove 1204 includes at least one clamping groove 12041 connected with the limiting clip 1104; the limiting clip 1104 goes into the limiting groove 1204 via each clamping groove 12041, and is capable of moving in the limiting groove 1204.

The wire winder also includes a wire winder cover 13 that is fastened to the wire winder top shell 11 and a wire winder bottom shell 12, and engaged with the bottom substrate 1202 of the wire winder bottom shell 12.

The bottom substrate 1202 is formed by a first-layer substrate 12021 and a second-layer substrate 12022 into a stepped structure; the first-layer substrate includes a fixing clip 120211; the bottom substrate 1202 is engaged with the wire winder cover 13 by means of the fixing clip 120211.

The wire winder top shell 11 also includes a third pillar 1105 that is located in the first pillar 1101 and connected with the bottom of the first wire head placement groove 1103; further, the third pillar 1105 is coaxial with the top substrate 1102. The wire winder bottom shell 12 also includes a fourth pillar 1205 that is located within the second pillar 1201 and coaxial with the bottom substrate 1202; further, the fourth pillar 1205 may be directly connected with the bottom substrate 1202. In addition, the second wire head placement groove 1203 may also penetrate through both ends of the second pillar 1201, and under such a structure, the fourth pillar 1205 may be located at the top of the second wire head placement groove 1203.

When the wire winder top shell 11 is engaged with the wire winder bottom shell 12, the third pillar 1105 is connected with the fourth pillar 1205 of the bottom substrate. Wherein, the third pillar 1105 and the fourth pillar 1205 may be pillars having the same size, and the two are connected directly; the third pillar 1105 and the fourth pillar 1205 may also be in the forms of a pin and an inserting hole, and when the wire winder top shell 11 is engaged with the wire winder bottom shell 12, the third pillar 1105 is inserted into the fourth pillar 1205.

The first pillar 1101 and the second pillar 1201 are cylinders having the same size; the top substrate 1102 and the bottom substrate 1202 are circular. A diameter of the top substrate 1102 is greater than a diameter of a bottom surface of the first pillar 1101, and a diameter of the top substrate 1102 is smaller than a diameter of the second-layer substrate 12022 of the bottom substrate 1202.

A bottom surface of the wire winder cover 13 is circular; a diameter of the bottom surface of the wire winder cover 13 is greater than the diameter of the top substrate 1102, and equal to the diameter of the second-layer substrate 12022 of the bottom substrate 1202.

A shape of the first wire head placement groove 1103 is the same as a shape of a data wire head at one end of a data wire; for example, if the first wire head placement groove 1103 is adopted to hold the data wire head, connected with a mobile device, of the data wire, the first wire head placement groove 1103 and the data wire head connected with the mobile device have the same shape; if the first wire head placement groove 1103 is used for holding a USB type data wire head of the data wire, the first wire head placement groove 1103 and the USB type data wire head have the same shape.

A size of the second wire head placement groove 1203 is greater than a size of the USB type data wire head of the data wire, such that the USB type data wire can be placed in the second wire head placement groove 1203.

When the wire winder is adopted to receive a data wire, one data wire head of the data wire, for example, the USB type data wire head inserted into a USB jack, may be placed in the second wire head placement groove 1203; next, one part of the data wire is wound in the second cylinder 1201, while the other part of the data wire is wound in the first cylinder 1101, and the other data wire head of the data wire, for example, a data wire head connected to a mobile device, is placed in the first wire head placement groove 1103. The wire winder top shell 11 is rotated, such that the limiting clip 1104 of the wire winder top shell 11 goes into the limiting groove 1204 via the clamping groove 12041, and therefore, the wire winder top shell 11 is locked with the wire winder bottom shell 12; subsequently, the limiting clip 1104 is capable of moving in the limiting groove 1204, resulting in gradual change of positions of the first wire head placement groove 1103 of the wire winder top shell 11 and the second wire head placement groove 1203 of the wire winder bottom shell 12; that is to say, relative positions of the first wire head placement groove 1103 and the second wire head placement groove 1203 may be changed by adjusting the position of the limiting clip 1104 in the limiting groove 1204. In the process when the relative positions of the two are changed, the data wire may be wound around the first pillar 1101 and the second pillar 1201 until it is wound completely; at this moment, the two ends of the data wire are fixed in the first wire head placement groove 1103 and the second wire head placement groove 1203; as a result, the data wire can be gathered effectively and tidy wire winding is guaranteed, and therefore, the data wire is prevented from damage due to folding.

Subsequently, the wire winder cover 13 is fastened to the wire winder top shell 11 and the wire winder bottom shell 12, and connected with the bottom surface 1202 of the wire winder bottom shell 12, such that the two ends of the data wire both can be placed in the wire winder cover and protected against abrasion, and therefore, the product quality is guaranteed. The bottom substrate 1202 is engaged with the wire winder cover 13 by means of the fixing clip 120211 to enable more connection of the wire winder cover 13 and the bottom substrate 1202.

Each embodiment in the description is described in a progressive manner. Descriptions emphasize on the differences of each embodiment from other embodiments, and same or similar parts of various embodiments just refer to each other.

Although the preferred embodiments among embodiments of the present disclosure are already described, additional alterations and modifications can be made to these embodiments by a person skilled in the art upon knowing the basic creative concept. Hence, the attached claims are meant to be explained as including the preferred embodiments and all alterations and modifications falling into the scope of the embodiments of the present disclosure.

Finally, it also needs to be noted that in this text, relation terms such as first, second, and the like are merely used for distinguishing an entity or an operation from another entity or another operation, rather than certainly requiring or implying any actual relation or order between the entities or operations. Additionally, the terms “including”, and “including” or any other variants thereof are meant to cover non-exclusive including, such that a process, a method, an article or a terminal device including a series of elements includes not only those elements, but also other elements not listed explicitly, or further includes intrinsic elements of the process, method, article or terminal device. Without more limitations, elements defined by a sentence “including a . . . ” do not exclude that there also are another same elements in the process, method, article or terminal device including the elements.

The wire winder provided by the present disclosure is introduced above in detail. In this text, the principle and embodiments of the present disclosure are elaborated by using specific examples; the above descriptions of the embodiments are merely intended to help understanding the method of the present disclosure and the core concept thereof; meanwhile, for a person skilled in the art, alterations will be made to the specific embodiments and the application range according to the concept of the present disclosure; in conclusion, the contents of the description should not be understood as limitations to the present disclosure.

Claims

1. A wire winder, comprising a wire winder top shell and a wire winder bottom shell,

Wherein the wire winder top shell comprises a first pillar, a top substrate, and a first wire head placement groove; one end of the first pillar is connected with the top substrate; a groove of the top substrate is connected with a groove of the first pillar to form the first wire head placement groove;

the wire winder bottom shell comprises a second pillar, a bottom substrate, and a second wire head placement groove; one end of the second pillar is connected with the bottom substrate; the second pillar is connected with a groove on one side of the bottom substrate to form the second wire head placement groove;

the first pillar of the wire winder top shell is engaged with the second pillar of the wire winder bottom shell.

2. The wire winder according to claim 1, wherein the wire winder top shell also comprises at least one limiting clip that is connected with an inner wall of the other end of the first pillar; the wire winder bottom shell also comprises a limiting groove that is connected with an inner wall of the other end of the second pillar;

the limiting clip of the first pillar is engaged with the limiting groove of the second pillar.

3. The wire winder according to claim 2, wherein the limiting groove comprises at least one clamping groove connected with the limiting clip; the limiting clip goes into the limiting groove via each clamping groove, and is capable of moving in the limiting groove.

4. The wire winder according to claim 1, further comprising a wire winder cover that is fastened to the wire winder top shell and a wire winder bottom shell, and engaged with the bottom substrate of the wire winder bottom shell.

5. The wire winder according to claim 4, wherein the bottom substrate is formed by a first-layer substrate and a second-layer substrate into a stepped structure; the first-layer substrate comprises a fixing clip;

the bottom substrate is engaged with the wire winder cover by means of the fixing clip.

6. The wire winder according to claim 5, wherein the first pillar and the second pillar are cylinders having the same size; the top substrate and the lower substrate are circular.

7. The wire winder according to claim 6, wherein a diameter of the top substrate is greater than a diameter of a bottom surface of the first pillar, and smaller than a diameter of the second-layer substrate of the bottom substrate.

8. The wire winder according to claim 7, wherein a bottom surface of the wire winder cover is circular; a diameter of the bottom surface of the wire winder cover is greater than the diameter of the top substrate, and equal to the diameter of the second-layer substrate of the bottom substrate.

9. The wire winder according to claim 1, wherein a shape of the first wire head placement groove is the same as a shape of a data wire head at one end of a data wire.

10. The wire winder according to claim 1, wherein a size of the second wire head placement groove is greater than a size of a USB type data wire head of a data wire.