HEAT EXCHANGER WITH VARIABLE DENSITY FEATURE ARRAYS
According to various aspects, exemplary embodiments are provided of heat exchangers and applications. In an exemplary embodiment, a heat exchanger can include at least a first feature array and a second feature array, a channel in an interior of the heat exchanger, through which a fluid can flov, an inlet for the fluid to enter the channel, an outlet for the fluid to exit the channel. The channel may include at least one surface and said first feature array and said second feature array are positioned on the at least one surface of the channel, the fluid configured to flow from said inlet, through said channel to said outlet, and the first and second feature arrays have different densities.
This application claims priority from U.S. Provisional Patent Application No. 62/186,796, which was filed on Jun. 30, 2015, which application is hereby incorporated by reference.
BACKGROUNDIn various scientific or engineering applications, there is a need to maintain distinct heat sources at an approximate temperature. For example, in power electronics, various components can generate heat including inductors, rectifiers, and transistors. Each component that generates heat can be considered a heat source that if not regulated, can lead to malfunction. Other applications include a phased array, which has a plurality of elements that generate heat. In these applications, there are distinct heat sources that need to be regulated at an approximate temperature.
Typical systems used to cool such heat sources involve a heat exchanger. For example, a heat exchanger can be a cold plate or heat sink affixed to the heat sources, with fluid such as air or water flowing through the cold plate or heat sink. The fluid can flow in series past each of the heat sources or can flow in parallel over them. These systems, however, present disadvantages. For example, in a system where fluid flows in series over each heat source, the fluid will enter the heat exchanger at a particular temperature and will move past the first heat source, followed by the next heat source and so on. The temperature of the fluid increases as it passes each successive heat source. So the fluid as it passes the last heat source before exiting the cold plate or heat sink will be hotter than when it entered. As a result, the last heat source is not cooled as effectively as the first. Where the heat sources are electronic devices such as transistors, the disparity in the cooling of the heat sources is not optimal and can result in the last transistor or heat source degrading before the other transistors earlier in the series. In general, therefore, thermal management systems are designed around this specific temperature difference to ensure that the temperature of the last component does not exceed the prescribed limit. As a result, heat sources upstream of the last component are cooled to a temperature below the required standards.
In heat exchangers where the fluid flows in parallel over the heat sources, the fluid can enter at one or more inlets to the cold plate and divide such that fluid flows past each heat source at the same time. These systems can also suffer from unreliability due to either more points of leaking and/or increased components.
SUMMARYAccording to various aspects, exemplary embodiments are provided of heat exchangers and applications. In an exemplary embodiment, a heat exchanger can include at least a first feature array and a second feature array, a channel in an interior of the heat exchanger, through which a fluid can flow, an inlet for the fluid to enter the channel, an outlet for the fluid to exit the channel. The channel may include at least one surface and said first feature array and said second feature array are positioned on the at least one surface of the channel, the fluid configured to flow from said inlet, through said channel to said outlet, and the first and second feature arrays have different densities.
In another exemplary embodiment, a multi-phase inverter can have a heat exchanger, where the heat exchanger can include at least a first feature array, a second feature array, and a third feature array, the first, second, and third feature arrays positioned along a surface of a channel defined in an interior of said heat exchanger, said first, second, and third feature arrays having different densities, an exterior surface, an inlet for a fluid to enter the channel, an outlet for a fluid to exit the channel. The fluid configured to flow from said inlet, through said channel to said outlet, and at least a first phase, a second phase, and a third phase, each of said first phase, second phase, and third phase having at least one switch, said first, second, and third phases positioned along said exterior surface, the first phase is positioned adjacent to said first feature array, the second phase is positioned adjacent to the second feature array, and the third phase is positioned adjacent to said third feature array.
In another exemplary embodiment, a heat exchanger can include at least a first feature array and a second feature array, a channel in an interior of the heat exchanger, through which a fluid can flow, an inlet for the fluid to enter the channel, an outlet for the fluid to exit the channel. The channel includes at least one surface and said first feature array and said second feature array are positioned on the at least one surface of the channel. The fluid configured to flow from said inlet, through said channel to said outlet, and the features of said first array and the features of said second feature arrays have different cross-sectional shapes.
Further aspects and features of the present disclosure will become apparent from the detailed description provided hereinafter. In addition, any one or more aspects of the present disclosure may be implemented individually or in any combination with any one or more of the other aspects of the present disclosure. It should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the present disclosure, are intended for purposes of illustration only and are not intended to limit the scope of the present disclosure.
Positioned on the exterior side 110 of the first panel 104 is a first heat source 120 and a second heat source 122. The first heat source 120 is located adjacent to the first array of features 116 and the second heat source 122 is located adjacent to the second array of features 118. The interior sides 108 and 112 form a channel 124 in which a fluid can enter, flow through, and exit. The channel 124 is positioned on an interior of the heat exchanger 100. The fluid enters the channel 124 through an inlet 126 and exits the channel through an outlet 128. In the embodiment of
Stated previously, the density of the second array of features 118 is higher than the first array of features 116. The higher density of the second array of features 118 leads to a heat transfer rate that is higher than the first array of features 116. Tuning the feature densities of the first and second arrays of features 116 and 118 allows the heat sources 120 and 122 to be maintained at particular temperatures.
For example, as the fluid passes through the heat exchanger 100 via the channel 124, the temperature of the fluid itself changes. The temperature of the fluid as it enters the channel 124 is lower than the temperature when the fluid exits the channel 124. Put differently, the fluid temperature increases as it flows through the channel. The fluid temperature increase affects the temperature of the heat sources. If, for example, there were no first or second arrays of features, then the second heat source 122 would be hotter than the first heat source 120. In another example, if there were first and second arrays of features, but they had a constant density, then again the second heat source 122 would be hotter than the first heat source 120. The higher temperature of the second heat source 122 can be disadvantageous, especially where the two heat sources produce the same magnitude of heat. For example, if the first and second heat sources 120 and 122 were transistors, then the second heat source would be hotter than the first heat source. As a result, maintaining the ideal operating temperature of the second heat source (via the fluid flowing in the channel 124) would cause the first heat source to be unnecessarily cooled below the ideal operating temperature. In the embodiment of
Positioned on the exterior side 410 of the first panel 404 is a first heat source 422, a second heat source 424, and a third heat source 426. The first heat source 422 is located adjacent to the first array of features 416, the second heat source 424 is located adjacent to the second array of features 418, and the third heat source 426 is located adjacent to the second array of features 420. The interior sides 408 and 412 form a channel 428 in which a fluid can enter, flow through, and exit. Put another way, the channel 428 is on an interior of the heat exchanger 400. The fluid enters the channel 428 through an inlet 430 and exits the channel through an outlet 432. In the embodiment of
The heat exchanger 100 and 400 illustrate two and three heat sources respectively. Heat exchangers with more than two or three heat sources can be utilized without departing from the scope of the invention. For example, two or more heat sources can be placed in series on a heat exchanger. In another example, heat sources can be disposed on both exterior sides of the panels of the heat exchanger. An example of this mirrored heat exchanger is shown in
The arrays of features described in this disclosure including as shown in the corresponding figures constitute a plurality of projections (i.e., features) that can be arranged in any suitable configuration without departing from the scope of this disclosure. For example, the arrays could include features that are arranged in a rectangular fashion, but can be in other configurations such as trapezoidal, rectangular, circular, or triangular. The configurations could also be staggered or aligned. Additionally, the features can have any suitable cross-sectional shape without departing from the scope of this disclosure. Such cross-sectional shapes can include, without limitation, circles, rectangles, ovals, rhomboids, or the shape of a hydrofoil or an airfoil. Furthermore, the features may also be located on an edge of the channel of the heat exchanger. The feature sizes are typically in the range of 0.1 mm to 5 mm, but can greater or smaller depending on a particular application.
The heat exchangers described herein can also be used for any suitable application where there are multiple heat sources that need to be regulated. For example, the heat exchangers described in this disclosure can be used in power electronics, to regulate the temperature of components such as transistors, inductors, and rectifiers. The components needing thermal regulation can be placed on an exemplary heat exchanger with an array of features adjacent to each component, with the feature density tuned to regulate the heat source. For example, the heat exchangers described herein can be used to create a multi-phase inverter, with each phase of the inverter having utilizing typically a pair of switches. Each switch can comprise one or more transistors and/or other circuit elements. During operation, each switch generates heat (i.e., is a heat source). Manufacturers sell pairs of switches as a type of module. So a three-phase inverter can be constructed with three such modules, with each module generating heat. A setup like this could employ, for example, the heat exchanger shown in
In the example of the multi-phase inverter, the heat produced by each phase would be uniform. In this case, and as described in
In certain applications the heat exchanger can operate as a cold plate. In other applications, rather than a heat source, there can be sources that cool over time, such that the heat exchanger should function as a hot plate. The variable density feature arrays described herein may be used where the heat exchanger operates as a hot plate.
The feature density under a heat or cool source can be calculated in a two-step process. In the first step the temperature of the plate was approximated by solving the 1D heat equation with a Finite Difference Approximation (FDA) in the direction of the flow path. The heat transfer coefficients in the regions where the heat or cool sources are located on the heat exchanger are selectively tuned, by adjusting the shape and/or size of the feature, and/or the density of the feature array, to yield the desired temperatures profile in the heat exchanger. The calculation process is iterated and the heat transfer coefficients are adapted until the regions where each of the heat or cool sources are located are at the desired operating temperature. In the second step the desired heat transfer coefficients are mapped back to geometric parameters such as longitudinal and transversal pitches of the feature array. Generally accepted correlations of flow across aligned and staggered projections such as ones proposed by Zukauskas can be used to determine the feature density.
It should be understood that the heat exchangers described herein can be formed from a unitary structure. For example, the first and second panels described herein may be discrete or integral structures. Similarly, the feature arrays described herein may be integral or discrete with the heat exchanger. It should be further understood that the heat exchanger could be made from any suitable thermal conductor including, without limitation, aluminum, copper, thermally conductive plastic, gold, platinum, or silver. In addition, the inlets and outlets described herein, can comprise one or more openings without departing from the scope of this disclosure.
While embodiments in this disclosure illustrate tuning the density of features to maintain a temperature of a heated or cooled surface, it should be understood, as described above, that adjusting the shape and/or size of features can also serve to maintain a temperature of a heated surface (e.g., a hot plate) or cooled surface (e.g., cold plate). Applications of maintaining a heated or cooled surface include applications in the food industry including hot food and beverage applications, wet laboratory applications including the industrial versions of the same such as oil refineries, and chemical engineering applications.
While embodiments have been illustrated and described herein, it is appreciated that various substitutions and changes in the described embodiments may be made by those skilled in the art without departing from the spirit of this disclosure. The embodiments described herein are for illustration and not intended to limit the scope of this disclosure.
Claims
1. A heat exchanger comprising:
- at least a first feature array and a second feature array,
- a channel in an interior of the heat exchanger, through which a fluid can flow,
- an inlet for the fluid to enter the channel,
- an outlet for the fluid to exit the channel,
- wherein said channel includes at least one surface and said first feature array and said second feature array are positioned on the at least one surface of the channel,
- wherein said fluid configured to flow from said inlet, through said channel to said outlet, and
- wherein said first and second feature arrays have different densities.
2. The heat exchanger of claim 1 wherein the at least one surface of said channel defines an edge and wherein at least one feature of at least one of said first and second feature arrays is positioned on said edge.
3. The heat exchanger of claim 1 wherein said first feature array is less dense than said second feature array.
4. The heat exchanger of claim 3 wherein said second feature array is downstream of said first feature array.
5. The heat exchanger of claim 1 further comprising an exterior surface wherein a first heat source and a second heat source is positioned on said exterior surface, and wherein said first feature array is adjacent to said first heat source and said second feature array is adjacent to said second heat source.
6. The heat exchanger of claim 5 further comprising a third feature array and a fourth feature array, wherein the third feature array and the fourth feature array are positioned on a second surface in the channel.
7. The heat exchanger of claim 6 further comprising at least a second exterior surface, wherein a third and a fourth heat source positioned on the at least a second exterior surface, and wherein said third feature array is adjacent to said third heat source and said fourth feature array is adjacent to said fourth heat source.
8. The heat exchanger of claim 1 wherein at least one of said first feature array and said second feature array is staggered.
9. A multi-phase inverter comprising:
- a heat exchanger, wherein the heat exchanger comprises,
- at least a first feature array, a second feature array, and a third feature array, the first, second, and third feature arrays positioned along a surface of a channel defined in an interior of said heat exchanger, said first, second, and third feature arrays having different densities,
- an exterior surface,
- inlet for a fluid to enter the channel,
- an outlet for a fluid to exit the channel,
- wherein said fluid configured to flow from said inlet, through said channel to said outlet, and
- at least a first phase, a second phase, and a third phase, each of said at least first phase, second phase, and third phase having at least one switch,
- said at least first, second, and third phases positioned along said exterior surface,
- wherein said first phase is positioned adjacent to said first feature array, said second phase is positioned adjacent to said second feature array, and said third phase is positioned adjacent to said third feature array.
10. The multi-phase inverter of claim 9 wherein the features of at least one of said first, second, and third feature arrays have a cross-sectional shape of a hydrofoil.
11. The multi-phase inverter of claim 9 wherein the second feature array is downstream of the first feature array and the third feature array is downstream of the second feature array.
12. The multi-phase inverter of claim 11 wherein the second feature array is denser than the first feature array and the third feature array is denser than the second feature array.
13. The multi-phase inverter of claim 9 wherein said at least one switch of at least one of said first, second and third phases comprises at least one transistor.
14. The multi-phase inverter of claim 9 wherein said at least one surface of said channel defines an edge and wherein at least one feature of at least one of said first, second, and third feature arrays is positioned on said edge.
15. The multi-phase inverter of claim 9 further comprising a fourth feature array, a fifth feature array, and a sixth feature array, wherein the fourth feature array, the fifth feature array, and a sixth feature array are positioned on a second surface in the channel.
16. The multi-phase inverter of claim 15 further comprising a second exterior surface, wherein a fourth phase, a fifth phase, and a sixth phase is positioned on said second exterior surface, each of said fourth phase, fifth phase, and sixth phase having at least one switch.
17. The multi-phase inverter of claim 16 wherein said fourth feature array is adjacent to said fourth phase, said fifth feature array is adjacent to said fifth phase, and said sixth feature array is adjacent to said sixth phase.
18. The multi-phase inverter of claim 9 wherein at least one of said first feature array and said second feature array is staggered.
19. A heat exchanger comprising:
- at least a first feature array and a second feature array,
- a channel in an interior of the heat exchanger, through which a fluid can flow,
- an inlet for the fluid to enter the channel,
- an outlet for the fluid to exit the channel,
- wherein said channel includes at least one surface and said first feature array and said second feature array are positioned on the at least one surface of the channel,
- wherein said fluid configured to flow from said inlet, through said channel to said outlet, and
- wherein the features of said first array and the features of said second feature arrays have different cross-sectional shapes.
20. The heat exchanger of claim 19 wherein said heat exchanger forms part of a multi-phase inverter.
Type: Application
Filed: Jun 29, 2016
Publication Date: Dec 21, 2017
Inventors: James Rhett Mayor (Braselton, GA), Danielle Hesse (Mableton, GA), Benjamin H. Loeffler (Fayetteville, GA)
Application Number: 15/330,960